Test Resource Partitioning for System-on-a-Chip is about test resource partitioning and optimization techniques for plug-and-play system-on-a-chip (SOC) test automation. Plug-and-play refers to the paradigm in which core-to-core interfaces as well as core-to-SOC logic interfaces are standardized, such that cores can be easily plugged into "virtual sockets" on the SOC design, and core tests can be plugged into the SOC during test without substantial effort on the part of the system integrator. The goal of the book is to position test resource partitioning in the context of SOC test automation, as well as to generate interest and motivate research on this important topic.

SOC integrated circuits composed of embedded cores are now commonplace. Nevertheless, There remain several roadblocks to rapid and efficient system integration. Test development is seen as a major bottleneck in SOC design, and test challenges are a major contributor to the widening gap between design capability and manufacturing capacity. Testing SOCs is especially challenging in the absence of standardized test structures, test automation tools, and test protocols.

Test Resource Partitioning for System-on-a-Chip responds to a pressing need for a structured methodology for SOC test automation. It presents new techniques for the partitioning and optimization of the three major SOC test resources: test hardware, testing time and test data volume.

Test Resource Partitioning for System-on-a-Chip paves the way for a powerful integrated framework to automate the test flow for a large number of cores in an SOC in a plug-and-play fashion. The framework presented allows the system integrator to reduce test cost and meet short time-to-market requirements.

This book describes most recent progress in the properties, synthesis, characterization, modelling, and applications of nanomaterials and nanodevices. It begins with the review of the modelling of the structural, electronic and optical properties of low dimensional and nanoscale semiconductors, methodology of synthesis, and characterization of quantum dots and nanowires, with special attention towards Dirac materials, whose electrical conduction and sensing properties far exceed those of silicon-based materials, making them strong competitors. The contributed reviews presented in this book touch on broader issues associated with the environment, as well as energy production and storage, while highlighting important achievements in materials pertinent to the fields of biology and medicine, exhibiting an outstanding confluence of basic physical science with vital human endeavor. The subjects treated in this book are attractive to the broader readership of graduate and advanced undergraduate students in physics, chemistry, biology, and medicine, as well as in electrical, chemical, biological, and mechanical engineering. Seasoned researchers and experts from the semiconductor/device industry also greatly benefit from the book's treatment of cutting-edge application studies.

Metal-dielectric interfaces are ubiquitous in modern electronics. As advanced gigascale electronic devices continue to shrink, the stability of these interfaces is becoming an increasingly important issue that has a profound impact on the operational reliability of these devices. In this book, the authors present the basic science underlying the thermal and electrical stability of metal-dielectric interfaces and its relationship to the operation of advanced interconnect systems in gigascale electronics. Interface phenomena, including chemical reactions between metals and dielectrics, metallic-atom diffusion, and ion drift, are discussed based on fundamental physical and chemical principles. Schematic diagrams are provided throughout the book to illustrate interface phenomena and the principles that govern them. Metal-Dielectric Interfaces in Gigascale Electronics provides a unifying approach to the diverse and sometimes contradictory test results that are reported in the literature on metal-dielectric interfaces. The goal is to provide readers with a clear account of the relationship between interface science and its applications in interconnect structures. The material presented here will also be of interest to those engaged in field-effect transistor and memristor device research, as well as university researchers and industrial scientists working in the areas of electronic materials processing, semiconductor manufacturing, memory chips, and IC design.

The idea for this book arose out of the realization that, although excellent surveys and a phosphor handbook are available, there is no single source covering the area of phosphate based phosphors especially for lamp industry. Moreover, as this field gets only limited attention in most general books on luminescence, there is a clear need for a book in which attention is specifically directed toward this rapidly growing field of solid state lighting and its many applications. This book is aimed at providing a sound introduction to the synthesis and optical characterization of phosphate phosphor for undergraduate and graduate students as well as teachers and researchers. The book provides guidance through the multidisciplinary field of solid state lighting specially phosphate phosphors for beginners, scientists and engineers from universities, research organizations, and especially industry. In order to make it useful for a wide audience, both fundamentals and applications are discussed, together.

Physics of Semiconductor Devices covers both basic classic topics such as energy band theory and the gradual-channel model of the MOSFET as well as advanced concepts and devices such as MOSFET short-channel effects, low-dimensional devices and single-electron transistors. Concepts are introduced to the reader in a simple way, often using comparisons to everyday-life experiences such as simple fluid mechanics. They are then explained in depth and mathematical developments are fully described.
Physics of Semiconductor Devices contains a list of problems that can be used as homework assignments or can be solved in class to exemplify the theory. Many of these problems make use of Matlab and are aimed at illustrating theoretical concepts in a graphical manner.

