Scienti?c Computing in Electrical Engineering (SCEE) is an international c- ference series, which started as a national German meeting held in Darmstadt (1997) and Berlin (1998), both under the auspices of the Deutscher Mathematiker Verein. The ?rst truly international SCEE conference was organized in 2000 in Warnemunde, .. Germany, by the University of Rostock. In 2002, the 4th SCEE c- ference took place in Eindhoven, The Netherlands, jointly organized by the Ei- hoven University of Technologyand Philips Research LaboratoriesEindhoven.The 5th SCEE conference was held in 2004 in Capo D'Orlando, Italy, jointly organized by Universita di Catania and Consorzio Catania Ricerche. The venue of the 6th SCEE conference was Sinaia, Romania, in 2006, organized by the Politehnica U- versity of Bucharest. The 7th International Conference on Scienti?c Computing in Electrical En- neering (SCEE 2008) was held in Espoo, Finland, from September 28 to October 3, 2008. It was organized by the Helsinki University of Technology; Faculty of Electronics, Communications and Automation; Department of Radio Science and Engineering; Circuit Theory Group. (Details on the SCEE 2008 conference are at http://radio.tkk.fi/en/conferences/scee2008/).

This book addresses presents recent developments of novel planar inter digital sensors for food inspection. It covers the fundamentals of sensors, their design, modelling and simulations, fabrications, characterizations, experimental investigations and analyses. This book will be useful for the engineers and researchers especially higher undergraduate, postgraduate students as well as practitioners working on the development of Electromagnetic Sensors.

FPGAs (Field-Programmable Gate Arrays) can be found in applications such as smart phones, mp3 players, medical imaging devices, and for aerospace and defense technology. FPGAs consist of logic blocks and programmable interconnects. This allows an engineer to start with a blank slate and program the FPGA for a specific task, for instance, digital signal processing, or a specific device, for example, a software-defined radio. Due to the short time to market and ability to reprogram to fix bugs without having to respin FPGAs are in increasingly high demand.
This book is for the engineer that has not yet had any experience with this electrifying and growing field. The complex issue of FPGA design is broken down into four distinct phases - Design / Synthesis / Simulation / Place & Route. Numerous step-by-step examples along with source code accompany the discussion. A brief primer of one of the popular FPGA and hardware languages, VHDL, is incorporated for a simple yet comprehensive learning tool. While a general technology background is assumed, no direct hardware development understanding is needed. Also, included are details on tool-set up, verifaction techniques, and test benches. Reference material consists of a quick reference guide, reserved words, and common VHDL/FPGA terms.
Learn how to design and develop FPGAs -- no prior experience necessary Breaks down the complex design and development of FPGAs into easy-to-learn building blocksContains examples, helpful tips, and step-by-step tutorials for synthesis, implementation, simulation, and programming phases

Silicon Devices and Process Integration covers state-of-the-art silicon devices, their characteristics, and their interactions with process parameters. It serves as a comprehensive guide which addresses both the theoretical and practical aspects of modern silicon devices and the relationship between their electrical properties and processing conditions. The book is compiled from the author's industrial and academic lecture notes and reflects years of experience in the development of silicon devices. Features include: A review of silicon properties which provides a foundation for understanding the device properties discussion, including mobility-enhancement by straining silicon; State-of-the-art technologies on high-K gate dielectrics, low-K dielectrics, Cu interconnects, and SiGe BiCMOS; CMOS-only applications, such as subthreshold current and parasitic latch-up; Advanced Enabling processes and process integration. This book is written for engineers and scientists in semiconductor research, development and manufacturing. The problems at the end of each chapter and the numerous charts, figures and tables also make it appropriate for use as a text in graduate and advanced undergraduate courses in electrical engineering and materials science.

This book presents selected articles from INDIA SMART GRID WEEK (ISGW 2017), which is the third edition of the Conference cum Exhibition on Smart Grids and Smart Cities, organized by India Smart Grid Forum from 07-10 March 2017 at Manekshaw Centre, Dhaula Kuan, New Delhi, India. ISGF is a public private partnership initiative of the Ministry of Power, Govt. of India with the mandate of accelerating smart grid deployments across the country. This book gives current scenario updates of Indian power sector business. It also highlights various disruptive technologies for power sector business.

