With the ongoing, worldwide installation of 40 Gbit/s fiber optic transmission systems, there is an urgency to learn more about the photonic devices supporting this technology. Focusing on the components used to generate, modulate, and receive optical signals, High-Speed Photonic Devices presents the state-of- the-art enabling technologies behind high-speed telecommunication systems. Written by experts in the field, the book explores high-speed transmitters, receivers, electronics, and all-optical techniques. Following a brief introduction of the devices, the subsequent chapters cover... High-speed, low-driving voltage electroabsorption modulators and their integration with distributed-feedback lasers for high-bitrate and long-haul optical fiber transmission systems Linear electro-optic Ti-diffused LiNbO3 devices, specifically, traveling-wave high-speed modulators III-V compound semiconductor electro-optic modulators High-speed polymer device technology and numerous examples of new material combinations Fundamental physical processes used in common photodetectors as well as some emerging photodetector designs High-speed electronic devices and integrated circuit technologies for very high-speed future lightwave communication systems Very high-speed all-optical technologies required for multi-terabit/s optical fiber transmission systems. Although it is hard to predict which particular technology will prevail in the future, you can be sure that the systems discussed in High-Speed Photonic Devices will help pave the way for low-cost, high-performance fiber optic networks that will cover the entire globe. This improved and easily accessible communications capability will no doubt better the quality of life for everyone.

Scanning transmission electron microscopy has become a mainstream technique for imaging and analysis at atomic resolution and sensitivity, and the authors of this book are widely credited with bringing the field to its present popularity. Scanning Transmission Electron Microscopy(STEM): Imaging and Analysis will provide a comprehensive explanation of the theory and practice of STEM from introductory to advanced levels, covering the instrument, image formation and scattering theory, and definition and measurement of resolution for both imaging and analysis. The authors will present examples of the use of combined imaging and spectroscopy for solving materials problems in a variety of fields, including condensed matter physics, materials science, catalysis, biology, and nanoscience. Therefore this will be a comprehensive reference for those working in applied fields wishing to use the technique, for graduate students learning microscopy for the first time, and for specialists in other fields of microscopy.

"Solid-State Theory - An Introduction" is a textbook for graduate students of physics and material sciences. Whilst covering the traditional topics of older textbooks, it also takes up new developments in theoretical concepts and materials that are connected with such breakthroughs as the quantum-Hall effects, the high-Tc superconductors, and the low-dimensional systems realized in solids. Thus besides providing the fundamental concepts to describe the physics of the electrons and ions comprising the solid, including their interactions, the book casts a bridge to the experimental facts and gives the reader an excellent insight into current research fields. A compilation of problems makes the book especially valuable to both students and teachers.

Planet Earth is under stress from various environmental factors, increasing the importance of being able to estimate the environmental costs associated with dynamic material shifts. Such shifts are occurring in the electronics industry and the most famous recent example is the introduction of lead-free solders. "Global Life Cycle Impact Assessments of Material Shifts" describes the environmental implications of this shift to lead-free solders and conductive adhesives using the standardized methodology of environmental life-cycle assessment (LCA).

As the product systems involved are rather small for interconnection materials it is possible using uncertainty analysis and consequential LCA to arrive at robust conclusions, even in the difficult holistic field of environmental cost accounting. The lead-free shift has many implications, such as the export of electronics waste, resource consumption, recycling issues, and technology development.

First published in 1990, this book provides an overview of the global distribution of the electronics industry and the structural factors which promoted this distribution by the end of the 1980s. Regarded as a 'flagship' sector in both advanced and developing countries, the electronics industry is encouraged by governments everywhere. Covering both the civilian and the military sides of the industry, Professor Todd reflects on the future of civilian electronics in the light of its global segmentation, and hints at the fundamental role of governments in the unfolding of both civilian and defence-electronics developments. He also endorses the overwhelming significance of strategies being played by electronics enterprises in both the USA and Japan.

