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Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > General
In the last few decades the effect of lead contamination on human health has received significant attention. Based on such concerns elimination of lead from ceramic glaze, paint, plumbing etc. has been legislated and implemented. However, till recently, solders used in electronics, remained lead-based. The worldwide multi-faceted research efforts to arrive at suitable solutions, especially as the deadline for implementation of lead-free electronic solders approaches, have resulted in an exhaustive number of research papers in several reviewed scientific journals. Similarly there have been presentations in several national and international meetings of various technical societies. It is impossible for any researcher or student to be aware of all the materials that have been, and are being, published in these many different sources, so it becomes essential to have most of the relevant and currently available information presented in a single publication. electronic solder area were identified, and researchers recognized for their significant scientific contributions in those areas were invited to write articles on those topics. They were asked to address the importance of a given issue, the current status of understanding and available solutions, the problems that still need to be tackled and suggestions for potential approaches to do so. The chapters are organized around the following subject areas: thermodynamics and phase diagrams, solder developments, processing issues, mechanical property considerations, effects of thermal excursions (TMF), electromigraion, whisker growth, tin pest, and industrial perspectives (consumer electronics, and high-end high reliability applications). This material originally appeared in a special issue of Journal of Materials Science: Materials in Electronics. for academic researchers in fields other than Materials Science and those in industry, and to provide wider awareness of the current status of lead-free electronic solders to those persons active in the area but who are not regular readers of the Journal, these articles are being reprinted in book form.
5. 2. Distinction between thick- and thin-film devices . . . . . . . . . . . . . . . . . . . . 109 5. 3. I-V Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112 5. 3. 1. Threshold voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2 5. 3 . 2. Body effecL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 8 5. 3. 3. Short-channel effects . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 5. 3. 4. Output characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 24 5. 4. Transconductance and mobility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129 5. 4. 1 Transconductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129 5. 4. 2. Mobility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130 5. 5. Subthreshold slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132 5. 6. Impact ionization and high-field effects . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 9 5. 6. 1. Kink effecL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 39 5. 6. 2. Hot-electron degradation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143 5. 7. Parasitic bipolar effects . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145 5. 7. 1. Anomalous subthreshold slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 45 5. 7. 2. Reduced drain breakdown voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 7 5. 8. Accumulation-mode p-channel MOSFET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 9 CHAPTER 6 - Other SOl Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 5 9 6. 1. Non-conventional devices adapted from bulk . . . . . . . . . . . . . . . . . . . . . . . . . . . 159 6. 1. 1. COMFET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160 6. 1. 2. High-voltage lateral MOSFET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 6 1 6. 1. 3. PIN photodiode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162 6. 1. 4. JFET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163 6. 2. Novel SOl devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164 6. 2. 1. Lubistor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164 6. 2. 2. Bipolar-MOS device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166 6. 2. 3. Double-gate MOSFET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 69 6. 2. 4. Bipolar transistors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172 6. 2. 5. Optical modulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 74 CHAPTER 7 - The sm MOSFET Operating in a Harsh Environment. . . . . . . . 1 77 7. 1. Radiation environment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 7 7 7. 1. 1. SEU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178 7. 1. 2. Total dose . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180 7. 1. 3. Dose-rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 8 4 7. 2. High-temperature operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 85 7. 2. 1. Leakage currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
This book addresses the development of electronic devices using redox-active organic molecules and their porous coordination networks (PCNs), and highlights the importance of the molecular arrangement. Redox-active organic molecules hold considerable promise as flexible electronic elements, because their electronic state can easily be controlled using external energy. Although various kinds of redox-active organic molecules have been synthesized, attempts to apply them to electronic devices have been limited, owing to the lack of proper structural design. Moreover, ligand-based redox-active PCNs remain largely unexplored because of the limited availability of redox-active ligands. In addition to developing new redox-active organic molecules, in order to design electronic devices based on these molecules/PCNs, it is essential to understand the connections between their molecular arrangement, electrical properties, and redox activity. In this thesis, the redox-active organic molecule 2,5,8-tri(4-pyridyl)1,3-diazaphenalene (TPDAP), which features a large pi plane and multi-intermolecular interactivity, is used to develop a resistive switching memory device. In addition, its PCNs are synthesized to fabricate chemiresistive sensors, and the electrical properties are modulated using post-synthetic modification. Each mechanism is systematically investigated by means of structural determination and well-defined control experiments. Subsequently, the book proposes general guidelines for designing electronic devices using redox-active organic molecules. The book will appeal to a broad range of readers, from basic scientists to materials engineers, as well as general, non-expert readers.
