The IGBT Device: Physics, Design and Applications of the Insulated Gate Bipolar Transistor, Second Edition provides the essential information needed by applications engineers to design new products using the device in sectors including consumer, industrial, lighting, transportation, medical and renewable energy. The IGBT device has proven to be a highly important Power Semiconductor, providing the basis for adjustable speed motor drives (used in air conditioning and refrigeration and railway locomotives), electronic ignition systems for gasoline powered motor vehicles and energy-saving compact fluorescent light bulbs. The book presents recent applications in plasma displays (flat-screen TVs) and electric power transmission systems, alternative energy systems and energy storage, but it is also used in all renewable energy generation systems, including solar and wind power. This book is the first available on the applications of the IGBT. It will unlock IGBT for a new generation of engineering applications, making it essential reading for a wide audience of electrical and design engineers, as well as an important publication for semiconductor specialists.

Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity. MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond. MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area.

Throughout the 1980s and 1990s, the theory and practice of testing electronic products has changed considerably. Quality and testing have become inextricably linked and both are fundamental to the generation of revenue to a company, helping the company to remain profitable and therefore survive. Testing plays an important role in assessing the quality of a product. The tester acts as a filter, separating good products from bad. Unfortunately, the tester can pass bad products and fail good products, and the generation of high quality tests has become complex and time consuming. To achieve significant reduction in time and cost of testing, the role and responsibility of testing has to be considered across an entire organization and product development process. Testability Concepts for Digital ICs: The Macro Test Approach considers testability aspects for digital ICs. The strategy taken is to integrate the testability aspects into the design and manufacturing of ICs and, for each IC design project, to give a precise definition of the boundary conditions, responsibilities, interfaces and communications between persons, and quality targets. Macro Test, a design-for-Testability approach, provides a manageable test program route. Using the Macro Test approach, one can explore alternative solutions to satisfy pre-defined levels of performance (e.g. defect detection, defect location, test application) within a pre-defined cost budget and time scale. Testability Concepts for Digital ICs is the first book to present a tried and proven method of using a Macro approach to testing complex ICs and is of particular interest to all test engineers, IC designers and managers concerned with producing highquality ICs.

In response to new developments in the field, practical teaching experience, and readers' suggestions, the authors of the warmly received Reliablity Evaluation of Engineering Systems have updated and extended the work-providing extended coverage of fault trees and a more complete examination of probability distribution, among other things-without disturbing the original's concept, structure, or style.

This book covers broad aspects of the chemistry of -stacked polymers and low-molecular-weight molecules, from synthesis through theory. It is intended for graduate students and researchers in academia and industry and consists of chapters written by renowned scientists who have made significant contributions to this field in the past decade. -Stacked polymers and low-molecular-weight molecules are expected to replace main-chain conjugated polymers such as polyacetylenes and polythiophenes as organic conducting and energy-transferring substances that are important as materials for photo-electronic applications. -Stacked polymers and molecules have significant advantages over main-chain conjugated polymers, i.e., high solubility in solvents, large freedom in molecular design, and colorless nature.

Tutorial lectures given by world-renowned researchers have become one of the important traditions of the Nano and Giga Challenges (NGC) conference series. 1 Soon after preparations had begun for the rst forum, NGC2002, in Moscow, Russia, the organizers realized that publication of the lectures notes would be a va- able legacy of the meeting and a signi cant educational resource and knowledge base for students, young researchers, and senior experts. Our rst book was p- lished by Elsevier and received the same title as the meeting itself-Nano and Giga 2 Challenges in Microelectronics. Our second book, Nanotechnology for Electronic 3 4 Materials and Devices, based on the tutorial lectures at NGC2004 in Krakow, 5 Poland, the third book from NGC2007 in Phoenix, Arizona, and the current book 6 from joint NGC2009 and CSTC2009 meeting in Hamilton, Ontario, have been published in Springer's Nanostructure Science and Technology series. Hosted by McMaster University, the meeting NGC/CSTC 2009 was held as a joint event of two conference series, Nano and Giga Challenges (Nano & Giga Forum) and Canadian Semiconductor Technology Conferences (CSTC), bringing together the networks and expertise of both professional forums. Informational (electronics and photonics), renewable energy (solar systems, fuel cells, and batteries), and sensor (nano and bio) technologies have reached a new stage in their development in terms of engineering limits to cost-effective impro- ment of current technological approaches. The latest miniaturization of electronic devices is approaching atomic dimensions.

