Current models of acculturation in multicultural counseling literature are severely limited in describing how individuals deal with the complexity of culture change. The reasons for immigration, the historical period during which the immigration occurred, educational and socioeconomic levels, ethnic community and religious involvements, family functioning, and social support, to name a few, all have an impact in the process of cultural adaptation. This book examines Korean American women's dual-cultural identity. By utilizing multiple case studies, the book highlights: (1) the complexity of issues involved as individuals go through different levels of culture change, and (2) the multiplicity of people negotiating their lives in the dual-cultural context and creating meaning out of many ambiguous and even contradictory life situations.

High-Performance Digital VLSI Circuit Design is the first book devoted entirely to the design of digital high-performance VLSI circuits. CMOS, BiCMOS and bipolar ciruits are covered in depth, including state-of-the-art circuit structures. Recent advances in both the computer and telecommunications industries demand high-performance VLSI digital circuits. Digital processing of signals demands high-speed circuit techniques for the GHz range. The design of such circuits represents a great challenge; one that is amplified when the power supply is scaled down to 3.3 V. Moreover, the requirements of low-power/high-performance circuits adds an extra dimension to the design of such circuits. High-Performance Digital VLSI Circuit Design is a self-contained text, introducing the subject of high-performance VLSI circuit design and explaining the speed/power tradeoffs. The first few chapters of the book discuss the necessary background material in the area of device design and device modeling, respectively. High-performance CMOS circuits are then covered, especially the new all-N-logic dynamic circuits. Propagation delay times of high-speed bipolar CML and ECL are developed analytically to give a thorough understanding of various interacting process, device and circuit parameters. High-current phenomena of bipolar devices are also addressed as these devices typically operate at maximum currents for limited device area. Different, new, high-performance BiCMOS circuits are presented and compared to their conventional counterparts. These new circuits find direct applications in the areas of high-speed adders, frequency dividers, sense amplifiers, level-shifters, input/output clock buffers and PLLs. The book concludes with a few system application examples of digital high-performance VLSI circuits. Audience: A vital reference for practicing IC designers. Can be used as a text for graduate and senior undergraduate students in the area.

The recent boom in the mobile telecommunication market has captured the interest of electronic and communication companies worldwide. In order to cut costs, and to decrease volume and power consumption, research is ongoing which focuses on the integration of a complete RF transceiver on a single die. This book discusses for the first time an important building block in such a single-chip wireless transceiver, that is, the frequency synthesizer. CMOS Wireless Frequency Synthesizer Design starts off with a comprehensive overview of possible synthesizer architectures together with a discussion of the general PLL theory. It goes on to present an easy calculation method of predicting LC-tuned VCO phase noise. Practical designs are presented which illustrate in detail the implementation of monolithic LC-tuned VCOs, using either bonding-wire inductors or hollow planar inductors. It is demonstrated that such designs can achieve the required phase noise specifications using standard CMOS technology. CMOS Wireless Frequency Synthesizer Design also discusses the other PLL building blocks such as the high-speed frequency divider. The phase-switching multi-modulus prescaler architecture, which combines high input frequencies with a programmable division factor, is presented in chapter 6. A concluding chapter combines all the gathered knowledge and presents the first monolithic standard CMOS frequency synthesizer that achieves the DCS-1800 specifications. CMOS Wireless Frequency Synthesizer Design is essential reading for all researchers and practicing engineers working in the design of wireless communication systems requiring highly integrated RF transceivers and frequency synthesizers.

Introduction to Fuzzy Systems provides students with a self-contained introduction that requires no preliminary knowledge of fuzzy mathematics and fuzzy control systems theory. Simplified and readily accessible, it encourages both classroom and self-directed learners to build a solid foundation in fuzzy systems. After introducing the subject, the authors move directly into presenting real-world applications of fuzzy logic, revealing its practical flavor. This practicality is then followed by basic fuzzy systems theory. The book also offers a tutorial on fuzzy control theory, based mainly on the well-known classical Proportional-Integral-Derivative (PID) controllers theory and design methods. In particular, the text discusses fuzzy PID controllers in detail, including a description of the new notion of generalized verb-based fuzzy-logic control theory. Introduction to Fuzzy Systems is primarily designed to provide training for systems and control majors, both senior undergraduate and first year graduate students, to acquaint them with the fundamental mathematical theory and design methodology required to understand and utilize fuzzy control systems.