This book provides a comprehensive guide to the design of sustainable and green computing systems (GSC). Coverage includes important breakthroughs in various aspects of GSC, including multi-core architectures, interconnection technology, data centers, high performance computing (HPC), and sensor networks. The authors address the challenges of power efficiency and sustainability in various contexts, including system design, computer architecture, programming languages, compilers and networking.

The Heinz Nixdorf Museum Forum (HNF) is the world's largest c- puter museum and is dedicated to portraying the past, present and future of information technology. In the "Year of Informatics 2006" the HNF was particularly keen to examine the history of this still quite young discipline. The short-lived nature of information technologies means that individuals, inventions, devices, institutes and companies"age" more rapidly than in many other specialties. And in the nature of things the group of computer pioneers from the early days is growing smaller all the time. To supplement a planned new exhibit on "Software and Inform- ics" at the HNF, the idea arose of recording the history of informatics in an accompanying publication. Mysearchforsuitablesourcesandauthorsveryquickly cameupwith the right answer, the very rst name in Germany: Friedrich L. Bauer, Professor Emeritus of Mathematics at the TU in Munich, one of the - thers of informatics in Germany and for decades the indefatigable author of the"Historical Notes" column of the journal Informatik Spektrum. Friedrich L. Bauer was already the author of two works on the history of informatics, published in different decades and in different books. Both of them are notable for their knowledgeable, extremely comp- hensive and yet compact style. My obvious course was to motivate this author to amalgamate, supplement and illustrate his previous work.

In recent years, micro- and nanotechnologies became key technologies, having a significant effect on the development of new products and production technologies, as well as on novel medical diagnosis and treatment methods. Moreover, due to their enormous potential for new applications, micro- and nanotechnologies, in future, will increasingly affect our every days life, with an impact, comparable to that of the industrial revolution in the 19th century, or the developments in microelectronics in the 20th century.

Although, micro- and nanotechnologies, in general, are regarded as two independent disciplines, there is obviously an intense interaction between these two fascinating technologies. The term "MicroNano Integration," in this context, addresses the enormous potential of synergy effects, provided by the combination and mutual integration of micro- and nanotechnological elements.

In order to discuss the integration aspects of micro- and nanotechnologies, the "International Forum on MicroNano Integration," a conference, held in Potsdam, Germany on December 3-4, 2003 brought together researchers from both communities - from industries as well as from scientific institutions. The contributions to this book reflect the discussions during the conference.

Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity environments including indoor controlled conditions and outdoor climate changes. Moisture, ionic contamination, heat, radiation and mechanical stresses are all highly detrimental to electronic devices and can lead to device failures. Therefore, it is essential that the electronic devices be packaged for protection from their intended environments, as well as to provide handling, assembly, electrical and thermal considerations.
Currently, more than 99% of microelectronic devices are plastic encapsulated. Improvements in encapsulant materials, and cost incentives have stretched the application boundaries for plastic electronic packages. Many electronic applications that traditionally used hermetic packages such as military are now using commercial-off-the-shelf (COTS) plastic packages. Plastic encapsulation has the advantages of low cost, smaller form factors, and improved manufacturability.
With recent trends in environmental awareness, new environmentally friendly or ' green' encapsulant materials (i.e. without brominated additives) have emerged. Plastic packages are also being considered for use in extreme high and low temperature electronics. 3-D packaging and wafer-level-packaging (WLP) require unique encapsulation techniques. Encapsulant materials are also being developed for micro-electro-mechanical systems (MEMS), bio-MEMS, bio-electronics, and organic light-emitting diodes (O-LEDs).
This book offers a comprehensive discussion of encapsulants in electronic applications. The main emphasis is on the encapsulation of microelectronic devices; however, the encapsulation of connectors and transformers is also addressed. This book discusses 2-D and 3-D packaging and encapsulation, encapsulation materials including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification process for encapsulated packages. This book also provides information on the trends and challenges of encapsulation and microelectronic packages including application of nanotechnology.
Guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics
Coverage of environmentally friendly 'green encapsulants'
Practical coverage of faults and defects: how to analyze them and how to avoid them"

