Autonomic networking aims to solve the mounting problems created by increasingly complex networks, by enabling devices and service-providers to decide, preferably without human intervention, what to do at any given moment, and ultimately to create self-managing networks that can interface with each other, adapting their behavior to provide the best service to the end-user in all situations. This book gives both an understanding and an assessment of the principles, methods and architectures in autonomous network management, as well as lessons learned from, the ongoing initiatives in the field. It includes contributions from industry groups at Orange Labs, Motorola, Ericsson, the ANA EU Project and leading universities. These groups all provide chapters examining the international research projects to which they are contributing, such as the EU Autonomic Network Architecture Project and Ambient Networks EU Project, reviewing current developments and demonstrating how autonomic management principles are used to define new architectures, models, protocols, and mechanisms for future network equipment.

This book is an overview of the strategies to generate high-quality films of one-dimensional semiconductor nanostructures on flexible substrates (e.g., plastics) and the use of them as building blocks to fabricating flexible devices (including electronics, optoelectronics, sensors, power systems). In addition to engineering aspects, the physics and chemistry behind the fabrication and device operation will also be discussed as well. Internationally recognized scientists from academia, national laboratories, and industries, who are the leading researchers in the emerging areas, are contributing exceptional chapters according to their cutting-edge research results and expertise. This book will be an on-time addition to the literature in nanoscience and engineering. It will be suitable for graduate students and researchers as a useful reference to stimulate their research interest as well as facilitate their research in nanoscience and engineering.

With the advent of wavelength routing and dynamic, reconfigurable optical networks, new demands are being made in the design and operation of optical amplifiers. This book provides, for the first time, a comprehensive review of optical amplifier technology in the context of these recent advances in the field. It demonstrates how to manage the trade-offs between amplifier design, network architecture and system management and operation. The book provides an overview of optical amplifiers and reconfigurable networks before examining in greater detail the issues of importance to network operators and equipment manufacturers, including 40G and 100G transmission. Optical amplifier design is fully considered, focusing on fundamentals, design solutions and amplifier performance limitations. Finally, the book discusses other emerging applications for optical amplifiers such as optical networks for high data rate systems, free space systems, long single span links and optical digital networks. This book will be of great value to R&D engineers, network and systems engineers, telecommunications service providers, component suppliers, industry analysts, network operators, postgraduate students, academics and anyone seeking to understand emerging trends in optical networks and the consequent changes in optical amplifier design, features and applications.

Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike. The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly 'green' adhesives. Information about regulations and compliance has been brought fully up-to-date. As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as: * Tamper-proof adhesives for electronic security devices. * Bio-compatible adhesives for implantable medical devices. * Electrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly - as required by regulatory regimes, e.g. the EU's Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market). * Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices.

Electromechanical Coupling Theory, Methodology and Applications for High-Performance Microwave Equipment Electromechanical Coupling Theory, Methodology, and Applications for High-Performance Microwave Equipment is an authoritative and up-to-date guide to the structural, mechanical, and electrical aspects of electromechanical coupling. Addressing control, electromagnetism, and structural engineering, this comprehensive reference covers the electromechanical coupling of high-performance microwave electronic equipment (MEE), such as antennas, radar, large radio telescopes, and telecommunication and navigation equipment. The book is divided into four main sections, beginning with an introduction to electromechanical coupling (EMC) theory and a detailed description of the multi-field coupling model (MFCM) and the influence mechanism (IM) of nonlinear factors of antenna-servo-feeder systems on performance. Subsequent sections discuss MFCM- and IM-based design methodology, EMC-based measurement and testing, computer software for coupling analysis and design of electronic equipment, and various engineering applications of EMC theory and the IM of typical electronic equipment. In addition, the book: Discusses information and data transfer in electromagnetic fields, mechanical and structural deformation fields, and temperature fields Explains how high-performance microwave electronic equipment differs from traditional mechanical equipment Addresses EMC-based and general design-vector based optimization of electronic equipment design Describes applications such as a gun-guided radar system for warships and a large-diameter antenna for moon exploration Includes evaluation criteria to validate MFCM/IM design theory and methodology Electromechanical Coupling Theory, Methodology, and Applications for High-Performance Microwave Equipment is essential reading for circuit designers, microwave engineers, researchers working with high-frequency microwave engineering, and engineers working with integrated circuits in radar, communications, IoT, antenna engineering, and remote sensing.