The Landolt-Bornstein subvolumes III/44A and III/44B update the existing 8 volumes III/41 about Semiconductors and contain new Data and Updates for I-VII, III-V, III-VI, IV, VI and II-VI Compounds. The text, tables figures and references are provided in self-contained document files, each one dedicated to a substance and property. The first subvolume III/44A contains a "Systematics of Semiconductor Properties," which should help the non-specialist user to understand the meaning of the material parameters. Hyperlinked lists of substances and properties lead directly to the documents and make the electronic version an easy-to-use source of semiconductor data. In the new updates III/44A and III/44B, links to existing material in III/41 or to related documents for a specific substance are also included.
This book brings together the many concepts and discoveries in liquid crystal colloids contributed over the last twenty years and scattered across numerous articles and book chapters. It provides both a historical overview of the development of the field and a clear perspective on the future applications in photonics. The book covers all phenomena observed in liquid crystal colloids with an emphasis on experimental tools and applications of topology in condensed matter, as well as practical micro-photonics applications. It includes a number of spectacular manifestations of new topological phenomena not found or difficult to observe in other systems. Starting from the early works on nematic colloids, it explains the basics of topological defects in ordered media, charge and winding, and the elastic forces between colloidal particles in nematics. Following a detailed description of experimental methods, such as optical tweezing and particle tracking, the book eases the reader into the theoretical part, which deals with elastic deformation of nematic liquid crystals due to inclusions and surface alignment. This is discussed in the context of basic mean field Landau-de Gennes Q-tensor theory, with a brief explanation of the free-energy minimization numerical methods. There then follows an excursion into the topology of complex nematic colloidal structures, colloidal entanglement, knotting and linking. Nematic droplets, shells, handlebodies and chiral topological structures are addressed in separate chapters. The book concludes with an extensive chapter on the photonic properties of nematic dispersions, presenting the concept of integrated soft matter photonics and discussing the concepts of nematic and chiral nematic microlasers, surface-sensitive photonic devices and smectic microfibers. The text is complemented by a large bibliography, explanatory sketches and beautiful micrographs.
Until the 1990s, the reduction of the minimum feature sizes used to fabricate in- grated circuits, called "scaling," has highlighted serious advantages as integration density, speed, power consumption, functionality and cost. Direct consequence was the decrease of cost-per-function, so the electronic productivity has largely progressed in this period. Another usually cited trend is the evolution of the in- gration density as expressed by the well-know Moore's Law in 1975: the number of devices per chip doubles every 2 years. This evolution has allowed improving signi?cantly the circuit complexity, offering a great computing power in the case of microprocessor, for example. However, since few years, signi?cant issues appeared such as the increase of the circuit heating, device complexity, variability and dif?culties to improve the integration density. These new trends generate an important growth in development and production costs. Though is it, since 40 years, the evolution of the microelectronics always f- lowed the Moore's law and each dif?culty has found a solution.
"Fundamentals of Nanoscaled Field Effect Transistors" gives comprehensive coverage of thefundamental physical principles and theory behind nanoscale transistors.The specific issues that arise for nanoscale MOSFETs, such as quantum mechanical tunneling and inversion layer quantization, are fully explored. The solutions to these issues, such as high- technology, strained-Si technology, alternate devices structures and graphene technology are also given. Some case studies regarding the above issues and solution are also given in the book.
This text focuses on techniques for minimizing power dissipation during test application at logic and register-transfer levels of abstraction of the VLSI design flow. It surveys existing techniques and presents several test automation techniques for reducing power in scan-based sequential circuits and BIST data paths.
This book collects all the latest advances in the leading research of the circularly polarized luminescence (CPL) of small organic molecules. Compared with that of lanthanide-based fluorophores, the research into the CPL of small organic molecules is still at the developmental stage for their relatively smaller dissymmetric factors, but has been a source of widespread attention recently. The book includes the state of the art of the discoveries in CPL organic molecules, such as helicenes, biaryls, cyclophanes, boron dipyrromethene dyes, and other chiral molecules, mostly in their isolated states, covering all possible chiral substances for future applications. This book also highlights the recent development of CPL instruments as well as time-resolved circular dichroism spectroscopy, to facilitate the further development and future design of CPL molecules.
