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Reduced Thermal Processing for ULSI (Paperback, Softcover reprint of the original 1st ed. 1989)
Loot Price: R1,533
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Reduced Thermal Processing for ULSI (Paperback, Softcover reprint of the original 1st ed. 1989)
Series: NATO Science Series B:, 207
Expected to ship within 10 - 15 working days
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As feature dimensions of integrated circuits shrink, the associated
geometrical constraints on junction depth impose severe
restrictions on the thermal budget for processing such devices.
Furthermore, due to the relatively low melting point of the first
aluminum metallization level, such restrictions extend to the
fabrication of multilevel structures that are now essential in
increasing packing density of interconnect lines. The fabrication
of ultra large scale integrated (ULSI) devices under thermal budget
restrictions requires the reassessment of existing and the
development of new microelectronic materials and processes. This
book addresses three broad but interrelated areas. The first area
focuses on the subject of rapid thermal processing (RTP), a
technology that allows minimization of processing time while
relaxing the constraints on high temperature. Initially developed
to limit dopant redistribution, current applications of RTP are
shown here to encompass annealing, oxidation, nitridation,
silicidation, glass reflow, and contact sintering. In a second but
complementary area, advances in equipment design and performance of
rapid thermal processing equipment are presented in conjunction
with associated issues of temperature measurement and control.
Defect mechanisms are assessed together with the resulting
properties of rapidly deposited and processed films. The concept of
RTP integration for a full CMOS device process is also examined
together with its impact on device characteristics.
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