Design of Adhesive Joints Under Humid Conditions (Hardcover, 2013 ed.)

This book describes most recent advances and limitations concerning design of adhesive joints under humid conditions and discusses future trends. It presents new approaches to predict the failure load after exposure to load, temperature and humidity over a long period of time. With the rapid increase in numerical computing power there have been attempts to formalize the different environmental contributions in order to provide a procedure to predict assembly durability, based on an initial identification of diffusion coefficients and mechanical parameters for both the adhesive and the interface. A coupled numerical model for the joint of interest is then constructed and this allows local water content to be defined and resulting changes in adhesive and interface properties to be predicted.

General

Imprint:	Springer-Verlag
Country of origin:	Germany
Series:	Advanced Structured Materials, 25
Release date:	July 2013
First published:	2013
Editors:	Lucas F. M. da Silva • Chiaki Sato
Dimensions:	235 x 155 x 23mm (L x W x T)
Format:	Hardcover
Pages:	182
Edition:	2013 ed.
ISBN-13:	978-3-642-37613-9
Categories:	Books > Science & Mathematics > Chemistry > Organic chemistry > Polymer chemistry Books > Professional & Technical > Industrial chemistry & manufacturing technologies > Industrial chemistry > Plastics & polymers technology Books > Professional & Technical > Mechanical engineering & materials > Materials science > General Books > Professional & Technical > Transport technology > Aerospace & aviation technology > General Promotions
LSN:	3-642-37613-4
Barcode:	9783642376139

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