Master Today's Best Practices for Building Reusable .NET Frameworks, Libraries, and Components ".NET Core [contains] advances important to cloud application developers: performance, resource utilization, container support, and others. This third edition of Framework Design Guidelines adds guidelines related to changes that the .NET team adopted during transition from the world of client-server application to the world of the Cloud." -From the Foreword by Scott Guthrie Framework Design Guidelines has long been the definitive guide to best practices for developing components and component libraries in Microsoft .NET. Now, this third edition has been fully revised to reflect game-changing API design innovations introduced by Microsoft through eight recent updates to C#, eleven updates to .NET Framework, and the emergence and evolution of .NET Core. Three leading .NET architects share the same guidance Microsoft teams are using to evolve .NET, so you can design well-performing components that feel like natural extensions to the platform. Building on the book's proven explanatory style, the authors and expert annotators offer insider guidance on new .NET and C# concepts, including major advances in asynchronous programming and lightweight memory access. Throughout, they clarify and refresh existing content, helping you take full advantage of best practices based on C# 8, .NET Framework 4.8, and .NET Core. Discover which practices should always, generally, rarely, or never be used-including practices that are no longer recommended Learn the general philosophy and fundamental principles of modern framework design Explore common framework design patterns with up-to-date C# examples Apply best practices for naming, types, extensibility, and exceptions Learn how to design libraries that scale in the cloud Master new async programming techniques utilizing Task and ValueTask Make the most of the Memory and Span types for lightweight memory access This guide is an indispensable resource for everyone who builds reusable .NET-based frameworks, libraries, or components at any scale: large system frameworks, medium-size reusable layers of large distributed systems, extensions to system frameworks, or even small shared components. Register your book for convenient access to downloads, updates, and/or corrections as they become available. See inside book for details.

Reviews various types of MLD processes including vapor-phase MLD, liquid-phase MLD, and selective MLD. Introduces organic multiple quantum dots (Organic MQDs) that are typical tailored organic thin-film materials produced by MLD. Designs light modulators/optical switches, predicts their performance, and discusses impacts of the organic MQDs on them. Discusses impacts of the organic MQDs on optical interconnects within computers and on optical switching systems. Presents proposals of MLD applications to energy conversion systems, molecular targeted drug delivery, photodynamic therapy, and laser surgery for cancer therapy.

Rad-hard Semiconductor Memories is intended for researchers and professionals interested in understanding how to design and make a preliminary evaluation of rad-hard semiconductor memories, making leverage on standard CMOS manufacturing processes available from different silicon foundries and using different technology nodes. In the first part of the book, a preliminary overview of the effects of radiation in space, with a specific focus on memories, will be conducted to enable the reader to understand why specific design solutions are adopted to mitigate hard and soft errors. The second part will be devoted to RHBD (Radiation Hardening by Design) techniques for semiconductor components with a specific focus on memories. The approach will follow a top-down scheme starting from RHBD at architectural level (how to build a rad-hard floor-plan), at circuit level (how to mitigate radiation effects by handling transistors in the proper way) and at layout level (how to shape a layout to mitigate radiation effects). After the description of the mitigation techniques, the book enters in the core of the topic covering SRAMs (synchronous, asynchronous, single port and dual port) and PROMs (based on AntiFuse OTP technologies), describing how to design a rad-hard flash memory and fostering RHBD toward emerging memories like ReRAM. The last part will be a leap into emerging memories at a very early stage, not yet ready for industrial use in silicon but candidates to become an option for the next wave of rad-hard components. Technical topics discussed in the book include: - Radiation effects on semiconductor components (TID, SEE) - Radiation Hardening by Design (RHBD) Techniques - Rad-hard SRAMs - Rad-hard PROMs - Rad-hard Flash NVMs - Rad-hard ReRAMs - Rad-hard emerging technologies

The book addresses various approaches to television projection imaging on large screens using lasers. Results of theoretical and experimental studies of an acousto-optic projection system operating on the principle of projecting an image of an entire amplitude-modulated television line in a single laser pulse are presented. Characteristic features of image formation and requirements for individual components are discussed. Particular attention is paid to nonlinear distortions of the image signal, which show up most severely at low modulation signal frequencies. The feasibility of improving the process efficiency and image quality using acousto-optic modulators and pulsed lasers is studied.

The book covers all essential elements of current and next generation fibre optic networks, including many that are ignored in other books. The reader gains an in-depth understanding of the current and future capabilities of fibre optic communication networks. He can estimate what fibre optics has to provide and where its (current and long-term) limitations may lie. Optoelectronic devices and glass fibres are the basis of contemporary communication systems. The book deals with the various components of these systems such as lasers, amplifiers, modulation devices, converters, optical switches, filters, detectors, emitters, sensors and fibre transfer systems. A systematic evaluation of the state of the art in related technological research and the level reached in application is given.

