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Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > General
This book first provides a comprehensive coverage of state-of-the-art validation solutions based on real-time signal tracing to guarantee the correctness of VLSI circuits. The authors discuss several key challenges in post-silicon validation and provide automated solutions that are systematic and cost-effective. A series of automatic tracing solutions and innovative design for debug (DfD) techniques are described, including techniques for trace signal selection for enhancing visibility of functional errors, a multiplexed signal tracing strategy for improving functional error detection, a tracing solution for debugging electrical errors, an interconnection fabric for increasing data bandwidth and supporting multi-core debug, an interconnection fabric design and optimization technique to increase transfer flexibility and a DfD design and associated tracing solution for improving debug efficiency and expanding tracing window. The solutions presented in this book improve the validation quality of VLSI circuits, and ultimately enable the design and fabrication of reliable electronic devices.
Metamaterials are artificially designed materials engineered to acquire their properties by their specific structure rather than their composition. They are considered a major scientific breakthrough and have attracted enormous attention over the past decade. The major challenge in obtaining an optical metamaterial active at visible frequencies is the fabrication of complex continuous metallic structures with nano metric features. This thesis presents the fabrication and characterization of optical metamaterials made by block copolymer self assembly. This approach allows fabrication of an intriguing and complex continuous 3D architecture called a gyroid, which is replicated into active plasmonic materials such as gold. The optical properties endowed by this particular gyroid geometry include reduction of plasma frequency, extraordinarily enhanced optical transmission, and a predicted negative refractive index. To date, this is the 3D optical metamaterial with the smallest features ever made.
examples are presented. These chapters are intended to introduce the reader to the programs. The program structure and models used will be described only briefly. Since these programs are in the public domain (with the exception of the parasitic simulation programs), the reader is referred to the manuals for more details. In this second edition, the process program SUPREM III has been added to Chapter 2. The device simulation program PISCES has replaced the program SIFCOD in Chapter 3. A three-dimensional parasitics simulator FCAP3 has been added to Chapter 4. It is clear that these programs or other programs with similar capabilities will be indispensible for VLSI/ULSI device developments. Part B of the book presents case studies, where the application of simu lation tools to solve VLSI device design problems is described in detail. The physics of the problems are illustrated with the aid of numerical simulations. Solutions to these problems are presented. Issues in state-of-the-art device development such as drain-induced barrier lowering, trench isolation, hot elec tron effects, device scaling and interconnect parasitics are discussed. In this second edition, two new chapters are added. Chapter 6 presents the methodol ogy and significance of benchmarking simulation programs, in this case the SUPREM III program. Chapter 13 describes a systematic approach to investi gate the sensitivity of device characteristics to process variations, as well as the trade-otIs between different device designs."
Particle simulation of semiconductor devices is a rather new field which has started to catch the interest of the world's scientific community. It represents a time-continuous solution of Boltzmann's transport equation, or its quantum mechanical equivalent, and the field equation, without encountering the usual numerical problems associated with the direct solution. The technique is based on first physical principles by following in detail the transport histories of indi vidual particles and gives a profound insight into the physics of semiconductor devices. The method can be applied to devices of any geometrical complexity and material composition. It yields an accurate description of the device, which is not limited by the assumptions made behind the alternative drift diffusion and hydrodynamic models, which represent approximate solutions to the transport equation. While the development of the particle modelling technique has been hampered in the past by the cost of computer time, today this should not be held against using a method which gives a profound physical insight into individual devices and can be used to predict the properties of devices not yet manufactured. Employed in this way it can save the developer much time and large sums of money, both important considerations for the laboratory which wants to keep abreast of the field of device research. Applying it to al ready existing electronic components may lead to novel ideas for their improvement. The Monte Carlo particle simulation technique is applicable to microelectronic components of any arbitrary shape and complexity.
