Welcome to Loot.co.za! Sign in / Register |Wishlists & Gift Vouchers |Help | Advanced search

Checkout
- Your Cart Price

Your cart

Your cart is empty

Books > Professional & Technical > Energy technology & engineering > Electrical engineering

Buy Now

Foldable Flex and Thinned Silicon Multichip Packaging Technology (Paperback, Softcover reprint of the original 1st ed. 2003) Loot Price: R4,484

Discovery Miles 44 840

Repayment Terms: R420 pm x 12*

Add to cart

Foldable Flex and Thinned Silicon Multichip Packaging Technology (Paperback, Softcover reprint of the original 1st ed. 2003):...

Foldable Flex and Thinned Silicon Multichip Packaging Technology (Paperback, Softcover reprint of the original 1st ed. 2003)

John W. Balde

Series: Emerging Technology in Advanced Packaging, 1

(sign in to rate)

Loot Price R4,484 Discovery Miles 44 840 | Repayment Terms: R420 pm x 12*

Expected to ship within 10 - 15 working days

Description
Details
Customer Reviews

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.

General

Imprint:	Springer-Verlag New York
Country of origin:	United States
Series:	Emerging Technology in Advanced Packaging, 1
Release date:	August 2014
First published:	2003
Editors:	John W. Balde
Dimensions:	235 x 155 x 20mm (L x W x T)
Format:	Paperback
Pages:	347
Edition:	Softcover reprint of the original 1st ed. 2003
ISBN-13:	978-1-4613-4977-8
Categories:	Books > Science & Mathematics > Chemistry > Physical chemistry > Quantum & theoretical chemistry Books > Professional & Technical > Mechanical engineering & materials > Production engineering > General Books > Professional & Technical > Energy technology & engineering > Electrical engineering > General Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > General Promotions
LSN:	1-4613-4977-X
Barcode:	9781461349778