This book serves as a quick guide on the latest material systems including their synthesis, fabrication and characterization techniques. It discusses recent developments in different material systems and discusses their novel applications in various branches of science and engineering. The book briefs latest computational tools and techniques that are used to discover new material systems. The book also briefs applications of new emerging materials in various fields including, healthcare, sensors, opto-electronics, high power devices and nano-electronics. This book helps to create a synergy between computational and experimental research methods to better understand a particular material system.

This book helps you understand the basic properties of semiconductor quantum wells and superlattices and describes how they can be utilized for long-wavelength infrared detectors and imaging arrays. Includes 111 illustrations and 237 equations.

Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.

This thesis presents the discovery of a surprising phase transition between a topological and a broken symmetry phase. Phase transitions between broken symmetry phases involve a change in symmetry and those between topological phases require a change in topological order; in rare cases, however, transitions may occur between these two broad classes of phases in which the vanishing of the topological order is accompanied by the emergence of a broken symmetry. This thesis describes observations of such a special phase transition in the two-dimensional electron gas confined in the GaAs/AlGaAs structures. When tuned by hydrostatic pressure, the = 5/2 and = 7/2 fractional quantum Hall states, believed to be prototypical non-Abelian topological phases of the Pfaffian universality class, give way to an electronic nematic phase. Remarkably, the fractional quantum Hall states involved are due to pairing of emergent particles called composite fermions. The findings reported here, therefore, provide an interesting example of competition of pairing and nematicity. This thesis provides an introduction to quantum Hall physics of the two-dimensional electron gas, contains details of the high pressure experiments, and offers a discussion of the ramifications and of the origins of the newly reported phase transition.

An Introduction to Electronic Materials for Engineers aims to give a basic understanding and comprehensive overview of a wide range of materials, such as conducting materials, semiconductors, magnetic materials, optical materials, dielectric materials, superconductors, thermoelectric materials and ionic materials. The new chapters added into this latest edition include thin film electronic materials, organic electronic materials and nanostructured materials. These chapters aim to reflect the new developments made in electronic materials and nanotechnology research towards the design and fabrication of modern equipment and electronic devices.This book is designed for undergraduate engineering and technology students who have background knowledge of physics and chemistry, as well as for engineers who work on materials processing or application, or electric/electronic engineering.It emphasizes on the synthesis, performance and application of electronic materials and will enable readers to understand and relate to the devices and materials.

This book deals with the analysis and design of CMOS current-mode circuits for data communications. CMOS current-mode sampled-data networks, i.e. switched-current circuits, are excluded. Major subjects covered in the book include: a critical comparison of voltage-mode and current-mode circuits; the building blocks of current-mode circuits: design techniques; modeling of wire channels, electrical signaling for Gbps data communications; ESD protection for current-mode circuits and more. This book will appeal to IC design engineers, hardware system engineers and others.

This book provides in-depth coverage of smart materials, including electroactive polymers (EAPs), synthetic muscle, pneumatic artificial muscle, soft pneumatics, hydro-muscle, and other cutting-edge transformational smart material technologies. It looks at ways smart materials respond to stimuli, such as electricity, pressure, temperature, magnetism, or light. State-of-the-art developments in EAP based actuation and pneumatics are covered, including nanotechnology, soft robotics, EAP considerations for NASA applications and thermal control of satellites, control of mirrors using dielectric elastomeric actuators, and biomimetic design and function in robotics and prosthetics. A detailed analysis of the challenges of smart materials on Earth and in space is included, with an interview about considerations and training for Missions to Moon and Mars. This book is a must-read within the smart material and space communities, from tech savvy students to industry professionals.

Advances in Measurement Technology, Disaster Prevention and Mitigation collects papers resulting from the conference on Measurement Technology, Disaster Prevention and Mitigation (MTDPM 2022), Zhengzhou, China, 27-29 May, 2022. The primary goal is to promote research and developmental activities in measurement, disaster prevention and mitigation, and another goal is to promote scientific information interchange between scholars from the top universities, business associations, research centers and high-tech enterprises working all around the world. The conference conducts in-depth exchanges and discussions on relevant topics such as measurement, disaster prevention and mitigation, aiming to provide an academic and technical communication platform for scholars and engineers engaged in scientific research and engineering practice in the field of measurement application, measurement in civil engineering and disaster reduction. By sharing the research status of scientific research achievements and cutting-edge technologies, it helps scholars and engineers all over the world comprehend the academic development trend and broaden research ideas. So as to strengthen international academic research, academic topics exchange and discussion, and promote the industrialization cooperation of academic achievements.