Monte Carlo simulation is now a well established method for studying semiconductor devices and is particularly well suited to highlighting physical mechanisms and exploring material properties. Not surprisingly, the more completely the material properties are built into the simulation, up to and including the use of a full band structure, the more powerful is the method. Indeed, it is now becoming increasingly clear that phenomena such as reliabil ity related hot-electron effects in MOSFETs cannot be understood satisfac torily without using full band Monte Carlo. The IBM simulator DAMOCLES, therefore, represents a landmark of great significance. DAMOCLES sums up the total of Monte Carlo device modeling experience of the past, and reaches with its capabilities and opportunities into the distant future. This book, therefore, begins with a description of the IBM simulator. The second chapter gives an advanced introduction to the physical basis for Monte Carlo simulations and an outlook on why complex effects such as collisional broadening and intracollisional field effects can be important and how they can be included in the simulations. References to more basic intro the book. The third chapter ductory material can be found throughout describes a typical relationship of Monte Carlo simulations to experimental data and indicates a major difficulty, the vast number of deformation poten tials required to simulate transport throughout the entire Brillouin zone. The fourth chapter addresses possible further extensions of the Monte Carlo approach and subtleties of the electron-electron interaction."
The present book provides recent developments in various in vivo imaging and sensing techniques such as photo acoustics (PA) imaging and microscopy, ultrasound-PA combined modalities, optical coherence tomography (OCT) and micro OCT, Raman and surface enhanced Raman scattering (SERS), Fluorescence lifetime imaging (FLI) techniques and nanoparticle enabled endoscopy etc. There is also a contributing chapter from leading medical instrumentation company on their view of optical imaging techniques in clinical laparoscopic surgery. The UN proclaimed 2015 as the International Year of Light and Light-based Technologies, emphasizing achievements in the optical sciences and their importance to human beings. In this context, this book focusses on the recent advances in biophotonics techniques primarily focused towards translational medicine contributed by thought leaders who have made cutting edge developments in various photonics techniques.
Microcantilevers for Atomic Force Microscope Data Storage describes a research collaboration between IBM Almaden and Stanford University in which a new mass data storage technology was evaluated. This technology is based on the use of heated cantilevers to form submicron indentations on a polycarbonate surface, and piezoresistive cantilevers to read those indentations. Microcantilevers for Atomic Force Microscope Data Storage describes how silicon micromachined cantilevers can be used for high-density topographic data storage on a simple substrate such as polycarbonate. The cantilevers can be made to incorporate resistive heaters (for thermal writing) or piezoresistive deflection sensors (for data readback). The primary audience for Microcantilevers for Atomic Force Microscope Data Storage is industrial and academic workers in the microelectromechanical systems (MEMS) area. It will also be of interest to researchers in the data storage industry who are investigating future storage technologies.
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is the work of the European network ELFNET which was founded by the European Commission in the 6th Framework Programme. It brings together contributions from the leading European experts in lead-free soldering. The limited validity of testing methods originating from tin-lead solder was a major point of concern in ELFNET members' discussions. As a result, the network's reliability group decided to bring together the material properties of lead-free solders, as well as the basics of material science, and to discuss their influence on the procedures for accelerated testing. This has led to a matrix of failure mechanisms and their activation and, as a result, to a comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints. The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is written for scientists, engineers and researchers involved with lead-free electronics.
The goal of this book is to bring together into one accessible text the fundamentals of the many disciplines needed by today's engineer working in the field of microelectromechanical systems (MEMS). The subject matter is wide-ranging: microfabrication, mechanics, heat flow, electronics, noise, and dynamics of systems, with and without feedback. Because it is very difficult to enunciate principles of good design' in the abstract, the book is organized around a set of Case Studies that are based on real products, or, where appropriately well-documented products could not be found, on thoroughly published prototype work. The Case Studies were selected to sample a multidimensional space: different manufacturing and fabrication methods, different device applications, and different physical effects used for transduction. The Case Study subjects are: the design and packaging of a piezoresistive pressure sensor, a capacitively-sensed accelerometer, a quartz piezoelectrically-driven and sensed rate gyroscope, two electrostatically-actuated optical projection displays, two microsystems for the amplification of DNA, and a catalytic sensor for combustible gases. This book is used for a graduate course in Design and Fabrication of Microelectromechanical Devices (MEMS)' at the Massachusetts Institute of Technology. It is appropriate for textbook use by senior/graduate courses in MEMS, and will be a useful reference for the active MEMS professional. Each chapter is supplemented with homework problems and suggested related reading. In addition, the book is supported by a web site that will include additional homework exercises, suggested design problems and related teaching materials, and software usedin the textbook examples and homework problems.