The first textbook to provide in-depth treatment of electroceramics with emphasis on applications in microelectronics, magneto-electronics, spintronics, energy storage and harvesting, sensors and detectors, magnetics, and in electro-optics and acousto-optics Electroceramics is a class of ceramic materials used primarily for their electrical properties. This book covers the important topics relevant to this growing field and places great emphasis on devices and applications. It provides sufficient background in theory and mathematics so that readers can gain insight into phenomena that are unique to electroceramics. Each chapter has its own brief introduction with an explanation of how the said content impacts technology. Multiple examples are provided to reinforce the content as well as numerous end-of-chapter problems for students to solve and learn. The book also includes suggestions for advanced study and key words relevant to each chapter. Fundamentals of Electroceramics: Materials, Devices and Applications offers eleven chapters covering: 1.Nature and types of solid materials; 2. Processing of Materials; 3. Methods for Materials Characterization; 4. Binding Forces in Solids and Essential Elements of Crystallography; 5. Dominant Forces and Effects in Electroceramics; 6. Coupled Nonlinear Effects in Electroceramics; 7. Elements of Semiconductor; 8. Electroceramic Semiconductor Devices; 9. Electroceramics and Green Energy; 10.Electroceramic Magnetics; and 11. Electro-optics and Acousto-optics. Provides an in-depth treatment of electroceramics with the emphasis on fundamental theoretical concepts, devices, and applications with focus on non-linear dielectrics Emphasizes applications in microelectronics, magneto-electronics, spintronics, energy storage and harvesting, sensors and detectors, magnetics and in electro-optics and acousto-optics Introductory textbook for students to learn and make an impact on technology Motivates students to get interested in research on various aspects of electroceramics at undergraduate and graduate levels leading to a challenging career path. Includes examples and problem questions within every chapter that prepare students well for independent thinking and learning. Fundamentals of Electroceramics: Materials, Devices and Applications is an invaluable academic textbook that will benefit all students, professors, researchers, scientists, engineers, and teachers of ceramic engineering, electrical engineering, applied physics, materials science, and engineering.

This thesis offers a thorough and informative study of high-power, high-energy optical parametric chirped pulse amplifications systems, the foundation of the next generation of femtosecond laser technology. Starting from the basics of the linear processes involved and the essential design considerations, the author clearly and systematically describes the various prerequisites of the nonlinear optical systems expected to drive attosecond physics in the coming decade. In this context, he gives an overview of methods for generating the broadband and carrier-envelope-phase stable seed pulses necessary for producing controlled electric-field waveforms in the final system; provides a guide to handling the high-power, high-energy pump lasers required to boost the pulse energy to the desired operating range; describes the design of the nonlinear optical system used to perform the amplification, including modes of operation for ultra-broadband infrared-visible pulses or narrowband (yet still ultrafast) pulses tunable over multiple octaves; and finally presents a prospective high-energy field synthesizer based upon these techniques. As such, this work is essential reading for all scientists interested in utilizing the newest generation of ultrafast systems.

This proceedings volume presents selected and peer reviewed 50 reports of the 2015 International Conference on "Physics and Mechanics of New Materials and Their Applications" (Azov, Russia, 19-22 May, 2015), devoted to 100th Anniversary of the Southern Federal University, Russia. The book presents processing techniques, physics, mechanics, and applications of advanced materials. The book is concentrated on some nanostructures, ferroelectric crystals, materials and composites and other materials with specific properties. In this book are presented nanotechnology approaches, modern piezoelectric techniques, physical and mechanical studies of the structure-sensitive properties of the materials. A wide spectrum of mathematical and numerical methods is applied to the solution of different technological, mechanical and physical problems for applications. Great attention is devoted to novel devices with high accuracy, longevity and extended possibilities to work in a large scale of temperatures and pressure ranges, aggressive media, etc. The characteristics of materials and composites with improved properties is shown, and new possibilities in studying of various physico-mechanical processes and phenomena are demonstrated.