This book covers device design fundamentals and system applications in optical MEMS and nanophotonics. Expert authors showcase examples of how fusion of nanoelectromechanical (NEMS) with nanophotonic elements is creating powerful new photonic devices and systems including MEMS micromirrors, MEMS tunable filters, MEMS-based adjustable lenses and apertures, NEMS-driven variable silicon nanowire waveguide couplers, and NEMS tunable photonic crystal nanocavities. The book also addresses system applications in laser scanning displays, endoscopic systems, space telescopes, optical telecommunication systems, and biomedical implantable systems. Presents efforts to scale down mechanical and photonic elements into the nano regime for enhanced performance, faster operational speed, greater bandwidth, and higher level of integration. Showcases the integration of MEMS and optical/photonic devices into real commercial products. Addresses applications in optical telecommunication, sensing, imaging, and biomedical systems. Prof. Vincent C. Lee is Associate Professor in the Department of Electrical and Computer Engineering, National University of Singapore. Prof. Guangya Zhou is Associate Professor in the Department of Mechanical Engineering at National University of Singapore.

This authoritative new book focuses on recent developments in the instrumentation for sending voltages and currents. It covers new trends and challenges in the field, such as measurements of biocurrents, the increased speed of the components for data taking, testing of computers and integrated circuits where the measurement of rapid voltage and current variations on a very small geometrical scale is necessary. The first chapter concentrates on recent methods to sense voltages and currents, while the rest of the book investigates the applied side, covering for instance electrical power and energy measurements. The main purpose of this volume is to illustrate commonly employed techniques rather than track the scientific evolution and merits and therefore mainly covers patent literature aimed at industrial applications. It is an exciting addition, justifying the series' claim to cover state-of-the-art developments in both the applied and theoretical fields of sensors and actuators.

The measurement of voltages and currents is a common task in the field of electricity and electronics. From a technical point of view it is useful to identify schematically different steps of such a measurement. In a first step a voltage or a current is sensed, intermediate steps such as amplification, transmission and further treatment may follow to yield the result in the final step. Today in most cases microprocessors perform the final steps of such measurements. Analog-to digital converters digitise a voltage that is proportional to the value to be measured and a processor performs further computations and handles the storage and the display of the results. The prerequisite for such measurements are sensors or transducers that respond in a known way to the voltage or current to be measured. The emphasis of this book is put on recent developments of the instrumentation for sensing voltages and currents.

Aside from the general trend towards smaller, cheaper and more reliable instrumentation, new demands have arisen. New applications, like measurements of biocurrents, ask for higher sensitivities. Computers and integrated circuits pose new challenges. To exploit the increased speed of the components for data taking, suitable sensors are required. The accuracy that can be achieved depends more than ever on the first step, the acquisition of the raw data. The influence of the measurement process on the results becomes more crucial. Testing of integrated circuits themselves is a completely new application. For such tests one has to measure rapid voltage and current variations on very small geometrical scales. Here, as well as in the traditional high voltage applications, contactless measurements play an important role.

The organisation of this book is as follows: In the first chapter different methods to sense voltages and currents are described. For the sake of completeness most commonly used methods are mentioned, we concentrate, however, on those developed recently. The chapters address the subject from the side of different applications in which voltages and currents are sensed.

Since the main purpose of this publication is to illustrate commonly employed techniques rather than to track the scientific evolution and merits in particular fields, in general those publications that illustrate a particular measurement principle best have been cited. The citation of a particular reference does therefore not imply that this is the first or most pertinent publication in the respective field.

This book addresses computationally-efficient multi-objective optimization of antenna structures using variable-fidelity electromagnetic simulations, surrogate modeling techniques, and design space reduction methods. Based on contemporary research, it formulates multi-objective design tasks, highlights related challenges in the context of antenna design, and discusses solution approaches. Specific focus is on providing methodologies for handling computationally expensive simulation models of antenna structures in the sense of their multi-objective optimization. Also given is a summary of recent developments in antenna design optimization using variable-fidelity simulation models. Numerous examples of real-world antenna design problems are provided along with discussions and recommendations for the readers interested in applying the considered methods in their design work.Written with researchers and students in mind, topics covered can also be applied across a broad spectrum of aeronautical, mechanical, electrical, biomedical and civil engineering. It is of particular interest to those dealing with optimization, computationally expensive design tasks and simulation-driven design.

