Rad-hard Semiconductor Memories is intended for researchers and professionals interested in understanding how to design and make a preliminary evaluation of rad-hard semiconductor memories, making leverage on standard CMOS manufacturing processes available from different silicon foundries and using different technology nodes. In the first part of the book, a preliminary overview of the effects of radiation in space, with a specific focus on memories, will be conducted to enable the reader to understand why specific design solutions are adopted to mitigate hard and soft errors. The second part will be devoted to RHBD (Radiation Hardening by Design) techniques for semiconductor components with a specific focus on memories. The approach will follow a top-down scheme starting from RHBD at architectural level (how to build a rad-hard floor-plan), at circuit level (how to mitigate radiation effects by handling transistors in the proper way) and at layout level (how to shape a layout to mitigate radiation effects). After the description of the mitigation techniques, the book enters in the core of the topic covering SRAMs (synchronous, asynchronous, single port and dual port) and PROMs (based on AntiFuse OTP technologies), describing how to design a rad-hard flash memory and fostering RHBD toward emerging memories like ReRAM. The last part will be a leap into emerging memories at a very early stage, not yet ready for industrial use in silicon but candidates to become an option for the next wave of rad-hard components. Technical topics discussed in the book include: - Radiation effects on semiconductor components (TID, SEE) - Radiation Hardening by Design (RHBD) Techniques - Rad-hard SRAMs - Rad-hard PROMs - Rad-hard Flash NVMs - Rad-hard ReRAMs - Rad-hard emerging technologies

This thesis presents the discovery of a surprising phase transition between a topological and a broken symmetry phase. Phase transitions between broken symmetry phases involve a change in symmetry and those between topological phases require a change in topological order; in rare cases, however, transitions may occur between these two broad classes of phases in which the vanishing of the topological order is accompanied by the emergence of a broken symmetry. This thesis describes observations of such a special phase transition in the two-dimensional electron gas confined in the GaAs/AlGaAs structures. When tuned by hydrostatic pressure, the = 5/2 and = 7/2 fractional quantum Hall states, believed to be prototypical non-Abelian topological phases of the Pfaffian universality class, give way to an electronic nematic phase. Remarkably, the fractional quantum Hall states involved are due to pairing of emergent particles called composite fermions. The findings reported here, therefore, provide an interesting example of competition of pairing and nematicity. This thesis provides an introduction to quantum Hall physics of the two-dimensional electron gas, contains details of the high pressure experiments, and offers a discussion of the ramifications and of the origins of the newly reported phase transition.

In recent years, there has been a considerable amount of effort, both in industry and academia, focusing on the design, implementation, performance analysis, evaluation and prediction of silicon photonic interconnects for inter- and intra-chip communication, paving the way for the design and dimensioning of the next and future generation of high-performance computing systems. Photonic Interconnects for Computing Systems provides a comprehensive overview of the current state-of-the-art technology and research achievements in employing silicon photonics for interconnection networks and high-performance computing, summarizing main opportunities and some challenges. The majority of the chapters were collected from presentations made at the International Workshop on Optical/Photonic Interconnects for Computing Systems (OPTICS) held over the past two years. The workshop invites internationally recognized speakers on the range of topics relevant to silicon photonics and computing systems. Technical topics discussed in the book include: Design and Implementation of Chip-Scale Photonic Interconnects; Developing Design Automation Solutions for Chip-Scale Photonic Interconnects; Design Space Exploration in Chip-Scale Photonic Interconnects; Thermal Analysis and Modeling in Photonic Interconnects; Design for Reliability; Fabrication Non-Uniformity in Photonic Interconnects; Photonic Interconnects for Computing Systems presents a compilation of outstanding contributions from leading research groups in the field. It presents a comprehensive overview of the design, advantages, challenges, and requirements of photonic interconnects for computing systems. The selected contributions present important discussions and approaches related to the design and development of novel photonic interconnect architectures, as well as various design solutions to improve the performance of such systems while considering different challenges. The book is ideal for personnel in computer/photonic industries as well as academic staff and master/graduate students in computer science and engineering, electronic engineering, electrical engineering and photonics.