Arranged in a format that follows the industry-common ASIC physical design flow, Physical Design Essentials begins with general concepts of an ASIC library, then examines floorplanning, placement, routing, verification, and finally, testing. Among the topics covered are Basic standard cell design, transistor-sizing, and layout styles; Linear, non-linear, and polynomial characterization; Physical design constraints and floorplanning styles; Algorithms used for placement; Clock Tree Synthesis; Parasitic extraction; Electronic Testing, and many more.
Laser diodes represent a key element in the emerging field of opto electronics which includes, for example, optical communication, optical sensors or optical disc systems. For all these applications, information is either transmitted, stored or read out. The performance of these systems depends to a great deal on the performance of the laser diode with regard to its modulation and noise characteristics. Since the modulation and noise characteristics of laser diodes are of vital importance for optoelectronic systems, the need for a book arises that concentrates on this subject. This book thus closes the gap between books on the device physics of semiconductor lasers and books on system design. Complementary to the specific topics concerning modulation and noise, the first part of this book reviews the basic laser characteristics, so that even a reader without detailed knowledge of laser diodes may follow the text. In order to understand the book, the reader should have a basic knowledge of electronics, semiconductor physics and optical communica tions. The work is primarily written for the engineer or scientist working in the field of optoelectronics; however, since the book is self-contained and since it contains a lot of numerical examples, it may serve as a textbook for graduate students. In the field of laser diode modulation and noise a vast amount has been published during recent years. Even though the book contains more than 600 references, only a small part of the existing literature is included."
The key element of any fluorescence sensing or imaging technology is the fluorescence reporter, which transforms the information on molecular interactions and dynamics into measurable signals of fluorescence emission. This book, written by a team of frontline researchers, demonstrates the broad field of applications of fluorescence reporters, starting from nanoscopic properties of materials, such as self-assembled thin films, polymers and ionic liquids, through biological macromolecules and further to living cell, tissue and body imaging. Basic information on obtaining and interpreting experimental data is presented and recent progress in these practically important areas is highlighted. The book is addressed to a broad interdisciplinary audience.
The Problem of the Unknown Component: Theory and Applications addresses the issue of designing a component that, combined with a known part of a system, conforms to an overall specification. The authors tackle this problem by solving abstract equations over a language. The most general solutions are studied when both synchronous and parallel composition operators are used. The abstract equations are specialized to languages associated with important classes of automata used for modeling systems. The book is a blend of theory and practice, which includes a description of a software package with applications to sequential synthesis of finite state machines. Specific topologies interconnecting the components, exact and heuristic techniques, and optimization scenarios are studied. Finally the scope is enlarged to domains like testing, supervisory control, game theory and synthesis for special omega languages. The authors present original results of the authors along with an overview of existing ones.
Dear Readers, Since the ground-breaking, Nobel-prize crowned work of Heeger, MacDiarmid, and Shirakawa on molecularly doped polymers and polymers with an alternating bonding structure at the end of the 1970s, the academic and industrial research on hydrocarbon-based semiconducting materials and devices has made encouraging progress. The strengths of semiconducting polymers are currently mainly unfolding in cheap and easily assembled thin ?lm transistors, light emitting diodes, and organic solar cells. The use of so-called "plastic chips" ranges from lightweight, portable devices over large-area applications to gadgets demanding a degree of mechanical ?exibility, which would overstress conventionaldevices based on inorganic,perfect crystals. The ?eld of organic electronics has evolved quite dynamically during the last few years; thus consumer electronics based on molecular semiconductors has gained suf?cient market attractiveness to be launched by the major manufacturers in the recent past. Nonetheless, the numerous challenges related to organic device physics and the physics of ordered and disordered molecular solids are still the subjects of a cont- uing lively debate. The future of organic microelectronics will unavoidably lead to new devi- physical insights and hence to novel compounds and device architectures of - hanced complexity. Thus, the early evolution of predictive models and precise, computationally effective simulation tools for computer-aided analysis and design of promising device prototypes will be of crucial importance.
