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Foldable Flex and Thinned Silicon Multichip Packaging Technology (Paperback, Softcover reprint of the original 1st ed. 2003) Loot Price: R4,032
Discovery Miles 40 320
Repayment Terms: R378 pm x 12*
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Foldable Flex and Thinned Silicon Multichip Packaging Technology (Paperback, Softcover reprint of the original 1st ed. 2003):...

Foldable Flex and Thinned Silicon Multichip Packaging Technology (Paperback, Softcover reprint of the original 1st ed. 2003)

John W. Balde

Series: Emerging Technology in Advanced Packaging, 1

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Loot Price R4,032 Discovery Miles 40 320 | Repayment Terms: R378 pm x 12*

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Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.

General

Imprint: Springer-Verlag New York
Country of origin: United States
Series: Emerging Technology in Advanced Packaging, 1
Release date: August 2014
First published: 2003
Editors: John W. Balde
Dimensions: 235 x 155 x 20mm (L x W x T)
Format: Paperback
Pages: 347
Edition: Softcover reprint of the original 1st ed. 2003
ISBN-13: 978-1-4613-4977-8
Categories: Books > Science & Mathematics > Chemistry > Physical chemistry > Quantum & theoretical chemistry
Books > Professional & Technical > Mechanical engineering & materials > Production engineering > General
Books > Professional & Technical > Energy technology & engineering > Electrical engineering > General
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > General
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LSN: 1-4613-4977-X
Barcode: 9781461349778

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