This is a concise introduction into optical fiber communication. It covers important aspects from the physics of optical wave propagation and amplification to the essentials of modulation formats and receivers. The combination of a solid coverage of necessary fundamental theory with an in-depth discussion of recent relevant research results enables the reader to design modern optical fiber communication systems. The book serves both graduate students and professionals. It includes many worked examples with solutions for lecturers. For the second edition, Reinhold Noe made many changes and additions throughout the text so that this concise book presents the essentials of optical fiber communication in an easy readable and understandable way.

MEMS Vibratory Gyroscopes provides a solid foundation in the theory and fundamental operational principles of micromachined vibratory rate gyroscopes, and introduces structural designs that provide inherent robustness against structural and environmental variations. In the first part, the dynamics of the vibratory gyroscope sensing element is developed, common micro-fabrication processes and methods commonly used in inertial sensor production are summarized, design of mechanical structures for both linear and torsional gyroscopes are presented, and electrical actuation and detection methods are discussed along with details on experimental characterization of MEMS gyroscopes. In the second part, design concepts that improve robustness of the micromachined sensing element are introduced, supported by constructive computational examples and experimental results illustrating the material.

Circuit simulation is widely used for the design of circuits, both discrete and integrated. Device modeling is an impor tant aspect of circuit simulation since it is the link between the physical device and the sim ulate d device. Curren tly available circuit simulation programs provide a variety of built-in models. Many circuit designers use these built-in models whereas some incorporate new models in the circuit sim ulation programs. Understanding device modeling with particular emphasis on circuit simulation will be helpful in utilizing the built-in models more efficiently as well as in implementing new models. SPICE is used as a vehicle since it is the most widely used circuit sim ulation program. How ever, some issues are addressed which are not directly appli cable to SPICE but are applicable to circuit simulation in general. These discussions are useful for modifying SPICE and for understanding other simulation programs. The gen eric version 2G. 6 is used as a reference for SPICE, although numerous different versions exist with different modifications. This book describes field effect transistor models commonly used in a variety of circuit sim ulation pro grams. Understanding of the basic device physics and some familiarity with device modeling is assumed. Derivation of the model equations is not included. ( SPICE is a circuit sim ulation program available from EECS Industrial Support Office, 461 Cory Hall, University of Cali fornia, Berkeley, CA 94720. ) Acknowledgements I wish to express my gratitude to Valid Logic Systems, Inc."

-Shear-Induced Transitions and Instabilities in Surfactant Wormlike Micelles By S. Lerouge, J.-F. Berret -Laser-Interferometric Creep Rate Spectroscopy of Polymers By V. A. Bershtein, P. N. Yakushev -Polymer Nanocomposites for Electro-Optics: Perspectives on Processing Technologies, Material Characterization, and Future Application K. Matras-Postolek, D. Bogdal

PART I: sets the stage, provides context, reviews some of the prerequisite topics and gives a taste of what is to come in the rest of the book. Included are two refresher-type chapters on digital circuits and components, a discussion of types of computer systems, an overview of digital computer technology, and a detailed perspective on computer system 3erformance. PART II:lays out the user's interface to computer hardware known as the instruction-set architechture (ISA). For better understanding, the instruction set of MiniMIPS (a simplified, yet very realistic, machine for which open reference material and simulation tools exist) is described. Included is a chapter on variations in ISA (e.g. RISC vs CISC) and associated cost performace tradeoffs. The next two parts cover the central processing unit (CPU). PART III: describes the structure of arithmetic/logic units (ALUs) in some detail. Included are discussions of fixed- and floating-point number representations, design of high-speed adders, shift and logical operations, and hardware multipliers/dividers. Implementation aspects and pitfalls of floating-point arthimetic are also discussed. PART IV: is devoted to data path and control circuits comprising the CPU. Beginning with instruction execution steps, the needed components and control mechanisms are derived. These are followed by an exposition of control design strategies, use of a pipelined data path for performance enhancement, and various limitations of pipelining due to data and control dependencies. PART V: concerned with the memory system. The technologies in use for primary and secondary memories are described, along with their strengths and limitations. It is shown how the use of cache memories effectively bridges the speed gap between CPU and main memory. Similarly, the use of virtual memory to provide the illusion of a vast main memory is explained. PART VI: deals with input/output and interfacing topics. A discussion of I/O device technologies is followed by methods of I/O programming and the roles of buses and links (including standards) in I/O communication and interfacing. Elements of processes and context switching, for exception handling or multireaded computation, are also covered. PART VII: introduces advanced architectures. An overview of performance enhancement strategies, beyond simple pipelining, is presented and examples of applications requiring higher performance are cited. These are followed by design strategies and example architectures based on vector or array proccessing, multiprocessing, and multicomputing.

