This reference, written by leading authorities in the field, gives basic theory, implementation details, advanced research, and applications of RF and microwave in healthcare and biosensing. It first provides a solid understanding of the fundamentals with coverage of the basics of microwave engineering and the interaction between electromagnetic waves and biomaterials. It then presents the state-of-the-art development in microwave biosensing, implantable devices -including applications of microwave technology for sensing biological tissues - and medical diagnosis, along with applications involving remote patient monitoring. this book is an ideal reference for RF and microwave engineer working on, or thinking of working on, the applications of RF and Microwave technology in medicine and biology. Learn: The fundamentals of RF and microwave engineering in healthcare and biosensing How to combine biological and medical aspects of the field with underlying engineering concepts How to implement microwave biosensing for material characterization and cancer diagnosis Applications and functioning of wireless implantable biomedical devices and microwave non-contact biomedical radars How to combine devices, systems, and methods for new practical applications

The demand for ever smaller and portable electronic devices has driven metal oxide semiconductor-based (CMOS) technology to its physical limit with the smallest possible feature sizes. This presents various size-related problems such as high power leakage, low-reliability, and thermal effects, and is a limit on further miniaturization. To enable even smaller electronics, various nanodevices including carbon nanotube transistors, graphene transistors, tunnel transistors and memristors (collectively called post-CMOS devices) are emerging that could replace the traditional and ubiquitous silicon transistor. This book explores these nanoelectronics at the circuit and systems levels including modelling and design approaches and issues. Topics covered include self-healing analog and radio frequency circuits; on-chip gate delay variability measurement in scaled technology node; nanoscale finFET devices for PVT aware SRAM; data stability and write ability enhancement techniques for finFET SRAM circuits; low-leakage techniques for nanoscale CMOS circuits; thermal effects in carbon nanotube VLSI interconnects; lumped electro-thermal modeling and analysis of carbon nanotube interconnects; high-level synthesis of digital integrated circuits in the nanoscale mobile electronics era; SPICEless RTL design optimization of nanoelectronic digital integrated circuits; green on-chip inductors for three-dimensional integrated circuits; 3D network-on-chips; and DNA computing. This book is essential reading for researchers, research-focused industry designers/developers, and advanced students working on next-generation electronic devices and circuits.

Electromechanical Coupling Theory, Methodology and Applications for High-Performance Microwave Equipment Electromechanical Coupling Theory, Methodology, and Applications for High-Performance Microwave Equipment is an authoritative and up-to-date guide to the structural, mechanical, and electrical aspects of electromechanical coupling. Addressing control, electromagnetism, and structural engineering, this comprehensive reference covers the electromechanical coupling of high-performance microwave electronic equipment (MEE), such as antennas, radar, large radio telescopes, and telecommunication and navigation equipment. The book is divided into four main sections, beginning with an introduction to electromechanical coupling (EMC) theory and a detailed description of the multi-field coupling model (MFCM) and the influence mechanism (IM) of nonlinear factors of antenna-servo-feeder systems on performance. Subsequent sections discuss MFCM- and IM-based design methodology, EMC-based measurement and testing, computer software for coupling analysis and design of electronic equipment, and various engineering applications of EMC theory and the IM of typical electronic equipment. In addition, the book: Discusses information and data transfer in electromagnetic fields, mechanical and structural deformation fields, and temperature fields Explains how high-performance microwave electronic equipment differs from traditional mechanical equipment Addresses EMC-based and general design-vector based optimization of electronic equipment design Describes applications such as a gun-guided radar system for warships and a large-diameter antenna for moon exploration Includes evaluation criteria to validate MFCM/IM design theory and methodology Electromechanical Coupling Theory, Methodology, and Applications for High-Performance Microwave Equipment is essential reading for circuit designers, microwave engineers, researchers working with high-frequency microwave engineering, and engineers working with integrated circuits in radar, communications, IoT, antenna engineering, and remote sensing.