Design and Modeling of Millimeter-wave CMOS Circuits for Wireless Transceivers describes in detail some of the interesting developments in CMOS millimetre-wave circuit design. This includes the re-emergence of the slow-wave technique used on passive devices, the license-free 60GHz band circuit blocks and a 76GHz voltage-controlled oscillator suitable for vehicular radar applications.

All circuit solutions described are suitable for digital CMOS technology. Digital CMOS technology developments driven by Moorea (TM)s law make it an inevitable solution for low cost and high volume products in the marketplace. Explosion of the consumer wireless applications further makes this subject a hot topic of the day.

The book begins with a brief history of millimetre-wave research and how the silicon transistor is born. Originally meant for different purposes, the two technologies converged and found its way into advanced chip designs. The second part of the book describes the most important passive devices used in millimetre-wave CMOS circuits. Part three uses these passive devices and builds circuit blocks for the wireless transceiver. The book completes with a comprehensive list of references for further readings.

Design and Modeling of Millimeter-wave CMOS Circuits for Wireless Transceivers is useful to show the analogue IC designer the issues involved in making the leap to millimetre-wave circuit designs. The graduate student and researcher can also use it as a starting point to understand the subject or proceed to innovative from the works described herein.

All the design and development inspiration and direction an electronics engineer needs in one blockbuster book! John Donovan, Editor-in Chief, Portable Design has selected the very best electronic design material from the Newnes portfolio and has compiled it into this volume. The result is a book covering the gamut of electronic design from design fundamentals to low-power approaches with a strong pragmatic emphasis. In addition to specific design techniques and practices, this book also discusses various approaches to solving electronic design problems and how to successfully apply theory to actual design tasks. The material has been selected for its timelessness as well as for its relevance to contemporary electronic design issues.
Contents:
Chapter 1 System Resource Partitioning and Code Optimization
Chapter 2 Low Power Design Techniques, Design Methodology, and Tools
Chapter 3 System-Level Approach to Energy Conservation
Chapter 4 Radio Communication Basics
Chapter 5 Applications and Technologies
Chapter 6 RF Design Tools
Chapter 7 On Memory Systems and Their Design
Chapter 8 Storage in Mobile Consumer Electronics Devices
Chapter 9 Analog Low-Pass Filters
Chapter 10 Class A Amplifiers
Chapter 11 MPEG-4 and H.264
Chapter 12 Liquid Crystal Displays
*Hand-picked content selected by John Donovan, Editor-in Chief, Portable Design
*Proven best design practices for low-power, storage, and streamlined development
*Case histories and design examples get you off and running on your current project

All the design and development inspiration and direction a harware engineer needs in one blockbuster book! Clive "Max" Maxfield renowned author, columnist, and editor of PL DesignLine has selected the very best FPGA design material from the Newnes portfolio and has compiled it into this volume. The result is a book covering the gamut of FPGA design from design fundamentals to optimized layout techniques with a strong pragmatic emphasis. In addition to specific design techniques and practices, this book also discusses various approaches to solving FPGA design problems and how to successfully apply theory to actual design tasks. The material has been selected for its timelessness as well as for its relevance to contemporary FPGA design issues.
Contents
Chapter 1 Alternative FPGA Architectures
Chapter 2 Design Techniques, Rules, and Guidelines
Chapter 3 A VHDL Primer: The Essentials
Chapter 4 Modeling Memories
Chapter 5 Introduction to Synchronous State Machine Design and Analysis
Chapter 6 Embedded Processors
Chapter 7 Digital Signal Processing
Chapter 8 Basics of Embedded Audio Processing
Chapter 9 Basics of Embedded Video and Image Processing
Chapter 10 Programming Streaming FPGA Applications Using Block Diagrams In Simulink
Chapter 11 Ladder and functional block programming
Chapter 12 Timers
*Hand-picked content selected by Clive "Max" Maxfield, character, luminary, columnist, and author
*Proven best design practices for FPGA development, verification, and low-power
*Case histories and design examples get you off and running on your current project