This volume provides a complete understanding of the fundamental causes of routing congestion in present-day and next-generation VLSI circuits, offers techniques for estimating and relieving congestion, and provides a critical analysis of the accuracy and effectiveness of these techniques. The book includes metrics and optimization techniques for routing congestion at various stages of the VLSI design flow. The subjects covered include an explanation of why the problem of congestion is important and how it will trend, plus definitions of metrics that are appropriate for measuring congestion, and descriptions of techniques for estimating and optimizing routing congestion issues in cell-/library-based VLSI circuits.

Nanoimprint Lithography: An enabling process for nanofabrication presents a comprehensive description of nanotechnology that is one of the most promising low-cost, high-throughput technologies for manufacturing nanostructures, and an emerging lithography candidates for 22, 16 and 11 nm nodes. It provides the exciting, multidisciplinary field, offering a wide range of topics covering: principles, process, material and application. This book would be of specific interest for researchers and graduate students in the field of nanoscience, nanotechnology and nanofabrication, material, physical, chemical, electric engineering and biology. Dr. Weimin Zhou is an associate professor at Shanghai Nanotechnology Promotion Center, China.

This book gives an introduction to nanostructured materials and guides the reader through their different engineering applications. It addresses the special phenomena and potentials involved in the applications without going into too much scientific detail of the physics and chemistry involved, which makes the reading interesting for beginners in the field. Materials for different applications in engineering are described, such as those used in opto-electronics, energy, tribology, bio-applications, catalysis, reinforcement and many more. In each application chapter, the reader will learn about the phenomena involved in the application, the nanostructured materials used in the field and their processing, besides finding some practical examples of their use in laboratories and in industry.The clear language and the application-oriented perspective of the book makes it suitable for both engineers and students who want to learn about applications of nanostructured materials in Engineering.

While dealing with the design and operation of ion sources, this book additionally discusses the physics of ion formation of the various elements with different charge states and charge neutralization. Ion selection and beam diagnostics are equally included, and the presentation of the necessary equations and diagrams for the various parameters makes this a useful handbook for ion sources.

This book is concerned with polymeric hydrogels, which are considered as one of the most promising types of new polymer-based materials. Each chapter in this book describes a selected class of polymeric hydrogels, such as superabsorbent hybrid nanohydrogels, conducting polymer hydrogels, polysaccharide-based or protein-based hydrogels, or gels based on synthetic polymers. In this way, the book also addresses some of the fascinating properties and applications of polymeric hydrogels: they are three-dimensional, hydrophilic, polymeric networks that can absorb, swell and retain large quantities of water or aqueous fluids. In combination with metal nanoparticles, nanofibrils or nanowhiskers, which may be embedded in the gels, they find widespread applications, ranging from agriculture, and waste water treatment, over electronics, to pharmaceutical and biomedical applications. Applications mentioned in this book include electro sensors, capacitors, electromechanical actuators, and even artificial muscles.

Covers the statistical analysis and optimization issues arising due to increased process variations in current technologies.

Comprises a valuable reference for statistical analysis and optimization techniques in current and future VLSI design for CAD-Tool developers and for researchers interested in starting work in this very active area of research.

