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3-Dimensional Process Simulation (Paperback, Softcover reprint of the original 1st ed. 1995)
Loot Price: R1,393
Discovery Miles 13 930
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3-Dimensional Process Simulation (Paperback, Softcover reprint of the original 1st ed. 1995)
Expected to ship within 18 - 22 working days
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This book contains the proceedings of the International "Workshop
on 3D Process Simulation which was held at the Campus of the
University Erlangen-Nuremberg in Erlangen on September 5, 1995, in
conjunction with the 6th International Conference on "Simulation of
Semiconductor Devices and Processes (SISDEP 95). Whereas
two-dimensional semiconductor process simulation has achieved a
certain degree of maturity, three-dimensional process simulation is
a newly emerging field in which most efforts are dedicated to
necessary basic developments. Research in this area is promoted by
the growing demand to obtain reliable information on device
geometries and dopant distributions needed for three-dimensional
device simulation, and challenged by the great algorithmic problems
caused by moving interfaces and by the requirement to limit
computation times and memory requirements. This workshop provided a
forum to discuss the industrial needs, technical problems, and
solutions being developed in the field of three-dimensional
semiconductor process simulation. Invited presentations from
leading semiconductor companies and research Centers of Excellence
from Japan, the USA, and Europe outlined novel numerical
algorithms, physical models, and applications in this rapidly
emerging field.
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