This book provides a new, more accurate and efficient way for design engineers to understand electromagnetic theory and practice as it relates to the shielding of electrical and electronic equipment. The author starts by defining an electromagnetic wave, and goes on to explain the shielding of electromagnetic waves using the basic laws of physics. This is a new approach for the understanding of EMI shielding of barriers, apertures and seams. It provides a reliable, systematic approach that is easily understood by design engineers for the purpose of packaging the electrical and electronic systems of the future. This book covers both theory and practical application, emphasizing the use of transfer impedance to explain fully the penetration of an electromagnetic wave through an EMI gasketed seam. Accurate methods of testing shielding components such as EMI gaskets, shielded cables and connectors, shielded air vent materials, conductive glass and conductive paint are also covered. Describes in detail why the currently accepted theory of shielding needs improvement. Discusses the penetration of an electromagnetic wave through shielding barrier materials and electromagnetic interference (EMI) gasketed seams. Emphasizes the use of transfer impedance to explain the penetration of an electromagnetic wave through an EMI gasketed seam. The definition of an electromagnetic wave and how it is generated is included. Chapter in the book are included that reinforce the presented theory.

This book addresses selected topics in electrical engineering, electronics and mechatronics that have posed serious challenges for both the scientific and engineering communities in recent years. The topics covered range from mathematical models of electrical and electronic components and systems, to simulation tools implemented for their analysis and further developments; and from multidisciplinary optimization, signal processing methods and numerical results, to control and diagnostic techniques. By bridging theory and practice in the modeling, design and optimization of electrical, electromechanical and electronic systems, and by adopting a multidisciplinary perspective, the book provides researchers and practitioners with timely and extensive information on the state of the art in the field - and a source of new, exciting ideas for further developments and collaborations. The book presents selected results of the XIII Scientific Conference on Selected Issues of Electrical Engineering and Electronics (WZEE 2016), held on May 04-08, 2016, in Rzeszow, Poland. The Conference was organized by the Rzeszow Division of Polish Association of Theoretical and Applied Electrical Engineering (PTETiS) in cooperation with the Faculty of Electrical and Computer Engineering of the Rzeszow University of Technology.

This book is a comprehensive and intensive book for graduate students in fluid dynamics as well as scientists, engineers and applied mathematicians. Offering a systematic introduction to the physical theory of vortical flows at graduate level, it considers the theory of vortical flows as a branch of fluid dynamics focusing on shearing process in fluid motion, measured by vorticity. It studies vortical flows according to their natural evolution stages,from being generated to dissipated. As preparation, the first three chapters of the book provide background knowledge for entering vortical flows. The rest of the book deals with vortices and vortical flows, following their natural evolution stages. Of various vortices the primary form is layer-like vortices or shear layers, and secondary but stronger form is axial vortices mainly formed by the rolling up of shear layers. Problems are given at the end of each chapter and Appendix, some for helping understanding the basic theories, and some involving specific applications; but the emphasis of both is always on physical thinking.

This book explores the microsensing technologies and systems now available to monitor the quality of air and water within the urban environment and examines their role in the creation of sustainable cities against the background of the challenges posed by rapid urbanization. The opening section addresses the theoretical and conceptual background of microsensing networks. The coverage includes detailed description of microsensors, supported by design-specific equations, and clear explanation of the ways in which devices that harvest energy from ambient sources can detect and quantify pollution. The practical application of such systems in addressing environmental impacts within cities and in sustainable urban planning is then discussed with the aid of case studies in developing countries. The book will be of interest to all who wish to understand the benefits of microsensing networks in promoting sustainable cities through better delivery of information on health hazards and improved provision of data to environmental agencies and regulatory bodies in order to assist in monitoring, decision-making, and regulatory enforcement.