Nanostructured silicon-germanium (SiGe) opens up the prospects of novel and enhanced electronic device performance, especially for semiconductor devices. Silicon-germanium (SiGe) nanostructures reviews the materials science of nanostructures and their properties and applications in different electronic devices. The introductory part one covers the structural properties of SiGe nanostructures, with a further chapter discussing electronic band structures of SiGe alloys. Part two concentrates on the formation of SiGe nanostructures, with chapters on different methods of crystal growth such as molecular beam epitaxy and chemical vapour deposition. This part also includes chapters covering strain engineering and modelling. Part three covers the material properties of SiGe nanostructures, including chapters on such topics as strain-induced defects, transport properties and microcavities and quantum cascade laser structures. In Part four, devices utilising SiGe alloys are discussed. Chapters cover ultra large scale integrated applications, MOSFETs and the use of SiGe in different types of transistors and optical devices. With its distinguished editors and team of international contributors, Silicon-germanium (SiGe) nanostructures is a standard reference for researchers focusing on semiconductor devices and materials in industry and academia, particularly those interested in nanostructures.

The MEMS (Micro Electro-Mechanical Systems) market returned to growth in 2010. The total MEMS market is worth about $6.5 billion, up more than 11 percent from last year and nearly as high as its historic peak in 2007. MEMS devices are used across sectors as diverse as automotive, aerospace, medical, industrial process control, instrumentation and telecommunications - forming the nerve center of products including airbag crash sensors, pressure sensors, biosensors and ink jet printer heads. Part of the MEMS cluster within the Micro & Nano Technologies Series, this book covers the fabrication techniques and applications of thick film piezoelectric micro electromechanical systems (MEMS). It includes examples of applications where the piezoelectric thick films have been used, illustrating how the fabrication process relates to the properties and performance of the resulting device. Other topics include: top-down and bottom-up fabrication of thick film MEMS, integration of thick films with other materials, effect of microstructure on properties, device performance, etc.

Piezoelectric materials produce electric charges on their surfaces as a consequence of applying mechanical stress. They are used in the fabrication of a growing range of devices such as transducers (used, for example, in ultrasound scanning), actuators (deployed in such areas as vibration suppression in optical and microelectronic engineering), pressure sensor devices (such as gyroscopes) and increasingly as a way of producing energy. Their versatility has led to a wealth of research to broaden the range of piezoelectric materials and their potential uses. Advanced piezoelectric materials: science and technology provides a comprehensive review of these new materials, their properties, methods of manufacture and applications. After an introductory overview of the development of piezoelectric materials, Part one reviews the various types of piezoelectric material, ranging from lead zirconate titanate (PZT) piezo-ceramics, relaxor ferroelectric ceramics, lead-free piezo-ceramics, quartz-based piezoelectric materials, the use of lithium niobate and lithium in piezoelectrics, single crystal piezoelectric materials, electroactive polymers (EAP) and piezoelectric composite materials. Part two discusses how to design and fabricate piezo-materials with chapters on piezo-ceramics, single crystal preparation techniques, thin film technologies, aerosol techniques and manufacturing technologies for piezoelectric transducers. The final part of the book looks at applications such as high-power piezoelectric materials and actuators as well as the performance of piezoelectric materials under stress. With its distinguished editor and international team of expert contributors Advanced piezoelectric materials: science and technology is a standard reference for all those researching piezoelectric materials and using them to develop new devices in such areas as microelectronics, optical, sound, structural and biomedical engineering.

The development of nitride-based light-emitting diodes (LEDs) has led to advancements in high-brightness LED technology for solid-state lighting, handheld electronics, and advanced bioengineering applications. Nitride Semiconductor Light-Emitting Diodes (LEDs) reviews the fabrication, performance, and applications of this technology that encompass the state-of-the-art material and device development, and practical nitride-based LED design considerations. Part one reviews the fabrication of nitride semiconductor LEDs. Chapters cover molecular beam epitaxy (MBE) growth of nitride semiconductors, modern metalorganic chemical vapor deposition (MOCVD) techniques and the growth of nitride-based materials, and gallium nitride (GaN)-on-sapphire and GaN-on-silicon technologies for LEDs. Nanostructured, non-polar and semi-polar nitride-based LEDs, as well as phosphor-coated nitride LEDs, are also discussed. Part two covers the performance of nitride LEDs, including photonic crystal LEDs, surface plasmon enhanced LEDs, color tuneable LEDs, and LEDs based on quantum wells and quantum dots. Further chapters discuss the development of LED encapsulation technology and the fundamental efficiency droop issues in gallium indium nitride (GaInN) LEDs. Finally, part three highlights applications of nitride LEDs, including liquid crystal display (LCD) backlighting, infrared emitters, and automotive lighting. Nitride Semiconductor Light-Emitting Diodes (LEDs) is a technical resource for academics, physicists, materials scientists, electrical engineers, and those working in the lighting, consumer electronics, automotive, aviation, and communications sectors.