Nanostructured silicon-germanium (SiGe) opens up the prospects of novel and enhanced electronic device performance, especially for semiconductor devices. Silicon-germanium (SiGe) nanostructures reviews the materials science of nanostructures and their properties and applications in different electronic devices. The introductory part one covers the structural properties of SiGe nanostructures, with a further chapter discussing electronic band structures of SiGe alloys. Part two concentrates on the formation of SiGe nanostructures, with chapters on different methods of crystal growth such as molecular beam epitaxy and chemical vapour deposition. This part also includes chapters covering strain engineering and modelling. Part three covers the material properties of SiGe nanostructures, including chapters on such topics as strain-induced defects, transport properties and microcavities and quantum cascade laser structures. In Part four, devices utilising SiGe alloys are discussed. Chapters cover ultra large scale integrated applications, MOSFETs and the use of SiGe in different types of transistors and optical devices. With its distinguished editors and team of international contributors, Silicon-germanium (SiGe) nanostructures is a standard reference for researchers focusing on semiconductor devices and materials in industry and academia, particularly those interested in nanostructures.

The MEMS (Micro Electro-Mechanical Systems) market returned to growth in 2010. The total MEMS market is worth about $6.5 billion, up more than 11 percent from last year and nearly as high as its historic peak in 2007. MEMS devices are used across sectors as diverse as automotive, aerospace, medical, industrial process control, instrumentation and telecommunications - forming the nerve center of products including airbag crash sensors, pressure sensors, biosensors and ink jet printer heads. Part of the MEMS cluster within the Micro & Nano Technologies Series, this book covers the fabrication techniques and applications of thick film piezoelectric micro electromechanical systems (MEMS). It includes examples of applications where the piezoelectric thick films have been used, illustrating how the fabrication process relates to the properties and performance of the resulting device. Other topics include: top-down and bottom-up fabrication of thick film MEMS, integration of thick films with other materials, effect of microstructure on properties, device performance, etc.

Piezoelectric materials produce electric charges on their surfaces as a consequence of applying mechanical stress. They are used in the fabrication of a growing range of devices such as transducers (used, for example, in ultrasound scanning), actuators (deployed in such areas as vibration suppression in optical and microelectronic engineering), pressure sensor devices (such as gyroscopes) and increasingly as a way of producing energy. Their versatility has led to a wealth of research to broaden the range of piezoelectric materials and their potential uses. Advanced piezoelectric materials: science and technology provides a comprehensive review of these new materials, their properties, methods of manufacture and applications. After an introductory overview of the development of piezoelectric materials, Part one reviews the various types of piezoelectric material, ranging from lead zirconate titanate (PZT) piezo-ceramics, relaxor ferroelectric ceramics, lead-free piezo-ceramics, quartz-based piezoelectric materials, the use of lithium niobate and lithium in piezoelectrics, single crystal piezoelectric materials, electroactive polymers (EAP) and piezoelectric composite materials. Part two discusses how to design and fabricate piezo-materials with chapters on piezo-ceramics, single crystal preparation techniques, thin film technologies, aerosol techniques and manufacturing technologies for piezoelectric transducers. The final part of the book looks at applications such as high-power piezoelectric materials and actuators as well as the performance of piezoelectric materials under stress. With its distinguished editor and international team of expert contributors Advanced piezoelectric materials: science and technology is a standard reference for all those researching piezoelectric materials and using them to develop new devices in such areas as microelectronics, optical, sound, structural and biomedical engineering.

