Advanced Piezoelectric Materials: Science and Technology, Second Edition, provides revised, expanded, and updated content suitable for those researching piezoelectric materials or using them to develop new devices in areas such as microelectronics, optical, sound, structural, and biomedical engineering. Three new chapters cover multilayer technologies with base-metal internal electrodes, templated grain growth preparation techniques for manufacturing piezoelectric single crystals, and piezoelectric MEMS technologies. Chapters from the first edition have been revised in order to provide up-to-date, comprehensive coverage of developments in the field. Part One covers the structure and properties of a range of piezoelectric materials. Part Two details advanced manufacturing processes for particular materials and device types, including three new chapters. Finally, Part Three covers materials development for three key applications of piezoelectric materials. Dr. Kenji Uchino is a pioneer in piezoelectric actuators, Professor of Electrical Engineering at Penn State University, and Director of the International Center for Actuators and Transducers. He has authored 550 papers, 54 books and 26 patents in the ceramic actuator area.

The unique compendium presents special principles and techniques of spectroscopic measurements that are used in semiconductor manufacturing.Since industrial applications of spectroscopy are significantly different from those traditionally used in scientific laboratories, the design concepts and characteristics of industrial spectroscopic devices may vary significantly from conventional systems. These peculiarities are thus succinctly summarized in this volume for a wide audience of students, engineers, and scientific workers.Exceptionally well-illustrated with practical solutions in detail, this useful reference text will open new horizons in new research areas.

The development of nitride-based light-emitting diodes (LEDs) has led to advancements in high-brightness LED technology for solid-state lighting, handheld electronics, and advanced bioengineering applications. Nitride Semiconductor Light-Emitting Diodes (LEDs) reviews the fabrication, performance, and applications of this technology that encompass the state-of-the-art material and device development, and practical nitride-based LED design considerations. Part one reviews the fabrication of nitride semiconductor LEDs. Chapters cover molecular beam epitaxy (MBE) growth of nitride semiconductors, modern metalorganic chemical vapor deposition (MOCVD) techniques and the growth of nitride-based materials, and gallium nitride (GaN)-on-sapphire and GaN-on-silicon technologies for LEDs. Nanostructured, non-polar and semi-polar nitride-based LEDs, as well as phosphor-coated nitride LEDs, are also discussed. Part two covers the performance of nitride LEDs, including photonic crystal LEDs, surface plasmon enhanced LEDs, color tuneable LEDs, and LEDs based on quantum wells and quantum dots. Further chapters discuss the development of LED encapsulation technology and the fundamental efficiency droop issues in gallium indium nitride (GaInN) LEDs. Finally, part three highlights applications of nitride LEDs, including liquid crystal display (LCD) backlighting, infrared emitters, and automotive lighting. Nitride Semiconductor Light-Emitting Diodes (LEDs) is a technical resource for academics, physicists, materials scientists, electrical engineers, and those working in the lighting, consumer electronics, automotive, aviation, and communications sectors.

Unlike electroplating, electroless plating allows uniform deposits of coating materials over all surfaces, regardless of size, shape and electrical conductivity. Electroless copper and nickel-phosphorus deposits provide protective and functional coatings in industries as diverse as electronics, automotive, aerospace and chemical engineering. This book discusses the latest research in electroless depositions. After an introductory chapter, part one focuses on electroless copper depositions reviewing such areas as surface morphology and residual stress, modelling surface structure, adhesion strength of electroless copper deposit, electrical resistivity and applications of electroless copper deposits. Part two goes on to look at electroless nickel-phosphorus depositions with chapters on the crystallisation of nickel-phosphorus deposits, modelling the thermodynamics and kinetics of crystallisation of nickel-phosphorus deposits, artificial neural network (ANN) modelling of crystallisation temperatures, hardness evolution of nickel-phosphorus deposits and applications of electroless nickel-phosphorus plating. Written by leading experts in the field Electroless copper and nickel-phosphorus plating: Processing, characterisation and modelling is an invaluable guide for researchers studying electroless deposits or materials science as well as for those working in the chemical, oil and gas, automotive, electronics and aerospace industries.