The Beginnings of Electron Microscopy - Part 2, Volume 221 in the Advances in Imaging and Electron Physics series, highlights new advances in the field, with this new volume presenting interesting chapters on Recollections from the Early Years: Canada-USA, My Recollection of the Early History of Our Work on Electron Optics and the Electron Microscope, Walter Hoppe (1917-1986), Reminiscences of the Development of Electron Optics and Electron Microscope Instrumentation in Japan, Early Electron Microscopy in The Netherlands, L. L. Marton, 1901-1979, The Invention of the Electron Fresnel Interference Biprism, The Development of the Scanning Electron Microscope, and much more.

5G IoT and Edge Computing for Smart Healthcare addresses the importance of a 5G IoT and Edge-Cognitive-Computing-based system for the successful implementation and realization of a smart-healthcare system. The book provides insights on 5G technologies, along with intelligent processing algorithms/processors that have been adopted for processing the medical data that would assist in addressing the challenges in computer-aided diagnosis and clinical risk analysis on a real-time basis. Each chapter is self-sufficient, solving real-time problems through novel approaches that help the audience acquire the right knowledge. With the progressive development of medical and communication - computer technologies, the healthcare system has seen a tremendous opportunity to support the demand of today's new requirements.

This book presents an important technique to process organic photovoltaic devices. The basics, materials aspects and manufacturing of photovoltaic devices with solution processing are explained. Solution processable organic solar cells - polymer or solution processable small molecules - have the potential to significantly reduce the costs for solar electricity and energy payback time due to the low material costs for the cells, low cost and fast fabrication processes (ambient, roll-to-roll), high material utilization etc. In addition, organic photovoltaics (OPV) also provides attractive properties like flexibility, colorful displays and transparency which could open new market opportunities. The material and device innovations lead to improved efficiency by 8% for organic photovoltaic solar cells, compared to 4% in 2005. Both academic and industry research have significant interest in the development of this technology. This book gives an overview of the booming technology, focusing on the solution process for organic solar cells and provides a state-of-the-art report of the latest developments. World class experts cover fundamental, materials, devices and manufacturing technology of OPV technology.

MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs. Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain. Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).

Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.

The series Topics in Current Chemistry Collections presents critical reviews from the journal Topics in Current Chemistry organized in topical volumes. The scope of coverage is all areas of chemical science including the interfaces with related disciplines such as biology, medicine and materials science. The goal of each thematic volume is to give the non-specialist reader, whether in academia or industry, a comprehensive insight into an area where new research is emerging which is of interest to a larger scientific audience. Each review within the volume critically surveys one aspect of that topic and places it within the context of the volume as a whole. The most significant developments of the last 5 to 10 years are presented using selected examples to illustrate the principles discussed. The coverage is not intended to be an exhaustive summary of the field or include large quantities of data, but should rather be conceptual, concentrating on the methodological thinking that will allow the non-specialist reader to understand the information presented. Contributions also offer an outlook on potential future developments in the field.

This classroom-tested textbook is a modern primer on the rapidly developing field of quantum nano optics which investigates the optical properties of nanosized materials. The essentials of both classical and quantum optics are presented before embarking through a stimulating selection of further topics, such as various plasmonic phenomena, thermal effects, open quantum systems, and photon noise. Didactic and thorough in style, and requiring only basic knowledge of classical electrodynamics, the text provides all further physics background and additional mathematical and computational tools in a self-contained way. Numerous end-of-chapter exercises allow students to apply and test their understanding of the chapter topics and to refine their problem-solving techniques.