The development of nitride-based light-emitting diodes (LEDs) has led to advancements in high-brightness LED technology for solid-state lighting, handheld electronics, and advanced bioengineering applications. Nitride Semiconductor Light-Emitting Diodes (LEDs) reviews the fabrication, performance, and applications of this technology that encompass the state-of-the-art material and device development, and practical nitride-based LED design considerations. Part one reviews the fabrication of nitride semiconductor LEDs. Chapters cover molecular beam epitaxy (MBE) growth of nitride semiconductors, modern metalorganic chemical vapor deposition (MOCVD) techniques and the growth of nitride-based materials, and gallium nitride (GaN)-on-sapphire and GaN-on-silicon technologies for LEDs. Nanostructured, non-polar and semi-polar nitride-based LEDs, as well as phosphor-coated nitride LEDs, are also discussed. Part two covers the performance of nitride LEDs, including photonic crystal LEDs, surface plasmon enhanced LEDs, color tuneable LEDs, and LEDs based on quantum wells and quantum dots. Further chapters discuss the development of LED encapsulation technology and the fundamental efficiency droop issues in gallium indium nitride (GaInN) LEDs. Finally, part three highlights applications of nitride LEDs, including liquid crystal display (LCD) backlighting, infrared emitters, and automotive lighting. Nitride Semiconductor Light-Emitting Diodes (LEDs) is a technical resource for academics, physicists, materials scientists, electrical engineers, and those working in the lighting, consumer electronics, automotive, aviation, and communications sectors.

Optical MEMS are micro-electromechanical systems merged with micro-optics. They allow sensing or manipulating optical signals on a very small size scale using integrated mechanical, optical, and electrical systems and hold great promise specifically in biomedical applications, among others. This book describes the current state of optical MEMS in chemical and biomedical analysis with topics covered including fabrication and manufacturing technology for optical MEMS; electrothermally-actuated MEMS scanning micromirrors and their applications in endoscopic optical coherence tomography imaging; electrowetting-based microoptics; microcameras; biologically inspired optical surfaces for miniaturized optical systems; tuning nanophotonic cavities with nanoelectromechanical systems; quantum dot nanophotonics - micropatterned excitation, microarray imaging and hyperspectral microscopy; photothermal microfluidics; optical manipulation for biomedical applications; polymer-based optofluidic lenses; and nanostructured aluminum oxide-based optical biosensing and imaging. Bringing together topics representing the most exciting progress made and current trends in the field in recent years, this book is an essential addition to the bookshelves of researchers and advanced students working on developing, manufacturing or applying optical MEMS and other sensors.

Advances in Imaging and Electron Physics merges two long-running serials, Advances in Electronics and Electron Physics and Advances in Optical and Electron Microscopy. The series features extended articles on the physics of electron devices, especially semiconductor devices, particle optics at high and low energies, microlithography, image science, digital image processing, electromagnetic wave propagation, electron microscopy, and the computing methods used in all these domains.

In the era of cyber-physical systems, the area of control of complex systems has grown to be one of the hardest in terms of algorithmic design techniques and analytical tools. The 23 chapters, written by international specialists in the field, cover a variety of interests within the broader field of learning, adaptation, optimization and networked control. The editors have grouped these into the following 5 sections: "Introduction and Background on Control Theory", "Adaptive Control and Neuroscience", "Adaptive Learning Algorithms", "Cyber-Physical Systems and Cooperative Control", "Applications". The diversity of the research presented gives the reader a unique opportunity to explore a comprehensive overview of a field of great interest to control and system theorists. This book is intended for researchers and control engineers in machine learning, adaptive control, optimization and automatic control systems, including Electrical Engineers, Computer Science Engineers, Mechanical Engineers, Aerospace/Automotive Engineers, and Industrial Engineers. It could be used as a text or reference for advanced courses in complex control systems. * Collection of chapters from several well-known professors and researchers that will showcase their recent work * Presents different state-of-the-art control approaches and theory for complex systems * Gives algorithms that take into consideration the presence of modelling uncertainties, the unavailability of the model, the possibility of cooperative/non-cooperative goals and malicious attacks compromising the security of networked teams * Real system examples and figures throughout, make ideas concrete

Advances in Imaging and Electron Physics merges two long-running serials, Advances in Electronics and Electron Physics and Advances in Optical and Electron Microscopy. The series features extended articles on the physics of electron devices (especially semiconductor devices), particle optics at high and low energies, microlithography, image science, digital image processing, electromagnetic wave propagation, electron microscopy, and the computing methods used in all these domains.