This book serves as a quick guide on the latest material systems including their synthesis, fabrication and characterization techniques. It discusses recent developments in different material systems and discusses their novel applications in various branches of science and engineering. The book briefs latest computational tools and techniques that are used to discover new material systems. The book also briefs applications of new emerging materials in various fields including, healthcare, sensors, opto-electronics, high power devices and nano-electronics. This book helps to create a synergy between computational and experimental research methods to better understand a particular material system.

New to this edition: Updated to using OrCAD Release 17.2 and its new features; Coverage of PSPICE extra features: PSpice Designer, PSpice Designer Plus, Modelling Application, PSpice Part Search Symbol Viewer, PSpice Report, Associate PSpice model, New delay functions for Behavioural Simulation Models, New Models, Support for negative values in hysteresis voltage and threshold voltage; A new chapter on PSpice Advanced Analysis Analog Design and Simulation Using OrCAD Capture and PSpice, Second Edition provides step-by-step instructions on how to use the Cadence/OrCAD family of Electronic Design Automation software for analog design and simulation. The book explains how to enter schematics in Capture, set up project types, project libraries and prepare circuits for PSpice simulation. There are chapters on the different analysis types for DC Bias point, DC sweep, AC frequency sweep, Parametric analysis, Temperature analysis, Performance Analysis, Noise analysis, Sensitivity and Monte Carlo simulation. Subsequent chapters explain how the Stimulus Editor is used to define custom analog and digital signals, how the Model Editor is used to view and create new PSpice models and Capture parts and how the Magnetic Parts Editor is used to design transformers and inductors. Other chapters include Analog Behaviorial models, Test Benches as well as how to create hierarchical designs. The book includes the latest features in the OrCAD 17.2 release and there are exercises with step by step instructions at the end of each chapter that enables the reader to progress based upon their experience and knowledge gained from previous chapters. The author worked for Cadence for over eight years and supported and delivered OrCAD PSpice training courses all over Europe. This book has been endorsed by Cadence. In addition, there are new chapters on the PSpice Advanced Analysis suite of tools: Sensitivity Analysis, Optimizer, Monte Carlo, and Smoke Analysis.The chapters show how circuit performance can effectively be maximised and optimised for variations in component tolerances, temperature effects, manufacturing yields and component stress.

This book provides in-depth coverage of smart materials, including electroactive polymers (EAPs), synthetic muscle, pneumatic artificial muscle, soft pneumatics, hydro-muscle, and other cutting-edge transformational smart material technologies. It looks at ways smart materials respond to stimuli, such as electricity, pressure, temperature, magnetism, or light. State-of-the-art developments in EAP based actuation and pneumatics are covered, including nanotechnology, soft robotics, EAP considerations for NASA applications and thermal control of satellites, control of mirrors using dielectric elastomeric actuators, and biomimetic design and function in robotics and prosthetics. A detailed analysis of the challenges of smart materials on Earth and in space is included, with an interview about considerations and training for Missions to Moon and Mars. This book is a must-read within the smart material and space communities, from tech savvy students to industry professionals.

This book covers device design fundamentals and system applications in optical MEMS and nanophotonics. Expert authors showcase examples of how fusion of nanoelectromechanical (NEMS) with nanophotonic elements is creating powerful new photonic devices and systems including MEMS micromirrors, MEMS tunable filters, MEMS-based adjustable lenses and apertures, NEMS-driven variable silicon nanowire waveguide couplers, and NEMS tunable photonic crystal nanocavities. The book also addresses system applications in laser scanning displays, endoscopic systems, space telescopes, optical telecommunication systems, and biomedical implantable systems. Presents efforts to scale down mechanical and photonic elements into the nano regime for enhanced performance, faster operational speed, greater bandwidth, and higher level of integration. Showcases the integration of MEMS and optical/photonic devices into real commercial products. Addresses applications in optical telecommunication, sensing, imaging, and biomedical systems. Prof. Vincent C. Lee is Associate Professor in the Department of Electrical and Computer Engineering, National University of Singapore. Prof. Guangya Zhou is Associate Professor in the Department of Mechanical Engineering at National University of Singapore.