The demand for ever smaller and portable electronic devices has driven metal oxide semiconductor-based (CMOS) technology to its physical limit with the smallest possible feature sizes. This presents various size-related problems such as high power leakage, low-reliability, and thermal effects, and is a limit on further miniaturization. To enable even smaller electronics, various nanodevices including carbon nanotube transistors, graphene transistors, tunnel transistors and memristors (collectively called post-CMOS devices) are emerging that could replace the traditional and ubiquitous silicon transistor. This book explores these nanoelectronics at the circuit and systems levels including modelling and design approaches and issues. Topics covered include self-healing analog and radio frequency circuits; on-chip gate delay variability measurement in scaled technology node; nanoscale finFET devices for PVT aware SRAM; data stability and write ability enhancement techniques for finFET SRAM circuits; low-leakage techniques for nanoscale CMOS circuits; thermal effects in carbon nanotube VLSI interconnects; lumped electro-thermal modeling and analysis of carbon nanotube interconnects; high-level synthesis of digital integrated circuits in the nanoscale mobile electronics era; SPICEless RTL design optimization of nanoelectronic digital integrated circuits; green on-chip inductors for three-dimensional integrated circuits; 3D network-on-chips; and DNA computing. This book is essential reading for researchers, research-focused industry designers/developers, and advanced students working on next-generation electronic devices and circuits.

Very Large Scale Integration (VLSI) Systems refer to the latest development in computer microchips which are created by integrating hundreds of thousands of transistors into one chip. Emerging research in this area has the potential to uncover further applications for VSLI technologies in addition to system advancements. Design and Modeling of Low Power VLSI Systems analyzes various traditional and modern low power techniques for integrated circuit design in addition to the limiting factors of existing techniques and methods for optimization. Through a research-based discussion of the technicalities involved in the VLSI hardware development process cycle, this book is a useful resource for researchers, engineers, and graduate-level students in computer science and engineering.

Power Electronics and Motor Drive Systems is designed to aid electrical engineers, researchers, and students to analyze and address common problems in state-of-the-art power electronics technologies. Author Stefanos Manias supplies a detailed discussion of the theory of power electronics circuits and electronic power conversion technology systems, with common problems and methods of analysis to critically evaluate results. These theories are reinforced by simulation examples using well-known and widely available software programs, including SPICE, PSIM, and MATLAB/SIMULINK. Manias expertly analyzes power electronic circuits with basic power semiconductor devices, as well as the new power electronic converters. He also clearly and comprehensively provides an analysis of modulation and output voltage, current control techniques, passive and active filtering, and the characteristics and gating circuits of different power semiconductor switches, such as BJTs, IGBTs, MOSFETs, IGCTs, MCTs and GTOs.

There have been major recent advances in robotic systems that can replace humans in undertaking hazardous activities in demanding or dangerous environments. Published in association with the CLAWAR (Climbing and Walking Robots and Associated Technologies Association) (www.clawar.org), this important book reviews the development of robotic systems for de-mining and other risky activities such as fire-fighting. Part one provides an overview of the use of robots for humanitarian de-mining work. Part two discusses the development of sensors for mine detection whilst Part thee reviews developments in both teleoperated and autonomous robots. Building on the latter, Part four concentrates on robot autonomous navigation. The final part of the book reviews research on multi-agent-systems (MAS) and the multi-robotics-systems (MRS), promising tools that take into account modular design of mobile robots and the use of several robots in multi-task missions. With its distinguished editors and international team of contributors, Using robots in hazardous environments: landmine detection, de-mining and other applications is a standard reference for all those researching the use of robots in hazardous environments as well as government and other agencies wishing to use robots for dangerous tasks such as landmine detection and disposal.

Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field.

Unlike electroplating, electroless plating allows uniform deposits of coating materials over all surfaces, regardless of size, shape and electrical conductivity. Electroless copper and nickel-phosphorus deposits provide protective and functional coatings in industries as diverse as electronics, automotive, aerospace and chemical engineering. This book discusses the latest research in electroless depositions. After an introductory chapter, part one focuses on electroless copper depositions reviewing such areas as surface morphology and residual stress, modelling surface structure, adhesion strength of electroless copper deposit, electrical resistivity and applications of electroless copper deposits. Part two goes on to look at electroless nickel-phosphorus depositions with chapters on the crystallisation of nickel-phosphorus deposits, modelling the thermodynamics and kinetics of crystallisation of nickel-phosphorus deposits, artificial neural network (ANN) modelling of crystallisation temperatures, hardness evolution of nickel-phosphorus deposits and applications of electroless nickel-phosphorus plating. Written by leading experts in the field Electroless copper and nickel-phosphorus plating: Processing, characterisation and modelling is an invaluable guide for researchers studying electroless deposits or materials science as well as for those working in the chemical, oil and gas, automotive, electronics and aerospace industries.