This new volume focuses on a new, exciting field of research: Spintronics, the area also known as spin-based electronics. The ultimate aim of researchers in this area is to develop new devices that exploit the spin of an electron instead of, or in addition to, its electronic charge.
In recent years many groups worldwide have devoted huge efforts to research of spintronic materials, from their technology through characterization to modeling. The resultant explosion of papers in this field and the solid scientific results achieved justify the publication of this volume. Its goal is to summarize the current level of understanding and to highlight some key results and milestones that have been achieved to date.
Semiconductor spintronics is expected to lead to a new generation of transistors, lasers and integrated magnetic sensors that can be used to create ultra-low power, high-speed memory, logic and photonic devices. In addition, development of novel devices such as spin-polarized light emitters, spin field effect transistors, integrated sensors and high-temperature electronics is anticipated.
* Spintronics has emerged as one of the fastest growing areas of research
* This text presents an in-depth examination of the most recent technological spintronic developments
* Includes contributions from leading scholars and industry experts

Practical MEMS focuses on analyzing the operational principles of microsystems. The salient features of the book include:

Tutorial approach. The book emphasizes the design and analysis through over 100 calculated examples covering all aspects of MEMS design.

Emphasis on design. This book focuses on the microdevice operation. First, the physical operation principles are covered. Second, the design equations are derived and exemplified. Practical MEMS is a perfect companion to MEMS fabrication textbooks.

Quantitative performance analysis. The critical performance parameters for the given application are identified and analyzed. For example, the noise and power performance of piezoresistive and capacitive accelerometers is analyzed in detail. Mechanical, resistive (thermal and 1/f-noise), and circuit noise analysis is covered.

Application specifications. Different MEMS applications are compared to commercial design requirements. For example, the optical MEMS is analyzed in the context of bar code scanner, projection displays, and optical cross connect specifications.

MEMS economics and market analysis. A full chapter is devoted to yield and cost analysis of microfabricated devices. In addition, the market economics for emerging applications such as RF MEMS is discussed.

Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.

This book serves as a practical guide for practicing engineers who need to design embedded systems for high-speed data acquisition and control systems. A minimum amount of theory is presented, along with a review of analog and digital electronics, followed by detailed explanations of essential topics in hardware design and software development. The discussion of hardware focuses on microcontroller design (ARM microcontrollers and FPGAs), techniques of embedded design, high speed data acquisition (DAQ) and control systems. Coverage of software development includes main programming techniques, culminating in the study of real-time operating systems. All concepts are introduced in a manner to be highly-accessible to practicing engineers and lead to the practical implementation of an embedded board that can be used in various industrial fields as a control system and high speed data acquisition system.

This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as "More than Moore" (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to "Moore's Law". Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect.

Digital video is everywhere! The engineers creating HDTV, mp3 players, and smart phones and their components are in need of essential information at a moment's notice. The Instant Access Series provides all the critical content that a digital video engineer needs in his or her daily work.
This book provides an introduction to video as well as succinct overviews of analog and digital interfaces along with signal processing. This book is filled with images, figures, tables, and easy to find tips and tricks for the engineer that needs material fast to complete projects to deadline.
*Tips and tricks feature that will help engineers get up and running fast and move on to the next issue
*Easily searchable content complete with tabs, chapter table of contents, bulleted lists, and boxed features
*Just the essentials, no need to page through material not needed for the current project

How to develop innovative architectures based on emerging molecular devices? The simple yet ambitious objective of Molecular Electronics Materials, Devices and Applications is to give the reader the necessary information to understand the challenges and opportunities of this recent field of research. In order to provide a good overview and understanding, the main molecular devices are first presented. A complete set of presentation and discussion of the actual molecular architectures follows. Nevertheless, another goal of Molecular Electronics Materials, Devices and Applications is also to promote a practical approach. As a starting point for future developments, a pragmatic methodology for VHDL-AMS device modelling and circuit design based on experimental data is then proposed. It includes an original fault tolerant memory architecture based on molecular electronics.