This edited book designs the Cognitive Computing in Human Cognition to analyze to improve the efficiency of decision making by cognitive intelligence. The book is also intended to attract the audience who work in brain computing, deep learning, transportation, and solar cell energy. Due to this in the recent era, smart methods with human touch called as human cognition is adopted by many researchers in the field of information technology with the Cognitive Computing.

This book is an up-to-date survey of the major optical characterization techniques for thin solid films. Emphasis is placed on practicability of the various approaches. Relevant fundamentals are briefly reviewed before demonstrating the application of these techniques to practically relevant research and development topics. The book is written by international top experts, all of whom are involved in industrial research and development projects.

Explains the circuit design of silicon optoelectronic integrated circuits (OEICs), which are central to advances in wireless and wired telecommunications. The essential features of optical absorption are summarized, as is the device physics of photodetectors and their integration in modern bipolar, CMOS, and BiCMOS technologies. This information provides the basis for understanding the underlying mechanisms of the OEICs described in the main part of the book. In order to cover the topic comprehensively, Silicon Optoelectronic Integrated Circuits presents detailed descriptions of many OEICs for a wide variety of applications from various optical sensors, smart sensors, 3D-cameras, and optical storage systems (DVD) to fiber receivers in deep-sub-m CMOS. Numerous detailed illustrations help to elucidate the material.

This book reviews the most significant advances in concepts, methods, and applications of quantum systems in a broad variety of problems in modern chemistry, physics, and biology. In particular, it discusses atomic, molecular, and solid structure, dynamics and spectroscopy, relativistic and correlation effects in quantum chemistry, topics of computational chemistry, physics and biology, as well as applications of theoretical chemistry and physics in advanced molecular and nano-materials and biochemical systems. The book contains peer-reviewed contributions written by leading experts in the fields and based on the presentations given at the Twenty-Fourth International Workshop on Quantum Systems in Chemistry, Physics, and Biology held in Odessa, Ukraine, in August 2019. This book is aimed at advanced graduate students, academics, and researchers, both in university and corporation laboratories, interested in state-of-the-art and novel trends in quantum chemistry, physics, biology, and their applications.

Coined as the third revolution in electronics is under way; Manufacturing is going digital, driven by computing revolution, powered by MOS technology, in particular, by the CMOS technology and its development.In this book, the scaling challenges for CMOS: SiGe BiCMOS, THz and niche technology are covered; the first article looks at scaling challenges for CMOS from an industrial point of view (review of the latest innovations); the second article focuses on SiGe BiCMOS technologies (deals with high-speed up to the THz-region), and the third article reports on circuits associated with source/drain integration in 14 nm and beyond FinFET technology nodes. Followed by the last two articles on niche applications for emerging technologies: one deals with carbon nanotube network and plasmonics for the THz region carbon, while the other reviews the recent developments in integrated on-chip nano-optomechanical systems.

Terahertz (THz) electromagnetic waves, phenomena in the THz range and related technological issues have been explosively investigated during the recent two decades. However, its potential as a disruptive technology to commercial applications has yet to make any impression.The Russia-Japan-USA-Europe Symposium on Fundamental and Applied Problems of Terahertz Devices and Technologies (RJUSE-TeraTech 2016), held at Katahira Campus of Tohoku University, Sendai, Japan on October 31 - November 4, 2016, aims to bring together researchers from Russia, Japan, USA and Europe, who are working on the broad range of related problems in the terahertz devices, technologies and applications, to discuss on state-of-the-art results and future directions and collaborations in the development of THz.This is the fifth in the series of preceding successful symposiums in Terahertz Devices and Technologies. It contains 14 selected extended papers presented at the RJUSE-TeraTech 2016 symposium, addressing the variety of topics, in particular, THz detectors based on double heterojunction bipolar transistors (DHBT) and field effect transistors (FET) utilizing resonant plasma effects, quantum cascade (QCL) and HgCdTe quantum-well heterostructures, and graphene-based THz devices.