There have been major recent advances in robotic systems that can replace humans in undertaking hazardous activities in demanding or dangerous environments. Published in association with the CLAWAR (Climbing and Walking Robots and Associated Technologies Association) (www.clawar.org), this important book reviews the development of robotic systems for de-mining and other risky activities such as fire-fighting. Part one provides an overview of the use of robots for humanitarian de-mining work. Part two discusses the development of sensors for mine detection whilst Part thee reviews developments in both teleoperated and autonomous robots. Building on the latter, Part four concentrates on robot autonomous navigation. The final part of the book reviews research on multi-agent-systems (MAS) and the multi-robotics-systems (MRS), promising tools that take into account modular design of mobile robots and the use of several robots in multi-task missions. With its distinguished editors and international team of contributors, Using robots in hazardous environments: landmine detection, de-mining and other applications is a standard reference for all those researching the use of robots in hazardous environments as well as government and other agencies wishing to use robots for dangerous tasks such as landmine detection and disposal.

Electrical motor products reviews the energy efficiency management laws for electrical motor products in United States, European Union (EU) and China. The energy efficiency certification requirements for the electrical motor products vary from country to country and are summarised here. International standards, testing methods and certification requirements for specific electrical motor products are discussed, including electric motors, pumps and fans. Finally, methods for improving energy efficiency are examined.

Autonomic networking aims to solve the mounting problems created by increasingly complex networks, by enabling devices and service-providers to decide, preferably without human intervention, what to do at any given moment, and ultimately to create self-managing networks that can interface with each other, adapting their behavior to provide the best service to the end-user in all situations. This book gives both an understanding and an assessment of the principles, methods and architectures in autonomous network management, as well as lessons learned from, the ongoing initiatives in the field. It includes contributions from industry groups at Orange Labs, Motorola, Ericsson, the ANA EU Project and leading universities. These groups all provide chapters examining the international research projects to which they are contributing, such as the EU Autonomic Network Architecture Project and Ambient Networks EU Project, reviewing current developments and demonstrating how autonomic management principles are used to define new architectures, models, protocols, and mechanisms for future network equipment.

The MEMS (Micro Electro-Mechanical Systems) market returned to growth in 2010. The total MEMS market is worth about $6.5 billion, up more than 11 percent from last year and nearly as high as its historic peak in 2007. MEMS devices are used across sectors as diverse as automotive, aerospace, medical, industrial process control, instrumentation and telecommunications - forming the nerve center of products including airbag crash sensors, pressure sensors, biosensors and ink jet printer heads. Part of the MEMS cluster within the Micro & Nano Technologies Series, this book covers the fabrication techniques and applications of thick film piezoelectric micro electromechanical systems (MEMS). It includes examples of applications where the piezoelectric thick films have been used, illustrating how the fabrication process relates to the properties and performance of the resulting device. Other topics include: top-down and bottom-up fabrication of thick film MEMS, integration of thick films with other materials, effect of microstructure on properties, device performance, etc.

Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike. The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly 'green' adhesives. Information about regulations and compliance has been brought fully up-to-date. As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as: * Tamper-proof adhesives for electronic security devices. * Bio-compatible adhesives for implantable medical devices. * Electrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly - as required by regulatory regimes, e.g. the EU's Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market). * Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices.

Evolution of Knowledge Science: Myth to Medicine: Intelligent Internet-Based Humanist Machines explains how to design and build the next generation of intelligent machines that solve social and environmental problems in a systematic, coherent, and optimal fashion. The book brings together principles from computer and communication sciences, electrical engineering, mathematics, physics, social sciences, and more to describe computer systems that deal with knowledge, its representation, and how to deal with knowledge centric objects. Readers will learn new tools and techniques to measure, enhance, and optimize artificial intelligence strategies for efficiently searching through vast knowledge bases, as well as how to ensure the security of information in open, easily accessible, and fast digital networks. Author Syed Ahamed joins the basic concepts from various disciplines to describe a robust and coherent knowledge sciences discipline that provides readers with tools, units, and measures to evaluate the flow of knowledge during course work or their research. He offers a unique academic and industrial perspective of the concurrent dynamic changes in computer and communication industries based upon his research. The author has experience both in industry and in teaching graduate level telecommunications and network architecture courses, particularly those dealing with applications of networks in education.

Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field.

With the advent of wavelength routing and dynamic, reconfigurable optical networks, new demands are being made in the design and operation of optical amplifiers. This book provides, for the first time, a comprehensive review of optical amplifier technology in the context of these recent advances in the field. It demonstrates how to manage the trade-offs between amplifier design, network architecture and system management and operation. The book provides an overview of optical amplifiers and reconfigurable networks before examining in greater detail the issues of importance to network operators and equipment manufacturers, including 40G and 100G transmission. Optical amplifier design is fully considered, focusing on fundamentals, design solutions and amplifier performance limitations. Finally, the book discusses other emerging applications for optical amplifiers such as optical networks for high data rate systems, free space systems, long single span links and optical digital networks. This book will be of great value to R&D engineers, network and systems engineers, telecommunications service providers, component suppliers, industry analysts, network operators, postgraduate students, academics and anyone seeking to understand emerging trends in optical networks and the consequent changes in optical amplifier design, features and applications.

Thin film technology is used in many applications such as microelectronics, optics, hard and corrosion resistant coatings and micromechanics, and thin films form a uniquely versatile material base for the development of novel technologies within these industries. Thin film growth provides an important and up-to-date review of the theory and deposition techniques used in the formation of thin films. Part one focuses on the theory of thin film growth, with chapters covering nucleation and growth processes in thin films, phase-field modelling of thin film growth and surface roughness evolution. Part two covers some of the techniques used for thin film growth, including oblique angle deposition, reactive magnetron sputtering and epitaxial growth of graphene films on single crystal metal surfaces. This section also includes chapters on the properties of thin films, covering topics such as substrate plasticity and buckling of thin films, polarity control, nanostructure growth dynamics and network behaviour in thin films. With its distinguished editor and international team of contributors, Thin film growth is an essential reference for engineers in electronics, energy materials and mechanical engineering, as well as those with an academic research interest in the topic.

This book is an overview of the strategies to generate high-quality films of one-dimensional semiconductor nanostructures on flexible substrates (e.g., plastics) and the use of them as building blocks to fabricating flexible devices (including electronics, optoelectronics, sensors, power systems). In addition to engineering aspects, the physics and chemistry behind the fabrication and device operation will also be discussed as well. Internationally recognized scientists from academia, national laboratories, and industries, who are the leading researchers in the emerging areas, are contributing exceptional chapters according to their cutting-edge research results and expertise. This book will be an on-time addition to the literature in nanoscience and engineering. It will be suitable for graduate students and researchers as a useful reference to stimulate their research interest as well as facilitate their research in nanoscience and engineering.

Nanostructured silicon-germanium (SiGe) opens up the prospects of novel and enhanced electronic device performance, especially for semiconductor devices. Silicon-germanium (SiGe) nanostructures reviews the materials science of nanostructures and their properties and applications in different electronic devices. The introductory part one covers the structural properties of SiGe nanostructures, with a further chapter discussing electronic band structures of SiGe alloys. Part two concentrates on the formation of SiGe nanostructures, with chapters on different methods of crystal growth such as molecular beam epitaxy and chemical vapour deposition. This part also includes chapters covering strain engineering and modelling. Part three covers the material properties of SiGe nanostructures, including chapters on such topics as strain-induced defects, transport properties and microcavities and quantum cascade laser structures. In Part four, devices utilising SiGe alloys are discussed. Chapters cover ultra large scale integrated applications, MOSFETs and the use of SiGe in different types of transistors and optical devices. With its distinguished editors and team of international contributors, Silicon-germanium (SiGe) nanostructures is a standard reference for researchers focusing on semiconductor devices and materials in industry and academia, particularly those interested in nanostructures.