Artificial intelligence is smarter than humans. It can process information at lightning speed and remain focused on specific tasks without distraction. AI can see into the future, predict outcomes and even use sensors to see around physical and virtual corners. So why does AI frequently get it so wrong and cause harm?

The answer is us: the human beings who write the code and teach AI to mimic our behaviour. Scary Smart explains how to fix the current trajectory now, to make sure that the AI of the future can preserve our species. This book offers a blueprint, pointing the way to what we can do to safeguard ourselves, those we love and the planet itself.

This reference, written by leading authorities in the field, gives basic theory, implementation details, advanced research, and applications of RF and microwave in healthcare and biosensing. It first provides a solid understanding of the fundamentals with coverage of the basics of microwave engineering and the interaction between electromagnetic waves and biomaterials. It then presents the state-of-the-art development in microwave biosensing, implantable devices -including applications of microwave technology for sensing biological tissues - and medical diagnosis, along with applications involving remote patient monitoring. this book is an ideal reference for RF and microwave engineer working on, or thinking of working on, the applications of RF and Microwave technology in medicine and biology. Learn: The fundamentals of RF and microwave engineering in healthcare and biosensing How to combine biological and medical aspects of the field with underlying engineering concepts How to implement microwave biosensing for material characterization and cancer diagnosis Applications and functioning of wireless implantable biomedical devices and microwave non-contact biomedical radars How to combine devices, systems, and methods for new practical applications

Integrated Lasers on Silicon provides a comprehensive overview of the state-of-the-art use of lasers on silicon for photonic integration. The authors demonstrate the need for efficient laser sources on silicon, motivated by the development of on-board/on-chip optical interconnects and the different integration schemes available. The authors include detailed descriptions of Group IV-based lasers, followed by a presentation of the results obtained through the bonding approach (hybrid III-V lasers). The monolithic integration of III-V semiconductor lasers are explored, concluding with a discussion of the different kinds of cavity geometries benchmarked with respect to their potential integration on silicon in an industrial environment.

The demand for ever smaller and portable electronic devices has driven metal oxide semiconductor-based (CMOS) technology to its physical limit with the smallest possible feature sizes. This presents various size-related problems such as high power leakage, low-reliability, and thermal effects, and is a limit on further miniaturization. To enable even smaller electronics, various nanodevices including carbon nanotube transistors, graphene transistors, tunnel transistors and memristors (collectively called post-CMOS devices) are emerging that could replace the traditional and ubiquitous silicon transistor. This book explores these nanoelectronics at the device level including modelling and design. Topics covered include high-k dielectrics; high mobility n and p channels on gallium arsenide and silicon substrates using interfacial misfit dislocation arrays; anodic metal-insulator-metal (MIM) capacitors; graphene transistors; junction and doping free transistors; nanoscale gigh-k/metal-gate CMOS and FinFET based logic libraries; multiple-independent-gate nanowire transistors; carbon nanotubes for efficient power delivery; timing driven buffer insertion for carbon nanotube interconnects; memristor modeling; and neuromorphic devices and circuits. This book is essential reading for researchers, research-focused industry designers/developers, and advanced students working on next-generation electronic devices and circuits.

Materials Characterization Using Nondestructive Evaluation (NDE) Methods discusses NDT methods and how they are highly desirable for both long-term monitoring and short-term assessment of materials, providing crucial early warning that the fatigue life of a material has elapsed, thus helping to prevent service failures. Materials Characterization Using Nondestructive Evaluation (NDE) Methods gives an overview of established and new NDT techniques for the characterization of materials, with a focus on materials used in the automotive, aerospace, power plants, and infrastructure construction industries. Each chapter focuses on a different NDT technique and indicates the potential of the method by selected examples of applications. Methods covered include scanning and transmission electron microscopy, X-ray microtomography and diffraction, ultrasonic, electromagnetic, microwave, and hybrid techniques. The authors review both the determination of microstructure properties, including phase content and grain size, and the determination of mechanical properties, such as hardness, toughness, yield strength, texture, and residual stress.