The goal of putting systems on a chip' has been a difficult challenge that is only recently being met. Since the world is analog', putting systems on a chip requires putting analog interfaces on the same chip as digital processing functions. Since some processing functions are accomplished more efficiently in analog circuitry, chips with a large amount of analog and digital circuitry are being designed. Whether a small amount of analog circuitry is combined with varying amounts of digital circuitry or the other way around, the problem encountered in marrying analog and digital circuitry are the same but with different scope. Some of the most prevalent problems are chip/package capacitive and inductive coupling, ringing on the RLC tuned circuits that form the chip/package power supply rails and off-chip drivers and receivers, coupling between circuits through the chip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problems of designers who have to deal with the complexity of mixed-signal coupling there is a lack of verification techniques to simulate the problem. In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuit designers must also model coupling through the common substrate when simulating ICs to obtain an accurate estimate of coupled noise in their designs. Unfortunately, accurate simulation of substrate coupling has only recently begun to receive attention, and techniques for the same are not widely known. Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits addresses two major issues of the mixed-signal coupling problem -- how to simulate it and how to overcome it. It identifies some of the problems that will be encountered, gives examples of actual hardware experiences, offers simulation techniques, and suggests possible solutions. Readers of this book should come away with a clear directive to simulate their design for interactions prior to building the design, versus a build it and see' mentality.
Electronic structure and physical properties of strongly correlated materials containing elements with partially filled 3d, 4d, 4f and 5f electronic shells is analyzed by Dynamical Mean-Field Theory (DMFT). DMFT is the most universal and effective tool used for the theoretical investigation of electronic states with strong correlation effects. In the present book the basics of the method are given and its application to various material classes is shown. The book is aimed at a broad readership: theoretical physicists and experimentalists studying strongly correlated systems. It also serves as a handbook for students and all those who want to be acquainted with fast developing filed of condensed matter physics.
This book is mostly concerned on the experimental research of the
nonlinear optical characteristics of various media, low- and
high-order harmonic generation in different materials, and
formation, and nonlinear optical characterization of clusters. We
also demonstrate the inter-connection between these areas of
nonlinear optics.
This book provides a comprehensive overview of the main electrical technologies for process heating, which tend to be treated separately in specialized books. Individual chapters focus on heat transfer, electromagnetic fields in electro-technologies, arc furnaces, resistance furnaces, direct resistance heating, induction heating, and high-frequency and microwave heating. The author highlights those topics of greatest relevance to a wide-ranging teaching program, and at the same time offer a detailed review of the main applications of the various technologies. The content represents a synthesis of the extensive knowledge and experience that the author has accumulated while researching and teaching at the University of Padua's Engineering Faculty. This text on industrial electroheating technologies is a valuable resource not only for students of industrial, electrical, chemical, and material science engineering, but also for engineers, technicians and others involved in the application of electroheating and energy-efficient industrial processes.
This volume, which addresses various basic sensor principles, covers micro gravimetric sensors, semiconducting and nano tube sensors, calorimetric sensors and optical sensors. Furthermore, the authors discuss recent developments in the related sensitive layers including new properties of nano structured metal oxide layers. They provide in-depth insights into the unique chemistry and signal generation of copper oxide in percolating sensors and present a variety of applications of functional polymers made possible by proper imprinting. Highlights of the subjects covered include: requirements for high-temperature sensors carbon nano tube sensors new sensing model for nanostructured In2O3 bio mimetic approach for semiconductor sensor-based systems optical readout for inorganic and organic semiconductor sensors concept of virtual multisensors to improve specificity and selectivity calorimetric sensors for hydrogen peroxide detection percolation effect-based sensors to implement dosimeters imprinted polymer layers for bulk and surface acoustic wave sensors"
Lanthanides have fascinated scientists for more than two centuries now, and since efficient separation techniques were established roughly 50 years ago, they have increasingly found their way into industrial exploitation and our everyday lives. Numerous applications are based on their unique luminescent properties, which are highlighted in this volume. It presents established knowledge about the photophysical basics, relevant lanthanide probes or materials, and describes instrumentation-related aspects including chemical and physical sensors. The uses of lanthanides in bioanalysis and medicine are outlined, such as assays for in vitro diagnostics and research. All chapters were compiled by renowned scientists with a broad audience in mind, providing both beginners in the field and advanced researchers with comprehensive information on on the given subject. "
Systematic Analysis of Bipolar and MOS Transistors is a self-contained reference that walks you through the logical processes involved in transistor analysis. Linking device and circuit engineering, it shows you how to use device models intelligently, tailor existing models, and develop new ones.
This book discusses future trends and developments in electron device packaging and the opportunities of nano and bio techniques as future solutions. It describes theeffect of nano-sized particles and cell-based approaches for packaging solutions with their diverse requirements. It offers a comprehensive overview of nano particles and nano composites and theirapplication aspackaging functions in electron devices. The importance and challenges of three-dimensional design and computer modeling in nano packaging is discussed; alsoways for implementation are described. Solutions for unconventional packaging solutions for metallizations and functionalized surfaces as well as new packaging technologies with high potential for industrial applications are discussed. The book brings together a comprehensive overview of nano scale components and systems comprising electronic, mechanical and optical structures and serves as important reference for industrial and academic researchers."
