Digital Systems Design and Prototyping: Using Field Programmable Logic and Hardware Description Languages, Second Edition covers the subject of digital systems design using two important technologies: Field Programmable Logic Devices (FPLDs) and Hardware Description Languages (HDLs). These two technologies are combined to aid in the design, prototyping, and implementation of a whole range of digital systems from very simple ones replacing traditional glue logic to very complex ones customized as the applications require. Three HDLs are presented: VHDL and Verilog, the widely used standard languages, and the proprietary Altera HDL (AHDL). The chapters on these languages serve as tutorials and comparisons are made that show the strengths and weaknesses of each language. A large number of examples are used in the description of each language providing insight for the design and implementation of FPLDs. The CD-ROM included with the book contains the Altera MAX+PLUS II development environment which is ready to compile and simulate all examples. With the addition of the Altera UP-1 prototyping board, all examples can be tested and verified in a real FPLD. Digital Systems Design and Prototyping: Using Field Programmable Logic and Hardware Description Languages, Second Edition is designed as an advanced level textbook as well as a reference for the professional engineer.

This book presents a comprehensive treatise on the advances in the use of light-emitting diodes (LEDs) for sustainable crop production and describes the latest photomorphogenesis research findings. It introduces readers to the fundamentals and design features of LEDs applicable for plant growth and development and illustrates their advantages over the traditional lighting systems, including cost analyses. Further, it discusses a wide range of applications covering diverse areas of plant sciences relevant to controlled environment agriculture and in vitro plant morphogenesis. The chapters have been written by a team of pioneering international experts, who have made significant contributions to this emerging interdisciplinary field. The book will serve a valuable resource for graduate students, instructors, and researchers in the fields of horticulture, agricultural biotechnology, cell and developmental biology, and precision agriculture. It will also serve well professionals engaged in greenhouse and vertical farming.

As the characteristic dimensions of electronic devices continue to shrink, the ability to characterize their electronic properties at the nanometer scale has come to be of outstanding importance. In this sense, Scanning Probe Microscopy (SPM) is becoming an indispensable tool, playing a key role in nanoscience and nanotechnology. SPM is opening new opportunities to measure semiconductor electronic properties with unprecedented spatial resolution. SPM is being successfully applied for nanoscale characterization of ferroelectric thin films. In the area of functional molecular materials it is being used as a probe to contact molecular structures in order to characterize their electrical properties, as a manipulator to assemble nanoparticles and nanotubes into simple devices, and as a tool to pattern molecular nanostructures. This book provides in-depth information on new and emerging applications of SPM to the field of materials science, namely in the areas of characterisation, device application and nanofabrication of functional materials. Starting with the general properties of functional materials the authors present an updated overview of the fundamentals of Scanning Probe Techniques and the application of SPM techniques to the characterization of specified functional materials such as piezoelectric and ferroelectric and to the fabrication of some nano electronic devices. Its uniqueness is in the combination of the fundamental nanoscale research with the progress in fabrication of realistic nanodevices. By bringing together the contribution of leading researchers from the materials science and SPM communities, relevant information is conveyed that allows researchers to learn more about the actual developments in SPM applied to functional materials. This book will contribute to the continuous education and development in the field of nanotechnology.

This book is intended for theoretical and experimental researchers who are interested in ferroelectrics and advanced memory. After introducing readers to dielectric, perovskites, advanced memories, and ferroelectric, it explains quantum simulation. Then, using molecular orbital calculation results, it explains the ferroelectric mechanism in perovskite titanium oxides in concrete terms. Lastly, the book examines the materials designed for high-performance ferroelectrics and discusses the future of high-speed memory.

Internet of things (IoT) is a new type of network that combines communication technology, expanded applications, and physical devices. Among them, agriculture is one of the most important areas in the application of the IoT technology, which has its unique requirements and integration features. Compared to the information technology in traditional agriculture, the agricultural IoT mainly refers to industrialized production and sustainable development under relatively controllable conditions. Agricultural IoT applies sensors, RFID, visual capture terminals and other types of sensing devices to detect and collect site information, and with broad applications in field planting, facility horticulture, livestock and poultry breeding, aquaculture and agricultural product logistics. It utilizes multiple information transmission channels such as wireless sensor networks, telecommunications networks and the internet to achieve reliable transmission of agricultural information at multiple scales and intelligently processes the acquired, massive information. The goals are to achieve (i) optimal control of agricultural production process, (ii) intelligent electronic trading of agricultural products circulation, and (iii) management of systematic logistics, quality and safety traceability. This book focuses on three levels of agricultural IoT network: information perception technology, information transmission technology and application technology.