This book presents fabrication approaches that could be adapted for the high-throughput and low-cost manufacturing of the proposed transparent electrode. It proposes and demonstrates a new type of embedded metal-mesh transparent electrode (EMTE) that offers superior electrical, optical, and mechanical properties. The structure of the EMTE allows thick metal mesh to be used (for high conductivity) without sacrificing surface smoothness. In addition, the embedded structure improves the EMTE's mechanical stability under high bending stress, as well as its chemical stability in ambient environments. These design aspects are then shown to be suitable for larger electrode areas, narrower metal-mesh line widths, and a wide range of materials, and can easily be adapted to produce flexible and even stretchable devices. In closing, the book explores the practical applications of EMTEs in flexible bifacial dye-sensitized solar cells and transparent thin-film heaters, demonstrating their outstanding performance.

Low dimensional systems have revolutionized the science and technology in several areas. However, their understanding is still a great challenge for the scientific community. Solar energy conversion devices based on nanostructured materials have shown exceptional gains in efficiency and stability. In this context, nanostructures allow an improvement of surface properties, transport and charge transfer, as well as direct application as sensors and storage devices and energy conversion. This book discuss the recent advances and future trends of the nanoscience in solar energy conversion and storage. It explores and discusses recent developments both in theory as well as in experimental studies and is of interest to materials scientists, chemists, physicists and engineers.

This book provides an introduction to the cost modeling for electronic systems that is suitable for advanced undergraduate and graduate students in electrical, mechanical and industrial engineering, and professionals involved with electronics technology development and management. This book melds elements of traditional engineering economics with manufacturing process and life-cycle cost management concepts to form a practical foundation for predicting the cost of electronic products and systems. Various manufacturing cost analysis methods are addressed including: process-flow, parametric, cost of ownership, and activity based costing. The effects of learning curves, data uncertainty, test and rework processes, and defects are considered. Aspects of system sustainment and life-cycle cost modeling including reliability (warranty, burn-in), maintenance (sparing and availability), and obsolescence are treated. Finally, total cost of ownership of systems, return on investment, cost-benefit analysis, and real options analysis are addressed.

This volume explores and addresses the challenges of high-k gate dielectric materials, one of the major concerns in the evolving semiconductor industry and the International Technology Roadmap for Semiconductors (ITRS). The application of high-k gate dielectric materials is a promising strategy that allows further miniaturization of microelectronic components. This book presents a broad review of SiO2 materials, including a brief historical note of Moore's law, followed by reliability issues of the SiO2 based MOS transistor. It goes on to discuss the transition of gate dielectrics with an EOT ~ 1 nm and a selection of high-k materials. A review of the various deposition techniques of different high-k films is also discussed. High-k dielectrics theories (quantum tunneling effects and interface engineering theory) and applications of different novel MOSFET structures, like tunneling FET, are also covered in this book. The volume also looks at the important issues in the future of CMOS technology and presents an analysis of interface charge densities with the high-k material tantalum pentoxide. The issue of CMOS VLSI technology with the high-k gate dielectric materials is covered as is the advanced MOSFET structure, with its working structure and modeling. This timely volume will prove to be a valuable resource on both the fundamentals and the successful integration of high-k dielectric materials in future IC technology.

The role of manufacturing in a country's economy and societal development has long been established through their wealth generating capabilities. To enhance and widen our knowledge of materials and to increase innovation and responsiveness to ever-increasing international needs, more in-depth studies of functionally graded materials/tailor-made materials, recent advancements in manufacturing processes and new design philosophies are needed at present. The objective of this volume is to bring together experts from academic institutions, industries and research organizations and professional engineers for sharing of knowledge, expertise and experience in the emerging trends related to design, advanced materials processing and characterization, and advanced manufacturing processes.