This book focuses on basic fundamental and applied aspects of micro-LED, ranging from chip fabrication to transfer technology, panel integration, and various applications in fields ranging from optics to electronics to and biomedicine. The focus includes the most recent developments, including the uses in large large-area display, VR/AR display, and biomedical applications. The book is intended as a reference for advanced students and researchers with backgrounds in optoelectronics and display technology. Micro-LEDs are thin, light-emitting diodes, which have attracted considerable research interest in the last few years. They exhibit a set of exceptional properties and unique optical, electrical, and mechanical behaviors of fundamental interest, with the capability to support a range of important exciting applications that cannot be easily addressed with other technologies. The content is divided into two parts to make the book approachable to readers of various backgrounds and interests. The first provides a detailed description with fundamental materials and production approaches and assembly/manufacturing strategies designed to target readers who seek an understanding ofof essential materials and production approaches and assembly/manufacturing strategies designed to target readers who want to understand the foundational aspects. The second provides detailed, comprehensive coverage of the wide range of device applications that have been achieved. This second part targets readers who seek a detailed account of the various applications that are enabled by micro-LEDs.
Advances in Polymer Science enjoys a longstanding tradition and good reputation in its community. Each volume is dedicated to a current topic, and each review critically surveys one aspect of that topic, to place it within the context of the volume. The volumes typically summarize the significant developments of the last 5 to 10 years and discuss them critically, presenting selected examples, explaining and illustrating the important principles, and bringing together many important references of primary literature. On that basis, future research directions in the area can be discussed. Advances in Polymer Science volumes thus are important references for every polymer scientist, as well as for other scientists interested in polymer science - as an introduction to a neighboring field, or as a compilation of detailed information for the specialist.
This work provides a comprehensive overview of current InP HBT technology and its applications. Each chapter is written by a world-renowned expert on topics including crystal growth, processing, physics, modelling, and digital and analog circuits.
Call-by-push-value is a programming language paradigm that,
surprisingly, breaks down the call-by-value and call-by-name
paradigms into simple primitives. This monograph, written for
graduate students and researchers, exposes the call-by-push-value
structure underlying a remarkable range of semantics, including
operational semantics, domains, possible worlds, continuations and
games.
Xiao-Ming Jiang, Sheng-Ping Guo, Hui-Yi Zeng, Ming-Jian Zhang, Guo-Cong Guo: Large Crystal Growth and New Crystal Exploration of Mid-Infrared Second-Order Nonlinear Optical Materials.- Kechen Wu: Simulation and Design of Infrared Second-Order Nonlinear Optical Materials in Metal Cluster Compounds.- Chaoyang Tu: The Recent Development Of SRS and SRS SF- conversion Laser Crystal.- Hua-Jun Zhao, Xin-Tao Wu, Li-Ming Wu: Exploration of New Second-Order Nonlinear Optical Compounds Containing Main Group Elements.
Polymers in Electronics: Optoelectronic Properties, Design, Fabrication, and Applications brings together the fundamentals and latest advances in polymeric materials for electronic device applications, supporting researchers, scientists and advanced students, and approaching the topic from a range of disciplines. The book begins by introducing polymeric materials, their dielectric, optical, and thermal properties, and the essential principles and techniques for polymers as applied to electronics. This is followed by detailed coverage of the key steps in the preparation of polymeric materials for opto-electronic devices, including fabrication methods, materials design, rheology, encapsulation, and conductive polymer mechanisms. The final part of the book focuses on the latest developments in advanced devices, covering the areas of photovoltaics, transistors, light-emitting diodes, and stretchable electronics. In addition, it explains mechanisms, design, fabrication techniques, and end applications. This is a highly valuable resource for researchers, advanced students, engineers and R&D professionals from a range of disciplines.
This thesis focuses on chalcogenide compound quantum dots with special crystal structures and behaviors in an effort to achieve the synergistic optimization of electrical and thermal transport for high-efficiency thermoelectric materials. The controllability and large-scale synthesis of chalcogenide quantum dots are realized through simple colloid synthesis, and the synergistic optimization of the materials' electrical and thermal transport properties is successfully achieved. Furthermore, the book explores the mechanism involved in the integration of high thermoelectric performance and reversible p-n semiconducting switching in bimetal chalcogenide semiconductors. As such, the thesis will be of interest to university researchers and graduate students in the materials science, chemistry and physics. |
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