Written by author who lead much research in this area who provide novel ideas and approaches to handle the addressed issues

We have reached the double conclusion: that invention is choice, that this choice is imperatively governed by the sense of scientific beauty. Hadamard (1945), Princeton University Press, by permission. The great majority of all sources and amplifiers of microwave energy, and all devices for receiving or detecting microwaves, use a semiconductor active element. The development of microwave semiconductor devices, de scribed in this book, has proceeded from the simpler, two-terminal, devices such as GUNN or IMPATT devices, which originated in the 1960s, to the sophisticated monolithic circuit MESFET three-terminal active elements, of the 1980s and 1990s. The microwave field has experienced a renais sance in electrical engineering departments in the last few years, and much of this growth has been associated with microwave semiconductor devices. The University of Massachusetts has recently developed a well recognized program in microwave engineering. Much of the momentum for this pro gram has been provided by interaction with industrial companies, and the influx of a large number of industry-supported students. This program had a need for a course in microwave semiconductor devices, which covered the physical aspects, as well as the aspects of interest to the engineer who incorporates such devices in his designs. It was also felt that it would be im portant to introduce the most recently developed devices (HFETs, HBTs, and other advanced devices) as early as possible."

Traditionally, Computer Aided Design (CAD) tools have been used to create the nominal design of an integrated circuit (IC), such that the circuit nominal response meets the desired performance specifications. In reality, however, due to the disturbances ofthe IC manufacturing process, the actual performancesof the mass produced chips are different than those for the nominal design. Even if the manufacturing process were tightly controlled, so that there were little variations across the chips manufactured, the environmentalchanges (e. g. those oftemperature, supply voltages, etc. ) would alsomakethe circuit performances vary during the circuit life span. Process-related performance variations may lead to low manufacturing yield, and unacceptable product quality. For these reasons, statistical circuit design techniques are required to design the circuit parameters, taking the statistical process variations into account. This book deals with some theoretical and practical aspects of IC statistical design, and emphasizes how they differ from those for discrete circuits. It de scribes a spectrum of different statistical design problems, such as parametric yield optimization, generalized on-target design, variability minimization, per formance tunning, and worst-case design. The main emphasis of the presen tation is placed on the principles and practical solutions for performance vari ability minimization. It is hoped that the book may serve as an introductory reference material for various groups of IC designers, and the methodologies described will help them enhance the circuit quality and manufacturability. The book containsseven chapters."

This book covers the theoretical background, experimental methods and implementation details to engineer for communication and imaging application, terahertz devices using metamaterials, in mainstream semiconductor foundry processes. This book will provide engineers and physicists an authoritative reference to construct such devices with minimal background. The authors describe the design and construction of electromagnetic (EM) devices for terahertz frequencies (108-1010 cycles/sec) using artificial materials that are a fraction of the wavelength of the incident EM wave, resulting in an effective electric and magnetic properties (permittivity and permeability) that are unavailable in natural materials.

Recent years have seen silicon integrated circuits enter into an increasing number of technical and consumer applications, until they now affect everyday life, as well as technical areas. Polycrystalline silicon has been an important component of silicon technology for nearly two decades, being used first in MOS integrated circuits and now becoming pervasive in bipolar circuits, as well. During this time a great deal of informa tion has been published about polysilicon. A wide range of deposition conditions has been used to form films exhibiting markedly different properties. Seemingly contradictory results can often be explained by considering the details of the structure formed. This monograph is an attempt to synthesize much of the available knowledge about polysilicon. It represents an effort to interrelate the deposition, properties, and applications of polysilicon so that it can be used most effectively to enhance device and integrated-circuit perfor mance. As device performance improves, however, some of the proper ties of polysilicon are beginning to restrict the overall performance of integrated circuits, and the basic limitations of the properties of polysili con also need to be better understood to minimize potential degradation of circuit behavior."

The Physical Electronics Department of SRI International (formerly Stanford Research Institute) has been pioneering the development of devices fabricated to submicron tolerances for well over 20 years. In 1961, a landmark paper on electron-beam lithography and its associated technologies was published by K. R. Shoulderst (then at SRI), which set the stage for our subsequent efforts in this field. He had the foresight to believe that the building of such small devices was actually within the range of human capabilities. As a result of this initial momentum, our experience in the technologies associated with microfabrication has become remarkably comprehensive, despite the relatively small size of our research activity. We have frequently been asked to deliver seminars or provide reviews on various aspects of micro fabrication. These activities made us aware of the need for a comprehensive overview of the physics of microfabrication. We hope that this book will fill that need."