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Fluid Flow, Heat Transfer and Boiling in Micro-Channels (Paperback, Softcover reprint of hardcover 1st ed. 2009)
Loot Price: R4,287
Discovery Miles 42 870
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Fluid Flow, Heat Transfer and Boiling in Micro-Channels (Paperback, Softcover reprint of hardcover 1st ed. 2009)
Series: Heat and Mass Transfer
Expected to ship within 10 - 15 working days
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Total price: R4,307
Discovery Miles: 43 070
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The subject of the book is uid dynamics and heat transfer in
micro-channels. This problem is important for understanding the
complex phenomena associated with single- and two-phase ows in
heated micro-channels. The challenge posed by high heat uxes in
electronic chips makes thermal management a key factor in the
development of these systems. Cooling of mic- electronic components
by new cooling technologies, as well as improvement of the existing
ones, is becoming a necessity as the power dissipation levels of
integrated circuits increases and their sizes decrease. Miniature
heat sinks with liquid ows in silicon wafers could signi cantly
improve the performance and reliability of se- conductor devices.
The improvements are made by increasing the effective thermal
conductivity, by reducing the temperature gradient across the
wafer, by reducing the maximum wafer temperature, and also by
reducing the number and intensity of localized hot spots. A
possible way to enhance heat transfer in systems with high power
density is to change the phase in the micro-channels embedded in
the device. This has motivated a number of theoretical and
experimental investigations covering various aspects of heat
transfer in micro-channel heat sinks with phase change. The ow and
heat transfer in heated micro-channels are accompanied by a n- ber
of thermohydrodynamic processes, such as liquid heating and
vaporization, bo- ing, formation of two-phase mixtures with a very
complicated inner structure, etc., which affect signi cantly the
hydrodynamic and thermal characteristics of the co- ing systems.
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