Gettering Defects in Semiconductors fulfills three basic purposes: - to systematize the experience and research in exploiting various gettering techniques in microelectronics and nanoelectronics; - to identify new directions in research, particularly to enhance the perspective of professionals and young researchers and specialists; - to fill a gap in the contemporary literature on the underlying semiconductor-material theory. The authors address not only well-established gettering techniques but also describe contemporary trends in gettering technologies from an international perspective. The types and properties of structural defects in semiconductors, their generating and their transforming mechanisms during fabrication are described. The primary emphasis is placed on classifying and describing specific gettering techniques, their specificity arising from both their position in a general technological process and the regimes of their application. This book addresses both engineers and material scientists interested in semiconducting materials theory and also undergraduate and graduate students in solid-state microelectronics and nanoelectronics. A comprehensive list of references provides readers with direction for further reading.
This monograph is the first roadmap for transparent electronics. It defines and assesses what and where the field is, where it is going, and what needs to happen to get it there. Although the central focus of this monograph involves transparent electronics, many of the materials, devices, circuits, and process integration strategies discussed will be of great interest to researchers working in other emerging fields, including printed electronics, large-area electronics, low-cost electronics, and disposable electronics.
A recent technological advance is the art of designing circuits to test themselves, referred to as a Built-In Self-Test. This book is written from a designer's perspective and describes the major BIST approaches that have been proposed and implemented, along with their advantages and limitations.
The IGBT Device: Physics, Design and Applications of the Insulated Gate Bipolar Transistor, Second Edition provides the essential information needed by applications engineers to design new products using the device in sectors including consumer, industrial, lighting, transportation, medical and renewable energy. The IGBT device has proven to be a highly important Power Semiconductor, providing the basis for adjustable speed motor drives (used in air conditioning and refrigeration and railway locomotives), electronic ignition systems for gasoline powered motor vehicles and energy-saving compact fluorescent light bulbs. The book presents recent applications in plasma displays (flat-screen TVs) and electric power transmission systems, alternative energy systems and energy storage, but it is also used in all renewable energy generation systems, including solar and wind power. This book is the first available on the applications of the IGBT. It will unlock IGBT for a new generation of engineering applications, making it essential reading for a wide audience of electrical and design engineers, as well as an important publication for semiconductor specialists.
Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity. MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond. MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area.
Throughout the 1980s and 1990s, the theory and practice of testing electronic products has changed considerably. Quality and testing have become inextricably linked and both are fundamental to the generation of revenue to a company, helping the company to remain profitable and therefore survive. Testing plays an important role in assessing the quality of a product. The tester acts as a filter, separating good products from bad. Unfortunately, the tester can pass bad products and fail good products, and the generation of high quality tests has become complex and time consuming. To achieve significant reduction in time and cost of testing, the role and responsibility of testing has to be considered across an entire organization and product development process. Testability Concepts for Digital ICs: The Macro Test Approach considers testability aspects for digital ICs. The strategy taken is to integrate the testability aspects into the design and manufacturing of ICs and, for each IC design project, to give a precise definition of the boundary conditions, responsibilities, interfaces and communications between persons, and quality targets. Macro Test, a design-for-Testability approach, provides a manageable test program route. Using the Macro Test approach, one can explore alternative solutions to satisfy pre-defined levels of performance (e.g. defect detection, defect location, test application) within a pre-defined cost budget and time scale. Testability Concepts for Digital ICs is the first book to present a tried and proven method of using a Macro approach to testing complex ICs and is of particular interest to all test engineers, IC designers and managers concerned with producing highquality ICs.
In response to new developments in the field, practical teaching experience, and readers' suggestions, the authors of the warmly received Reliablity Evaluation of Engineering Systems have updated and extended the work-providing extended coverage of fault trees and a more complete examination of probability distribution, among other things-without disturbing the original's concept, structure, or style.
This book covers broad aspects of the chemistry of -stacked polymers and low-molecular-weight molecules, from synthesis through theory. It is intended for graduate students and researchers in academia and industry and consists of chapters written by renowned scientists who have made significant contributions to this field in the past decade. -Stacked polymers and low-molecular-weight molecules are expected to replace main-chain conjugated polymers such as polyacetylenes and polythiophenes as organic conducting and energy-transferring substances that are important as materials for photo-electronic applications. -Stacked polymers and molecules have significant advantages over main-chain conjugated polymers, i.e., high solubility in solvents, large freedom in molecular design, and colorless nature.
