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Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications (Hardcover, 2009 ed.) Loot Price: R4,479
Discovery Miles 44 790
Advanced Nanoscale ULSI Interconnects:  Fundamentals and Applications (Hardcover, 2009 ed.): Yosi Shacham-Diamand, Tetsuya...

Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications (Hardcover, 2009 ed.)

Yosi Shacham-Diamand, Tetsuya Osaka, Madhav Datta, Takayuki Ohba

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Loot Price R4,479 Discovery Miles 44 790 | Repayment Terms: R420 pm x 12*

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In Advanced ULSI interconnects - fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous "Moore's law" which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.

General

Imprint: Springer-Verlag New York
Country of origin: United States
Release date: October 2009
First published: 2009
Editors: Yosi Shacham-Diamand • Tetsuya Osaka • Madhav Datta • Takayuki Ohba
Dimensions: 235 x 155 x 34mm (L x W x T)
Format: Hardcover
Pages: 552
Edition: 2009 ed.
ISBN-13: 978-0-387-95867-5
Categories: Books > Professional & Technical > Technology: general issues > Nanotechnology
Books > Science & Mathematics > Chemistry > Physical chemistry > Electrochemistry & magnetochemistry
Books > Professional & Technical > Industrial chemistry & manufacturing technologies > Industrial chemistry > General
Books > Professional & Technical > Mechanical engineering & materials > Materials science > General
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > General
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LSN: 0-387-95867-3
Barcode: 9780387958675

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