The idea for this book arose out of the realization that, although excellent surveys and a phosphor handbook are available, there is no single source covering the area of phosphate based phosphors especially for lamp industry. Moreover, as this field gets only limited attention in most general books on luminescence, there is a clear need for a book in which attention is specifically directed toward this rapidly growing field of solid state lighting and its many applications. This book is aimed at providing a sound introduction to the synthesis and optical characterization of phosphate phosphor for undergraduate and graduate students as well as teachers and researchers. The book provides guidance through the multidisciplinary field of solid state lighting specially phosphate phosphors for beginners, scientists and engineers from universities, research organizations, and especially industry. In order to make it useful for a wide audience, both fundamentals and applications are discussed, together.

Test Resource Partitioning for System-on-a-Chip is about test resource partitioning and optimization techniques for plug-and-play system-on-a-chip (SOC) test automation. Plug-and-play refers to the paradigm in which core-to-core interfaces as well as core-to-SOC logic interfaces are standardized, such that cores can be easily plugged into "virtual sockets" on the SOC design, and core tests can be plugged into the SOC during test without substantial effort on the part of the system integrator. The goal of the book is to position test resource partitioning in the context of SOC test automation, as well as to generate interest and motivate research on this important topic.

SOC integrated circuits composed of embedded cores are now commonplace. Nevertheless, There remain several roadblocks to rapid and efficient system integration. Test development is seen as a major bottleneck in SOC design, and test challenges are a major contributor to the widening gap between design capability and manufacturing capacity. Testing SOCs is especially challenging in the absence of standardized test structures, test automation tools, and test protocols.

Test Resource Partitioning for System-on-a-Chip responds to a pressing need for a structured methodology for SOC test automation. It presents new techniques for the partitioning and optimization of the three major SOC test resources: test hardware, testing time and test data volume.

Test Resource Partitioning for System-on-a-Chip paves the way for a powerful integrated framework to automate the test flow for a large number of cores in an SOC in a plug-and-play fashion. The framework presented allows the system integrator to reduce test cost and meet short time-to-market requirements.

This book describes most recent progress in the properties, synthesis, characterization, modelling, and applications of nanomaterials and nanodevices. It begins with the review of the modelling of the structural, electronic and optical properties of low dimensional and nanoscale semiconductors, methodology of synthesis, and characterization of quantum dots and nanowires, with special attention towards Dirac materials, whose electrical conduction and sensing properties far exceed those of silicon-based materials, making them strong competitors. The contributed reviews presented in this book touch on broader issues associated with the environment, as well as energy production and storage, while highlighting important achievements in materials pertinent to the fields of biology and medicine, exhibiting an outstanding confluence of basic physical science with vital human endeavor. The subjects treated in this book are attractive to the broader readership of graduate and advanced undergraduate students in physics, chemistry, biology, and medicine, as well as in electrical, chemical, biological, and mechanical engineering. Seasoned researchers and experts from the semiconductor/device industry also greatly benefit from the book's treatment of cutting-edge application studies.

Metal-dielectric interfaces are ubiquitous in modern electronics. As advanced gigascale electronic devices continue to shrink, the stability of these interfaces is becoming an increasingly important issue that has a profound impact on the operational reliability of these devices. In this book, the authors present the basic science underlying the thermal and electrical stability of metal-dielectric interfaces and its relationship to the operation of advanced interconnect systems in gigascale electronics. Interface phenomena, including chemical reactions between metals and dielectrics, metallic-atom diffusion, and ion drift, are discussed based on fundamental physical and chemical principles. Schematic diagrams are provided throughout the book to illustrate interface phenomena and the principles that govern them. Metal-Dielectric Interfaces in Gigascale Electronics provides a unifying approach to the diverse and sometimes contradictory test results that are reported in the literature on metal-dielectric interfaces. The goal is to provide readers with a clear account of the relationship between interface science and its applications in interconnect structures. The material presented here will also be of interest to those engaged in field-effect transistor and memristor device research, as well as university researchers and industrial scientists working in the areas of electronic materials processing, semiconductor manufacturing, memory chips, and IC design.

Physics of Semiconductor Devices covers both basic classic topics such as energy band theory and the gradual-channel model of the MOSFET as well as advanced concepts and devices such as MOSFET short-channel effects, low-dimensional devices and single-electron transistors. Concepts are introduced to the reader in a simple way, often using comparisons to everyday-life experiences such as simple fluid mechanics. They are then explained in depth and mathematical developments are fully described.
Physics of Semiconductor Devices contains a list of problems that can be used as homework assignments or can be solved in class to exemplify the theory. Many of these problems make use of Matlab and are aimed at illustrating theoretical concepts in a graphical manner.