This book describes the theory and design of high-accuracy CMOS smart temperature sensors. The major topic of the work is the realization of a smart temperature sensor that has an accuracy that is so high that it can be applied without any form of calibration. Integrated in a low-cost CMOS technology, this yields at the publication date of this book one of the most inexpensive intelligent general purpose temperature sensors in the world. The first thermometers could only be read by the human eye. The industrial revolution and the following computerization asked for more intelligent sensors, which could easily communicate to digital computers. This led to. the development of integrated temperature sensors that combine a bipolar temperature sensor and an A-to-D converter on the same chip. The implementation in CMOS technology reduces the processing costs to a minimum while having the best-suited technology to increase the (digital) intelligence. The accuracy of conventional CMOS smart temperature sensors is degraded by the offset of the read-out electronics. Calibration of these errors is quite expensive, however, dynamic offset-cancellation techniques can reduce the offset of amplifiers by a factor 100 to 1000 and do not need trimming. Chapter two gives an elaborate description of the different kinds of dynamic offset-cancellation techniques. Also a new technique is introduced called the nested chopper technique. An implementation of a CMOS nested-chopper instrumentation amplifier shows a residual offset of less than lOOn V, which is the best result reported to date."

This book provides a comprehensive and up-to-date guide to the AMOLED technologies and applications which have become industry standard in a range of devices, from small mobile displays to large televisions. Unlike other books on the topic, which cover the fundamentals, materials, processing, and manufacturing of OLEDs, this one-stop book discusses the core components, such as TFT backplanes, OLED materials and devices, and driving schematics together in one volume with chapters written by experts from leading international companies in the field of OLED materials and OLED TVs. It also examines emerging areas, such as micro-LEDs, displays using quantum dots, and AR & VR displays. Presenting the latest research trends as well as the basic principles of each topic, this book is intended for undergraduate and postgraduate students taking display-related courses, new researchers, and engineers in related fields.

The book focuses on the topology optimization method for nano-optics. Both principles and implementing practice have been addressed, with more weight placed on applications. This is achieved by providing an in-depth study on the major topic of topology optimization of dielectric and metal structures for nano-optics with extension to the surface structures for electromagnetics. The comprehensive and systematic treatment of practical issues in topology optimization for nano-optics is one of the major features of the book, which is particularly suited for readers who are interested to learn practical solutions in topology optimization. The book can benefit researchers, engineers, and graduate students in the fields of structural optimization, nano-optics, wave optics, electromagnetics, etc.

Present-day scienceand technology have become increasingly based on studies and applications of thin films. This is especiallytrue of solid-state physics, semiconduc tor electronics, integrated optics, computer science, and the like. In these fields, it is necessary to use filmswith an ordered structure, especiallysingle-crystallinefilms, because physical phenomena and effects in such films are most reproducible. Also, active parts of semiconductor and other devices and circuits are created, as a rule, in single-crystal bodies. To date, single-crystallinefilms have been mainly epitaxial (or heteroepitaxial); i.e., they have been grown on a single-crystalline substrate, and principal trends, e.g., in the evolution of integrated circuits (lCs), have been based on continuing reduction in feature size and increase in the number of components per chip. However, as the size decreases into the submicrometer range, technological and physical limitations in integrated electronics become more and more severe. It is generally believed that a feature size of about 0.1um will have a crucial character. In other words, the present two-dimensional ICs are anticipated to reach their limit of minimization in the near future, and it is realized that further increase of packing density and/or functions might depend on three-dimensional integration. To solve the problem, techniques for preparation of single-crystalline films on arbitrary (including amorphous) substrates are essential."

The contrasting examples of microwave plasmas given in this volume demonstrate their capability of not only covering the totality of expressed needs in that particular field, but in many others. For example the ions and reactive neutral species, indispensable for the synergetic effects in etching and deposition processes can be used in metallurgical treatment, and for materials processing in general. They also have the ability to dissociate molecules and excite atoms as required in analytical chemistry where the information on the constituent concentrations is obtained through optical spectroscopy or mass spectrometry. Finally, microwave plasmas can supply the photons for laser and lighting applications. It is noteworthy that microwave plasmas cover an impressive pressure range of eight orders of magnitude from 10-3 Pa (10-5 torr) to above atmospheric pressure. The versatility of microwave plasmas, their moderate cost, and their ease of implementation particularly appeal to the industrial entrepreneur.

As well as providing a review of current developments, the work proposes a synthesis on microwave discharges, laying out the corresponding physical references without developing too much plasma theory. It will be of interest both to the user, who may not be overly concerned about plasma science, and to the plasma expert, who may wish to redirect his interest towards plasma applications, such as materials processing.