Tutorial lectures given by world-renowned researchers have become one of the important traditions of the Nano and Giga Challenges (NGC) conference series. 1 Soon after preparations had begun for the rst forum, NGC2002, in Moscow, Russia, the organizers realized that publication of the lectures notes would be a va- able legacy of the meeting and a signi cant educational resource and knowledge base for students, young researchers, and senior experts. Our rst book was p- lished by Elsevier and received the same title as the meeting itself-Nano and Giga 2 Challenges in Microelectronics. Our second book, Nanotechnology for Electronic 3 4 Materials and Devices, based on the tutorial lectures at NGC2004 in Krakow, 5 Poland, the third book from NGC2007 in Phoenix, Arizona, and the current book 6 from joint NGC2009 and CSTC2009 meeting in Hamilton, Ontario, have been published in Springer's Nanostructure Science and Technology series. Hosted by McMaster University, the meeting NGC/CSTC 2009 was held as a joint event of two conference series, Nano and Giga Challenges (Nano & Giga Forum) and Canadian Semiconductor Technology Conferences (CSTC), bringing together the networks and expertise of both professional forums. Informational (electronics and photonics), renewable energy (solar systems, fuel cells, and batteries), and sensor (nano and bio) technologies have reached a new stage in their development in terms of engineering limits to cost-effective impro- ment of current technological approaches. The latest miniaturization of electronic devices is approaching atomic dimensions.
The first textbook to provide in-depth treatment of electroceramics with emphasis on applications in microelectronics, magneto-electronics, spintronics, energy storage and harvesting, sensors and detectors, magnetics, and in electro-optics and acousto-optics Electroceramics is a class of ceramic materials used primarily for their electrical properties. This book covers the important topics relevant to this growing field and places great emphasis on devices and applications. It provides sufficient background in theory and mathematics so that readers can gain insight into phenomena that are unique to electroceramics. Each chapter has its own brief introduction with an explanation of how the said content impacts technology. Multiple examples are provided to reinforce the content as well as numerous end-of-chapter problems for students to solve and learn. The book also includes suggestions for advanced study and key words relevant to each chapter. Fundamentals of Electroceramics: Materials, Devices and Applications offers eleven chapters covering: 1.Nature and types of solid materials; 2. Processing of Materials; 3. Methods for Materials Characterization; 4. Binding Forces in Solids and Essential Elements of Crystallography; 5. Dominant Forces and Effects in Electroceramics; 6. Coupled Nonlinear Effects in Electroceramics; 7. Elements of Semiconductor; 8. Electroceramic Semiconductor Devices; 9. Electroceramics and Green Energy; 10.Electroceramic Magnetics; and 11. Electro-optics and Acousto-optics. Provides an in-depth treatment of electroceramics with the emphasis on fundamental theoretical concepts, devices, and applications with focus on non-linear dielectrics Emphasizes applications in microelectronics, magneto-electronics, spintronics, energy storage and harvesting, sensors and detectors, magnetics and in electro-optics and acousto-optics Introductory textbook for students to learn and make an impact on technology Motivates students to get interested in research on various aspects of electroceramics at undergraduate and graduate levels leading to a challenging career path. Includes examples and problem questions within every chapter that prepare students well for independent thinking and learning. Fundamentals of Electroceramics: Materials, Devices and Applications is an invaluable academic textbook that will benefit all students, professors, researchers, scientists, engineers, and teachers of ceramic engineering, electrical engineering, applied physics, materials science, and engineering.
This thesis offers a thorough and informative study of high-power, high-energy optical parametric chirped pulse amplifications systems, the foundation of the next generation of femtosecond laser technology. Starting from the basics of the linear processes involved and the essential design considerations, the author clearly and systematically describes the various prerequisites of the nonlinear optical systems expected to drive attosecond physics in the coming decade. In this context, he gives an overview of methods for generating the broadband and carrier-envelope-phase stable seed pulses necessary for producing controlled electric-field waveforms in the final system; provides a guide to handling the high-power, high-energy pump lasers required to boost the pulse energy to the desired operating range; describes the design of the nonlinear optical system used to perform the amplification, including modes of operation for ultra-broadband infrared-visible pulses or narrowband (yet still ultrafast) pulses tunable over multiple octaves; and finally presents a prospective high-energy field synthesizer based upon these techniques. As such, this work is essential reading for all scientists interested in utilizing the newest generation of ultrafast systems. |
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