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Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses - Fundamental Mechanisms and Application to IC Interconnect Technology (Paperback, Softcover reprint of the original 1st ed. 2002)
Loot Price: R4,470
Discovery Miles 44 700
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Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses - Fundamental Mechanisms and Application to IC Interconnect Technology (Paperback, Softcover reprint of the original 1st ed. 2002)
Expected to ship within 10 - 15 working days
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As semiconductor manufacturers implement copper conductors in
advanced interconnect schemes, research and development efforts
shift toward the selection of an insulator that can take maximum
advantage of the lower power and faster signal propagation allowed
by copper interconnects. One of the main challenges to integrating
a low-dielectric constant (low-kappa) insulator as a replacement
for silicon dioxide is the behavior of such materials during the
chemical-mechanical planarization (CMP) process used in Damascene
patterning. Low-kappa dielectrics tend to be softer and less
chemically reactive than silicon dioxide, providing significant
challenges to successful removal and planarization of such
materials. The focus of this book is to merge the complex CMP
models and mechanisms that have evolved in the past decade with
recent experimental results with copper and low-kappa CMP to
develop a comprehensive mechanism for low- and high-removal-rate
processes. The result is a more in-depth look into the fundamental
reaction kinetics that alter, selectively consume, and ultimately
planarize a multi-material structure during Damascene patterning.
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