MXene, a two-dimensional (2D) transition metal carbide, nitride, and carbonitride, was discovered in 2011. MXene has great potential as a cocatalyst in the field of photocatalysis due to its unique properties and structure. MXene-Based Photocatalysts: Fabrication and Applications introduces readers to the fundamentals, preparation, microstructure characterization, and a variety of applications of MXene-based photocatalysts. The book is a comprehensive reference for MXene materials and provides an overview of the current literature on MXene-based photocatalysts. FEATURES Discusses preparation methods of MXenes Describes the morphology and microstructure of MXenes Offers strategies for fabricating MXene-based photocatalysts Details the reaction mechanism of MXene-based photocatalysts Covers applications in photocatalytic water-splitting, photocatalytic CO2 reduction, photocatalytic degradation, photocatalytic nitrogen fixation, and photocatalytic H2O2 production This book serves as an invaluable guide for advanced students, industry professionals, professors, and researchers in the field of materials science and engineering, photocatalysis, energy, and environmental applications.

This book presents an important technique to process organic photovoltaic devices. The basics, materials aspects and manufacturing of photovoltaic devices with solution processing are explained. Solution processable organic solar cells - polymer or solution processable small molecules - have the potential to significantly reduce the costs for solar electricity and energy payback time due to the low material costs for the cells, low cost and fast fabrication processes (ambient, roll-to-roll), high material utilization etc. In addition, organic photovoltaics (OPV) also provides attractive properties like flexibility, colorful displays and transparency which could open new market opportunities. The material and device innovations lead to improved efficiency by 8% for organic photovoltaic solar cells, compared to 4% in 2005. Both academic and industry research have significant interest in the development of this technology. This book gives an overview of the booming technology, focusing on the solution process for organic solar cells and provides a state-of-the-art report of the latest developments. World class experts cover fundamental, materials, devices and manufacturing technology of OPV technology.

MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs. Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain. Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).

Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.

The series Topics in Current Chemistry Collections presents critical reviews from the journal Topics in Current Chemistry organized in topical volumes. The scope of coverage is all areas of chemical science including the interfaces with related disciplines such as biology, medicine and materials science. The goal of each thematic volume is to give the non-specialist reader, whether in academia or industry, a comprehensive insight into an area where new research is emerging which is of interest to a larger scientific audience. Each review within the volume critically surveys one aspect of that topic and places it within the context of the volume as a whole. The most significant developments of the last 5 to 10 years are presented using selected examples to illustrate the principles discussed. The coverage is not intended to be an exhaustive summary of the field or include large quantities of data, but should rather be conceptual, concentrating on the methodological thinking that will allow the non-specialist reader to understand the information presented. Contributions also offer an outlook on potential future developments in the field.

This classroom-tested textbook is a modern primer on the rapidly developing field of quantum nano optics which investigates the optical properties of nanosized materials. The essentials of both classical and quantum optics are presented before embarking through a stimulating selection of further topics, such as various plasmonic phenomena, thermal effects, open quantum systems, and photon noise. Didactic and thorough in style, and requiring only basic knowledge of classical electrodynamics, the text provides all further physics background and additional mathematical and computational tools in a self-contained way. Numerous end-of-chapter exercises allow students to apply and test their understanding of the chapter topics and to refine their problem-solving techniques.

This book describes the theory and design of high-accuracy CMOS smart temperature sensors. The major topic of the work is the realization of a smart temperature sensor that has an accuracy that is so high that it can be applied without any form of calibration. Integrated in a low-cost CMOS technology, this yields at the publication date of this book one of the most inexpensive intelligent general purpose temperature sensors in the world. The first thermometers could only be read by the human eye. The industrial revolution and the following computerization asked for more intelligent sensors, which could easily communicate to digital computers. This led to. the development of integrated temperature sensors that combine a bipolar temperature sensor and an A-to-D converter on the same chip. The implementation in CMOS technology reduces the processing costs to a minimum while having the best-suited technology to increase the (digital) intelligence. The accuracy of conventional CMOS smart temperature sensors is degraded by the offset of the read-out electronics. Calibration of these errors is quite expensive, however, dynamic offset-cancellation techniques can reduce the offset of amplifiers by a factor 100 to 1000 and do not need trimming. Chapter two gives an elaborate description of the different kinds of dynamic offset-cancellation techniques. Also a new technique is introduced called the nested chopper technique. An implementation of a CMOS nested-chopper instrumentation amplifier shows a residual offset of less than lOOn V, which is the best result reported to date."