This book addresses computationally-efficient multi-objective optimization of antenna structures using variable-fidelity electromagnetic simulations, surrogate modeling techniques, and design space reduction methods. Based on contemporary research, it formulates multi-objective design tasks, highlights related challenges in the context of antenna design, and discusses solution approaches. Specific focus is on providing methodologies for handling computationally expensive simulation models of antenna structures in the sense of their multi-objective optimization. Also given is a summary of recent developments in antenna design optimization using variable-fidelity simulation models. Numerous examples of real-world antenna design problems are provided along with discussions and recommendations for the readers interested in applying the considered methods in their design work.Written with researchers and students in mind, topics covered can also be applied across a broad spectrum of aeronautical, mechanical, electrical, biomedical and civil engineering. It is of particular interest to those dealing with optimization, computationally expensive design tasks and simulation-driven design.

The MOS 2016 Study Guide for Microsoft Outlook covers Microsoft Outlook 2016, specifically the skills required to pass the Outlook 2016 Microsoft Office Specialist exam. The Microsoft Office Specialist Study Guides provide concise descriptions of the tasks that certification candidates must demonstrate to pass the Microsoft Office Specialist exams, step-by-step procedures for performing those tasks, practice tasks based on the MOS exam approach, sample files for practicing the tasks, and solution files so you can check your work.

This volume comprises the expert contributions from the invited speakers at the 17th International Conference on Thin Films (ICTF 2017), held at CSIR-NPL, New Delhi, India. Thin film research has become increasingly important over the last few decades owing to the applications in latest technologies and devices. The book focuses on current advances in thin film deposition processes and characterization including thin film measurements. The chapters cover different types of thin films like metal, dielectric, organic and inorganic, and their diverse applications across transistors, resistors, capacitors, memory elements for computers, optical filters and mirrors, sensors, solar cells, LED's, transparent conducting coatings for liquid crystal display, printed circuit board, and automobile headlamp covers. This book can be a useful reference for students, researchers as well as industry professionals by providing an up-to-date knowledge on thin films and coatings.

This proven textbook guides readers to a thorough understanding of the theory and design of operational amplifiers (OpAmps). The core of the book presents systematically the design of operational amplifiers, classifying them into a periodic system of nine main overall configurations, ranging from one gain stage up to four or more stages. This division enables circuit designers to recognize quickly, understand, and choose optimal configurations. Characterization of operational amplifiers is given by macro models and error matrices, together with measurement techniques for their parameters. Definitions are given for four types of operational amplifiers depending on the grounding of their input and output ports. Many famous designs are evaluated in depth, using a carefully structured approach enhanced by numerous figures. In order to reinforce the concepts introduced and facilitate self-evaluation of design skills, the author includes problems with detailed solutions, as well as simulation exercises.

Silicon, as a single-crystal semiconductor, has sparked a revolution in the field of electronics and touched nearly every field of science and technology. Though available abundantly as silica and in various other forms in nature, silicon is difficult to separate from its chemical compounds because of its reactivity. As a solid, silicon is chemically inert and stable, but growing it as a single crystal creates many technological challenges. Crystal Growth and Evaluation of Silicon for VLSI and ULSI is one of the first books to cover the systematic growth of silicon single crystals and the complete evaluation of silicon, from sand to useful wafers for device fabrication. Written for engineers and researchers working in semiconductor fabrication industries, this practical text: Describes different techniques used to grow silicon single crystals Explains how grown single-crystal ingots become a complete silicon wafer for integrated-circuit fabrication Reviews different methods to evaluate silicon wafers to determine suitability for device applications Analyzes silicon wafers in terms of resistivity and impurity concentration mapping Examines the effect of intentional and unintentional impurities Explores the defects found in regular silicon-crystal lattice Discusses silicon wafer preparation for VLSI and ULSI processing Crystal Growth and Evaluation of Silicon for VLSI and ULSI is an essential reference for different approaches to the selection of the basic silicon-containing compound, separation of silicon as metallurgical-grade pure silicon, subsequent purification, single-crystal growth, and defects and evaluation of the deviations within the grown crystals.