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Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications (Hardcover, 2009 ed.)
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Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications (Hardcover, 2009 ed.)
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In Advanced ULSI interconnects - fundamentals and applications we
bring a comprehensive description of copper-based interconnect
technology for ultra-lar- scale integration (ULSI) technology for
integrated circuit (IC) application. In- grated circuit technology
is the base for all modern electronics systems. You can ?nd
electronics systems today everywhere: from toys and home appliances
to a- planes and space shuttles. Electronics systems form the
hardware that together with software are the bases of the modern
information society. The rapid growth and vast exploitation of
modern electronics system create a strong demand for new and
improved electronic circuits as demonstrated by the amazing
progress in the ?eld of ULSI technology. This progress is well
described by the famous "Moore's law" which states, in its most
general form, that all the metrics that describe integrated circuit
performance (e. g. , speed, number of devices, chip area) improve
expon- tially as a function of time. For example, the number of
components per chip d- bles every 18 months and the critical
dimension on a chip has shrunk by 50% every 2 years on average in
the last 30 years. This rapid growth in integrated circuits te-
nology results in highly complex integrated circuits with an
increasing number of interconnects on chips and between the chip
and its package. The complexity of the interconnect network on
chips involves an increasing number of metal lines per interconnect
level, more interconnect levels, and at the same time a reduction
in the interconnect line critical dimensions.
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