This new edition presents a unified description of these insulators from one to three dimensions based on the modified Dirac equation. It derives a series of solutions of the bound states near the boundary, and describes the current status of these solutions. Readers are introduced to topological invariants and their applications to a variety of systems from one-dimensional polyacetylene, to two-dimensional quantum spin Hall effect and p-wave superconductors, three-dimensional topological insulators and superconductors or superfluids, and topological Weyl semimetals, helping them to better understand this fascinating field. To reflect research advances in topological insulators, several parts of the book have been updated for the second edition, including: Spin-Triplet Superconductors, Superconductivity in Doped Topological Insulators, Detection of Majorana Fermions and so on. In particular, the book features a new chapter on Weyl semimetals, a topic that has attracted considerable attention and has already become a new hotpot of research in the community.

The proceedings present selected research papers from the CIAC2021, held in Zhanjiang, China on Nov 5-7, 2021. It covers a wide range of topics including intelligent control, robotics, artificial intelligence, pattern recognition, unmanned systems, IoT and machine learning. It includes original research and the latest advances in the field of intelligent automation. Engineers and researchers from academia, industry, and government can gain valuable insights into solutions combining ideas from multiple disciplines in this field.

Hands-on guide for scientists and engineers on how to use SQUID technology This practical book covers SQUID (superconducting quantum interference device) readout electronics and magnetometric systems. It illustrates their many practical applications in measuring extremely subtle magnetic fields and shows how the technique is developing into an enabling technology for many applications, such as biomagnetic imaging and geophysical prospecting. Clear and comprehensive, the book builds a bridge for scientists and engineers to fill in potential know-how gaps for all who work on SQUID systems and their practical applications. It helps make key words like readout electronics, flux quantization, Josephson effects, and noise contributions completely understandable to all who design and use simple and robust SQUID systems. Beginning with an introduction to the subject, SQUID Readout Electronics and Magnetometric Systems for Practical Applications offers in-depth chapter coverage of: Josephson junctions; dc SQUID's I-V characteristics and its bias modes; functions of the SQUID's readout electronics; direct readout scheme (DRS); SQUID magnetometry system and SQUID parameters; flux modulation scheme (FMS); and flux feedback concepts and parallel feedback circuit. Other sections examine: analyses of the "series feedback coil (circuit)" (SFC); weakly damped SQUID; two-stage and double relaxation oscillation readout schemes; and radio-frequency (rf) SQUID. - Provides a unique view of how simplicity and robustness are crucial for practical SQUID systems in applications - Focuses on the readout electronics of SQUID systems, particularly the advantages and disadvantages of the various systems - Helps materials scientists, physicists, and engineers overcome various major know-how barriers in order to understand the important challenges and to design practical SQUID systems - Largely documents the joint achievements accomplished in the cooperation between SIMIT and FZJ in the field of superconducting electronics SQUID Readout Electronics and Magnetometric Systems for Practical Applications is an excellent book for all materials scientists, electrical engineers, and physicists who can benefit from SQUID systems and their applications. It will also be of great benefit to analytical laboratories in industry, manufacturers of laboratory equipment, and systems engineers.

This book provides an overview of the current state of the art in novel piezo-composites based on ferroelectrics. Covering aspects ranging from theoretical materials simulation and manufacturing and characterization methods, to the application and performance of these materials, it focuses on the optimization of the material parameters. Presenting the latest findings on modern composites and highlighting the applications of piezoelectric materials for sensors, transducers and hydro-acoustics, the book addresses an important gap in the physics of active dielectrics and materials science and describes new trends in the research on ferroelectric composites.

Sintering process studies have re-emerged strongly in the past decade due to extensive discussions about the stabilization of nanoparticles and nanostructures, and the development of controlled nanograined bulk materials. This book presents the state-of-art in experiments and theory of novel sintering processes, traditional sintering and grain growth. The scope ranges from powder metallurgy to ceramic and composites processing. The challenges of conventional and novel sintering and grain growth in nanopowders and nanostructures are addressed, being useful for students as well as professionals interested in sintering at the nanoscale.

The second edition of this introductory book sets out clearly and concisely the principles of operation of the semiconductor devices that lie at the heart of the microelectronic revolution.

The book aims to teach the reader how semiconductor devices are modelled. It begins by providing a firm background in the relevant semiconductor physics. These ideas are then used to construct both circuit models and mathematical models for diodes, bipolar transistors and MOSFETs. It also describes the processes involved in fabricating silicon chips containing these devices.

The first edition has already proved a highly useful textbook to first and second year degree students in electrical and electronic engineering, and related disciplines. It is also useful to HND students in similar subject areas, and as supplementary reading for anyone involved in integrated circuit design and fabrication.