This book provides a comprehensive and up-to-date guide to the AMOLED technologies and applications which have become industry standard in a range of devices, from small mobile displays to large televisions. Unlike other books on the topic, which cover the fundamentals, materials, processing, and manufacturing of OLEDs, this one-stop book discusses the core components, such as TFT backplanes, OLED materials and devices, and driving schematics together in one volume with chapters written by experts from leading international companies in the field of OLED materials and OLED TVs. It also examines emerging areas, such as micro-LEDs, displays using quantum dots, and AR & VR displays. Presenting the latest research trends as well as the basic principles of each topic, this book is intended for undergraduate and postgraduate students taking display-related courses, new researchers, and engineers in related fields.

The book focuses on the topology optimization method for nano-optics. Both principles and implementing practice have been addressed, with more weight placed on applications. This is achieved by providing an in-depth study on the major topic of topology optimization of dielectric and metal structures for nano-optics with extension to the surface structures for electromagnetics. The comprehensive and systematic treatment of practical issues in topology optimization for nano-optics is one of the major features of the book, which is particularly suited for readers who are interested to learn practical solutions in topology optimization. The book can benefit researchers, engineers, and graduate students in the fields of structural optimization, nano-optics, wave optics, electromagnetics, etc.

Present-day scienceand technology have become increasingly based on studies and applications of thin films. This is especiallytrue of solid-state physics, semiconduc tor electronics, integrated optics, computer science, and the like. In these fields, it is necessary to use filmswith an ordered structure, especiallysingle-crystallinefilms, because physical phenomena and effects in such films are most reproducible. Also, active parts of semiconductor and other devices and circuits are created, as a rule, in single-crystal bodies. To date, single-crystallinefilms have been mainly epitaxial (or heteroepitaxial); i.e., they have been grown on a single-crystalline substrate, and principal trends, e.g., in the evolution of integrated circuits (lCs), have been based on continuing reduction in feature size and increase in the number of components per chip. However, as the size decreases into the submicrometer range, technological and physical limitations in integrated electronics become more and more severe. It is generally believed that a feature size of about 0.1um will have a crucial character. In other words, the present two-dimensional ICs are anticipated to reach their limit of minimization in the near future, and it is realized that further increase of packing density and/or functions might depend on three-dimensional integration. To solve the problem, techniques for preparation of single-crystalline films on arbitrary (including amorphous) substrates are essential."

Advances in Imaging and Electron Physics, Volume 216, merges two long-running serials, Advances in Electronics and Electron Physics and Advances in Optical and Electron Microscopy. The series features extended articles on the physics of electron devices (especially semiconductor devices), particle optics at high and low energies, microlithography, image science, digital image processing, electromagnetic wave propagation, electron microscopy and the computing methods used in all these domains.

The contrasting examples of microwave plasmas given in this volume demonstrate their capability of not only covering the totality of expressed needs in that particular field, but in many others. For example the ions and reactive neutral species, indispensable for the synergetic effects in etching and deposition processes can be used in metallurgical treatment, and for materials processing in general. They also have the ability to dissociate molecules and excite atoms as required in analytical chemistry where the information on the constituent concentrations is obtained through optical spectroscopy or mass spectrometry. Finally, microwave plasmas can supply the photons for laser and lighting applications. It is noteworthy that microwave plasmas cover an impressive pressure range of eight orders of magnitude from 10-3 Pa (10-5 torr) to above atmospheric pressure. The versatility of microwave plasmas, their moderate cost, and their ease of implementation particularly appeal to the industrial entrepreneur.

As well as providing a review of current developments, the work proposes a synthesis on microwave discharges, laying out the corresponding physical references without developing too much plasma theory. It will be of interest both to the user, who may not be overly concerned about plasma science, and to the plasma expert, who may wish to redirect his interest towards plasma applications, such as materials processing.

This new edition presents a unified description of these insulators from one to three dimensions based on the modified Dirac equation. It derives a series of solutions of the bound states near the boundary, and describes the current status of these solutions. Readers are introduced to topological invariants and their applications to a variety of systems from one-dimensional polyacetylene, to two-dimensional quantum spin Hall effect and p-wave superconductors, three-dimensional topological insulators and superconductors or superfluids, and topological Weyl semimetals, helping them to better understand this fascinating field. To reflect research advances in topological insulators, several parts of the book have been updated for the second edition, including: Spin-Triplet Superconductors, Superconductivity in Doped Topological Insulators, Detection of Majorana Fermions and so on. In particular, the book features a new chapter on Weyl semimetals, a topic that has attracted considerable attention and has already become a new hotpot of research in the community.