Multilevel Inverters: Conventional and Emerging Topologies and Their Control is written with two primary objectives: (a) explanation of fundamentals of multilevel inverters (MLIs) with reference to the general philosophy of power electronics; and (b) enabling the reader to systematically analyze a given topology with the possibility of contributing towards the ongoing evolution of topologies. The authors also present an updated status of current research in the field of MLIs with an emphasis on the evolution of newer topologies. In addition, the work includes a universal control scheme, with which any given topology can be modulated. Extensive qualitative and quantitative evaluations of emerging topologies give researchers and industry professionals suitable solutions for specific applications with a systematic presentation of software-based modeling and simulation, and an exploration of key issues. Topics covered also include power distribution among sources, voltage balancing, optimization switching frequency and asymmetric source configuration. This valuable reference further provides tools to model and simulate conventional and emerging topologies using MATLAB (R)/Simulink (R) and discusses execution of experimental set-up using popular interfacing tools. The book includes a Foreword by Dr. Frede Blaabjerg, Fellow IEEE, Professor and VILLUM Investigator, Aalborg University, Denmark.

New to this edition: Updated to using OrCAD Release 17.2 and its new features; Coverage of PSPICE extra features: PSpice Designer, PSpice Designer Plus, Modelling Application, PSpice Part Search Symbol Viewer, PSpice Report, Associate PSpice model, New delay functions for Behavioural Simulation Models, New Models, Support for negative values in hysteresis voltage and threshold voltage; A new chapter on PSpice Advanced Analysis Analog Design and Simulation Using OrCAD Capture and PSpice, Second Edition provides step-by-step instructions on how to use the Cadence/OrCAD family of Electronic Design Automation software for analog design and simulation. The book explains how to enter schematics in Capture, set up project types, project libraries and prepare circuits for PSpice simulation. There are chapters on the different analysis types for DC Bias point, DC sweep, AC frequency sweep, Parametric analysis, Temperature analysis, Performance Analysis, Noise analysis, Sensitivity and Monte Carlo simulation. Subsequent chapters explain how the Stimulus Editor is used to define custom analog and digital signals, how the Model Editor is used to view and create new PSpice models and Capture parts and how the Magnetic Parts Editor is used to design transformers and inductors. Other chapters include Analog Behaviorial models, Test Benches as well as how to create hierarchical designs. The book includes the latest features in the OrCAD 17.2 release and there are exercises with step by step instructions at the end of each chapter that enables the reader to progress based upon their experience and knowledge gained from previous chapters. The author worked for Cadence for over eight years and supported and delivered OrCAD PSpice training courses all over Europe. This book has been endorsed by Cadence. In addition, there are new chapters on the PSpice Advanced Analysis suite of tools: Sensitivity Analysis, Optimizer, Monte Carlo, and Smoke Analysis.The chapters show how circuit performance can effectively be maximised and optimised for variations in component tolerances, temperature effects, manufacturing yields and component stress.

In recent years, there has been a considerable amount of effort, both in industry and academia, focusing on the design, implementation, performance analysis, evaluation and prediction of silicon photonic interconnects for inter- and intra-chip communication, paving the way for the design and dimensioning of the next and future generation of high-performance computing systems. Photonic Interconnects for Computing Systems provides a comprehensive overview of the current state-of-the-art technology and research achievements in employing silicon photonics for interconnection networks and high-performance computing, summarizing main opportunities and some challenges. The majority of the chapters were collected from presentations made at the International Workshop on Optical/Photonic Interconnects for Computing Systems (OPTICS) held over the past two years. The workshop invites internationally recognized speakers on the range of topics relevant to silicon photonics and computing systems. Technical topics discussed in the book include: Design and Implementation of Chip-Scale Photonic Interconnects; Developing Design Automation Solutions for Chip-Scale Photonic Interconnects; Design Space Exploration in Chip-Scale Photonic Interconnects; Thermal Analysis and Modeling in Photonic Interconnects; Design for Reliability; Fabrication Non-Uniformity in Photonic Interconnects; Photonic Interconnects for Computing Systems presents a compilation of outstanding contributions from leading research groups in the field. It presents a comprehensive overview of the design, advantages, challenges, and requirements of photonic interconnects for computing systems. The selected contributions present important discussions and approaches related to the design and development of novel photonic interconnect architectures, as well as various design solutions to improve the performance of such systems while considering different challenges. The book is ideal for personnel in computer/photonic industries as well as academic staff and master/graduate students in computer science and engineering, electronic engineering, electrical engineering and photonics.