In recent years, Low Temperature Cofired Ceramics (LTCC) have become an attractive technology for electronic components and substrates that are compact, light, and offer high-speed and functionality for portable electronic devices such as cellular phones, personal digital assistants (PDA) and personal computers used for wireless voice and data communication in rapidly expanding mobile network systems. LTCC are especially suitable for the high frequency circuits required for high-speed data communications.

From little more than a circuit-theoretical concept in 1965, computer-aided circuit simulation developed into an essential and routinely used design tool in less than ten years. In 1965 it was costly and time consuming to analyze circuits consisting of a half-dozen transistors. By 1975 circuits composed of hundreds of transistors were analyzed routinely. Today, simulation capabilities easily extend to thousands of transistors. Circuit designers use simulation as routinely as they used to use a slide rule and almost as easily as they now use hand-held calculators. However, just as with the slide rule or hand-held calculator, some designers are found to use circuit simulation more effectively than others. They ask better questions, do fewer analyses, and get better answers. In general, they are more effective in using circuit simulation as a design tool. Why? Certainly, design experience, skill, intuition, and even luck contribute to a designer's effectiveness. At the same time those who design and develop circuit simulation programs would like to believe that their programs are so easy and straightforward to use, so well debugged and so efficient that even their own grandmother could design effectively using their program.

The book Computer Applications in Engineering and Management is about computer applications in management, electrical engineering, electronics engineering, and civil engineering. It covers the software tools for office automation, introduces the basic concepts of database management, and provides an overview about the concepts of data communication, internet, and e-commerce. Additionally, the book explains the principles of computing management used in construction of buildings in civil engineering and the role of computers in power grid automation in electronics engineering. Features Provides an insight to prospective research and application areas related to industry and technology Includes industry-based inputs Provides a hands-on approach for readers of the book to practice and assimilate learning This book is primarily aimed at undergraduates and graduates in computer science, information technology, civil engineering, electronics and electrical engineering, management, academicians, and research scholars.

This book contains a selection of papers presented at the Second National Conference on Sensors held in Rome 19-21 February 2014. The conference highlighted state-of-the-art results from both theoretical and applied research in the field of sensors and related technologies. This book presents material in an interdisciplinary approach, covering many aspects of the disciplines related to sensors, including physics, chemistry, materials science, biology and applications.

This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.

Due to the progress in VLSI technology, integrated circuit chips are now available that allow video/image signal processing to be performed with a single VLSI chip or small sets of VLSI chips. Recent standardization on bandwidth compression schemes for still images (JPEG) and motion pictures (H.261, R723, MPEG) also encourage the development of VLSI video/image processors for cost-effective solutions. Furthermore, recent trends suggest that the standardization on HDTB bandwidth compression for broadcasting and storage purposes is just around the corner. In terms of device technology, however, the progress achieved in increasing speed is not as high as that achieved by integration. The development of high speed systems is due to architectural effort, rather than device technology. This is why high speed architectures, such as those for special wired logic realization and for multi-processors are of great interest to VLSI system designers. VLSI Video/Image Signal Processing is an edited volume of original research comprising invited contributions by leading researchers.

The existence of electrical noise is basically due to the fact that electrical charge is not continuous but is carried in discrete amounts equal to the electron charge. Electrical noise represents a fundamental limit on the performance of electronic circuits and systems. With the explosive growth in the personal mobile communications market, the need for noise analysis/simulation techniques for nonlinear electronic circuits and systems has been re-emphasized. Even though most of the signal processing is done in the digital domain, every wireless communication device has an analog front-end which is usually the bottleneck in the design of the whole system. The requirements for low-power operation and higher levels of integration create new challenges in the design of the analog signal processing subsystems of these mobile communication devices. The effect of noise on the performance of these inherently nonlinear analog circuits is becoming more and more significant. Analysis and Simulation of Noise in Nonlinear Electronic Circuits and Systems presents analysis, simulation and characterization techniques and behavioral models for noise in nonlinear electronic circuits and systems, along with practical examples. This book treats the problem within the framework of, and using techniques from, the probabilistic theory of stochastic processes and stochastic differential systems. Analysis and Simulation of Noise in Nonlinear Electronic Circuits and Systems will be of interest to RF/analog designers as well as engineers interested in stochastic modeling and simulation.

Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools. Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.

As industry power demands become increasingly sensitive, power quality distortion becomes a critical issue. The recent increase in nonlinear loads drawing non-sinusoidal currents has seen the introduction of various tools to manage the clean delivery of power. Power demands of medical facilities, data storage and information systems, emergency equipment, etc. require uninterrupted, high quality power. Uninterruptible power supplies (UPS) and active filters provide this delivery. The first to treat these power management tools together in a comprehensive discussion, Uninterruptible Power Supplies and Active Filters compares the similarities of UPS, active filters, and unified power quality conditioners. The book features a description of low-cost and reduced-parts configurations presented for the first time in any publication, along with a presentation of advanced digital controllers. These configurations are vital as industries seek to reduce the cost of power management in their operations. As this field of power management technology continues to grow, industry and academia will come to rely upon the comprehensive treatment found within this book. Industrial engineers in power quality, circuits and devices, and aerospace engineers as well as graduate students will find this a complete and insightful resource for studying and applying the tools of this rapidly developing field.

Electrical and Electronic Systems is written in a way that makes it accessible for all its potential readers. Students specialising in electronic or electrical engineering will find material that is presented in a way that is easy to absorb, providing an excellent grounding for further study. For those intending to specialise in other areas of engineering or science, the book provides a good grounding in the basics, and progresses into detail only as far as it is appropriate for their needs.The key to the book's accessibility is the "top down" approach to the subject - the book begins by outlining the uses and characteristics of electrical and electronic systems, before looking in detail at their analysis. This gives students an insight into why topics are important before they are studied in detail.

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS(r) describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS(r) that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS(r) to perform solder joint reliability analysis.
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS(r) allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packag

The 26th International Conference on the Physics of Semiconductors was held from 29 July to 2 August 2002 at the Edinburgh International Conference Centre. It is the premier meeting in the field of semiconductor physics and attracted over 1000 participants from leading academic, governmental and industrial institutions in some 50 countries around the world. Plenary and invited papers (34) have been printed in the paper volume, and all submitted papers (742) are included on the downloadable resources.These proceedings provide an international perspective on the latest research and a review of recent developments in semiconductor physics. Topics range from growth and properties of bulk semiconductors to the optical and transport properties of semiconductor nanostructures. There are 742 papers, mostly arranged in chapters on Bulk, dynamics, defects and impurities, growth (147); Heterostructures, quantum wells, superlattices - optical (138); Heterostructures, quantum wells, superlattices - transport (97); Quantum nanostructures - optical (120); Quantum nanostructures - transport (85); New materials and concepts (52); Novel devices (43); and Spin and magnetic effects (48). A number of trends were identified in setting up the overall programme of the conference. There were significant contributions from new directions of research such as nanostructures and one-dimensional physics; spin effects and ferromagnetism; and terahertz and subband physics. These complemented areas in which the conference has traditional strengths, such as defects and bulk materials; crystal growth; quantum transport; and optical properties.As a record of a conference that covers the whole range of semiconductor physics, this book is an essential reference for researchers working on semiconductor physics, device physics, materials science, chemistry, and electronic and electrical engineering.

This book provides an insight into IoT intelligence in terms of applications and algorithmic challenges. The book is dedicated to addressing the major challenges in realizing the artificial intelligence in IoT-based applications including challenges that vary from cost and energy efficiency to availability to service quality in multidisciplinary fashion. The aim of this book is hence to focus on both the algorithmic and practical parts of the artificial intelligence approaches in IoT applications that are enabled and supported by wireless sensor networks and cellular networks. Targeted readers are from varying disciplines who are interested in implementing the smart planet/environments vision via intelligent wireless/wired enabling technologies. Includes the most up-to-date research and applications related to IoT artificial intelligence (AI); Provides new and innovative operational ideas regarding the IoT artificial intelligence that help advance the telecommunications industry; Presents AI challenges facing the IoT scientists and provides potential ways to solve them in critical daily life issues.

