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Ion Implantation in Semiconductors - Science and Technology (Paperback, Softcover reprint of the original 1st ed. 1975)
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Ion Implantation in Semiconductors - Science and Technology (Paperback, Softcover reprint of the original 1st ed. 1975)
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The technique of ion implantation has become a very useful and
stable technique in the field of semiconductor device fabrication.
This use of ion implantation is being adopted by industry. Another
important application is the fundamental study of the physical
properties of materials. The First Conference on Ion Implantation
in Semiconductors was held at Thousand Oaks, California in 1970.
The second conference in this series was held at
Garmish-Partenkirchen, Germany, in 1971. At the third conference,
which convened at Yorktown Heights, New York in 1973, the emphasis
was broadened to include metals and insulators as well as
semiconductors. This scope of the conference was still accepted at
the fourth conference which was held at Osaka, Japan, in 1974. A
huge number of papers had been submitted to this conference. All
papers which were presented at the Fourth International Conference
on Ion Implantation in Semiconductors and Other Materials are
included in this proceedings. The success of this conference was
due to technical presentations and discussions of 224 participants
from 14 countries as well as to financial support from many
companies in Japan. On behalf of the committee, I wish to thank the
authors for their excellent papers and the sponsors for their
financial support. The International Committee responsible for
advising this conference consisted of B.L. Crowder, J.A. Davies, G.
Dearna1ey, F.H. Eisen, Ph. G1otin, T. Itoh, A.U. MacRae, J.W.
Mayer, S. Namba, I. Ruge, and F.L. Vook.
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