Nanophotonics has emerged as a major technology and applications domain, exploiting the interaction of light-emitting and light-sensing nanostructured materials. These devices are lightweight, highly efficient, low on power consumption, and are cost effective to produce. The authors of this book have been involved in pioneering work in manufacturing photonic devices from carbon nanotube (CNT) nanowires and provide a series of practical guidelines for their design and manufacture, using processes such as nano-robotic manipulation and assembly methods. They also introduce the design and operational principles of opto-electrical sensing devices at the nano scale. Thermal annealing and packaging processes are also covered, as key elements in a scalable manufacturing process. Examples of applications of different nanowire based photonic devices are presented. These include applications in the fields of electronics (e.g. FET, CNT Schotty diode) and solar energy.

Organic flexible electronics represent a highly promising technology that will provide increased functionality and the potential to meet future challenges of scalability, flexibility, low power consumption, light weight, and reduced cost. They will find new applications because they can be used with curved surfaces and incorporated in to a number of products that could not support traditional electronics. The book covers device physics, processing and manufacturing technologies, circuits and packaging, metrology and diagnostic tools, architectures, and systems engineering. Part one covers the production, properties and characterisation of flexible organic materials and part two looks at applications for flexible organic devices.

This in-depth, detailed reference presents for the first time a comprehensive treatment of recent advances in optical performance monitoring. Written by leading experts in the field, the book provides an overview of recent developments in the area and the role of OPM in future optical systems and networks. Detailed discussions of various advanced techniques are provided to illustrate their principles. FEATURES: Presents the principles and applications of advanced OPM techniques, together with a comparative evaluation of their effectiveness in monitoring individual parameters, such as optical signal-to-noise ratio, chromatic dispersion, and polarization mode dispersion Explains the principles of the various advanced optical signal processing techniques and their applications in OPM Examines the role and applications of OPM in optical networks, including optical transport networks, coherent optical systems, and long-haul optical transmission systems Discusses the current approaches of OPM in the global standard SDH/SONET This book is ideal for technical professionals and researchers who want to understand and evaluate advanced techniques in OPM and their impact on the practical design of next-generation optical systems and networks.

Piezoelectric materials produce electric charges on their surfaces as a consequence of applying mechanical stress. They are used in the fabrication of a growing range of devices such as transducers (used, for example, in ultrasound scanning), actuators (deployed in such areas as vibration suppression in optical and microelectronic engineering), pressure sensor devices (such as gyroscopes) and increasingly as a way of producing energy. Their versatility has led to a wealth of research to broaden the range of piezoelectric materials and their potential uses. Advanced piezoelectric materials: science and technology provides a comprehensive review of these new materials, their properties, methods of manufacture and applications. After an introductory overview of the development of piezoelectric materials, Part one reviews the various types of piezoelectric material, ranging from lead zirconate titanate (PZT) piezo-ceramics, relaxor ferroelectric ceramics, lead-free piezo-ceramics, quartz-based piezoelectric materials, the use of lithium niobate and lithium in piezoelectrics, single crystal piezoelectric materials, electroactive polymers (EAP) and piezoelectric composite materials. Part two discusses how to design and fabricate piezo-materials with chapters on piezo-ceramics, single crystal preparation techniques, thin film technologies, aerosol techniques and manufacturing technologies for piezoelectric transducers. The final part of the book looks at applications such as high-power piezoelectric materials and actuators as well as the performance of piezoelectric materials under stress. With its distinguished editor and international team of expert contributors Advanced piezoelectric materials: science and technology is a standard reference for all those researching piezoelectric materials and using them to develop new devices in such areas as microelectronics, optical, sound, structural and biomedical engineering.

Advances in Imaging and Electron Physics merges two long-running serials, Advances in Electronics and Electron Physics and Advances in Optical and Electron Microscopy. The series features extended articles on the physics of electron devices, especially semiconductor devices, particle optics at high and low energies, microlithography, image science, digital image processing, electromagnetic wave propagation, electron microscopy, and the computing methods used in all these domains.