Silicon Carbide Microsystems for Harsh Environments reviews state-of-the-art Silicon Carbide (SiC) technologies that, when combined, create microsystems capable of surviving in harsh environments, technological readiness of the system components, key issues when integrating these components into systems, and other hurdles in harsh environment operation. The authors use the SiC technology platform suite the model platform for developing harsh environment microsystems and then detail the current status of the specific individual technologies (electronics, MEMS, packaging). Additionally, methods towards system level integration of components and key challenges are evaluated and discussed based on the current state of SiC materials processing and device technology. Issues such as temperature mismatch, process compatibility and temperature stability of individual components and how these issues manifest when building the system receive thorough investigation. The material covered not only reviews the state-of-the-art MEMS devices, provides a framework for the joining of electronics and MEMS along with packaging into usable harsh-environment-ready sensor modules.

This book introduces a paradigm of reverse hypothesis machines (RHM), focusing on knowledge innovation and machine learning. Knowledge- acquisition -based learning is constrained by large volumes of data and is time consuming. Hence Knowledge innovation based learning is the need of time. Since under-learning results in cognitive inabilities and over-learning compromises freedom, there is need for optimal machine learning. All existing learning techniques rely on mapping input and output and establishing mathematical relationships between them. Though methods change the paradigm remains the same-the forward hypothesis machine paradigm, which tries to minimize uncertainty. The RHM, on the other hand, makes use of uncertainty for creative learning. The approach uses limited data to help identify new and surprising solutions. It focuses on improving learnability, unlike traditional approaches, which focus on accuracy. The book is useful as a reference book for machine learning researchers and professionals as well as machine intelligence enthusiasts. It can also used by practitioners to develop new machine learning applications to solve problems that require creativity.

"Advanced technology is indistinguishable from magic." --Arthur C. ClarkeThis well-researched book makes sense of the new advances in electronic services and resources available to science and technology libraries. It will familiarize you with the latest collection development, reference service, and information service technologies. Inside you ll find case studies, examples of successful implementations of emerging information technologies, helpful tables and figures, screen shots, and more In addition to bringing you up to date on the latest trends in the area, Electronic Resources and Services in Sci-Tech Libraries will provide you with essential background information on these important technologies.With Electronic Resources and Services in Sci-Tech Libraries, you ll learn: how the University of Arizona Libraries access remote electronic resources how journal articles containing complex mathematics are published on the Web--including the latest developments in MathML, PDF, OpenMath, and more how the e-resource registry approach can be integrated with existing custom Web-based services how to use user-centered criteria to evaluate electronic journals how to use e-prints (electronic preprints) to break the stranglehold that journal publishers have over science libraries how to get the most from electronic reserves-with tips and techniques for implementing an e-reserves service, negotiating copyright issues, and more how to implement a successful current awareness services program how the next generation of library portals will impact sci-tech libraries and much more

Looking back when the International Forum on Advanced Microsystems for Automotive Application (AMAA) started, enormous progress has been made in reducing casualties, emissions and in increasing comfort and performance. Microsystems in many cases provided the key functions for this progress. Although the issues the event concentrated on didn t change significantly (safety, powertrain, comfort, etc.), considerable shifts of technological paradigms and approaches can be stated.

The future of microsystems will consist of integrated smart systems which are able to diagnose a situation, to describe and to qualify it. They will be able to identify and mutually address each other. They will be predictive and therefore they will be able to decide and help to decide. Smart systems will enable the automobile to interact with the environment, they will perform multiple tasks and assist a variety of activities. Smart systems will be highly reliable, often networked and energy autonomous.

There is a coincidence of the AMAA objectives and those of EPoSS, the European Technology Platform on Smart Systems Integration, contributing intensively to the development of automotive-specific smart systems. You will find a series of the EPoSS items in the programme of the 11th AMAA, which continues to be a unique exchange forum for companies in the automotive value chain.

The publication in hand also reflects these issues. It is a cut-out of new technological priorities in the area of microsystems-based smart devices and opens up a mid-term perspective of future smart systems applications in automobiles.

Additional information is available on www.amaa.de"

This book presents a universal mass-production micro/nano integrated fabrication technology, which can be used to realize micro/nano hierarchical structures on Si-based materials and flexible polymeric materials. This fabrication technology has been systematically investigated by using experimental measurements, mechanism analyses, theoretical simulations and so on. Three common materials (i.e., silicon, PDMS and Parylene-C) with micro/nano hierarchical structures have been successfully fabricated, which also show several attractive properties. Furthermore, this book introduces this fabrication technology into microenergy field, and proposes several high-performance nanogenerators, of which practical applications have also been studied in commercial electronic device and biomedical microsystem.