The demand for ever smaller and portable electronic devices has driven metal oxide semiconductor-based (CMOS) technology to its physical limit with the smallest possible feature sizes. This presents various size-related problems such as high power leakage, low-reliability, and thermal effects, and is a limit on further miniaturization. To enable even smaller electronics, various nanodevices including carbon nanotube transistors, graphene transistors, tunnel transistors and memristors (collectively called post-CMOS devices) are emerging that could replace the traditional and ubiquitous silicon transistor. This book explores these nanoelectronics at the device level including modelling and design. Topics covered include high-k dielectrics; high mobility n and p channels on gallium arsenide and silicon substrates using interfacial misfit dislocation arrays; anodic metal-insulator-metal (MIM) capacitors; graphene transistors; junction and doping free transistors; nanoscale gigh-k/metal-gate CMOS and FinFET based logic libraries; multiple-independent-gate nanowire transistors; carbon nanotubes for efficient power delivery; timing driven buffer insertion for carbon nanotube interconnects; memristor modeling; and neuromorphic devices and circuits. This book is essential reading for researchers, research-focused industry designers/developers, and advanced students working on next-generation electronic devices and circuits.

The rapid growth of the use of optoelectronic technology in Information and Communications Technology (ICT) has seen a complementary increase in the performance of such technologies. As a result, optoelectronic technologies have replaced the technology of electronic interconnections. However, the control of manufacturing techniques for optoelectronic systems is more delicate than that of microelectronic technologies. This practical resource, divided into four chapters, examines several methods for determining the reliability of infrared LED devices. The primary interest of this book focuses on methods of extracting fundamental parameters from the electrical and optical characterization of specific zones in components. Failure mechanisms are identified based on measured performance before and after aging tests. Knowledge of failure mechanisms allows formulation of degradation laws, which in turn allow an accurate lifetime distribution for specific devices to be proposed.

Very Large Scale Integration (VLSI) Systems refer to the latest development in computer microchips which are created by integrating hundreds of thousands of transistors into one chip. Emerging research in this area has the potential to uncover further applications for VSLI technologies in addition to system advancements. Design and Modeling of Low Power VLSI Systems analyzes various traditional and modern low power techniques for integrated circuit design in addition to the limiting factors of existing techniques and methods for optimization. Through a research-based discussion of the technicalities involved in the VLSI hardware development process cycle, this book is a useful resource for researchers, engineers, and graduate-level students in computer science and engineering.

There have been major recent advances in robotic systems that can replace humans in undertaking hazardous activities in demanding or dangerous environments. Published in association with the CLAWAR (Climbing and Walking Robots and Associated Technologies Association) (www.clawar.org), this important book reviews the development of robotic systems for de-mining and other risky activities such as fire-fighting. Part one provides an overview of the use of robots for humanitarian de-mining work. Part two discusses the development of sensors for mine detection whilst Part thee reviews developments in both teleoperated and autonomous robots. Building on the latter, Part four concentrates on robot autonomous navigation. The final part of the book reviews research on multi-agent-systems (MAS) and the multi-robotics-systems (MRS), promising tools that take into account modular design of mobile robots and the use of several robots in multi-task missions. With its distinguished editors and international team of contributors, Using robots in hazardous environments: landmine detection, de-mining and other applications is a standard reference for all those researching the use of robots in hazardous environments as well as government and other agencies wishing to use robots for dangerous tasks such as landmine detection and disposal.

Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field.

This book gives a review of the principles, methods and techniques of important and emerging research topics and technologies in Channel Coding, including theory, algorithms, and applications. Edited by leading people in the field who, through their reputation, have been able to commission experts to write on a particular topic. With this reference source you will: Quickly grasp a new area of research Understand the underlying principles of a topic and its applications Ascertain how a topic relates to other areas and learn of the research issues yet to be resolved

Unlike electroplating, electroless plating allows uniform deposits of coating materials over all surfaces, regardless of size, shape and electrical conductivity. Electroless copper and nickel-phosphorus deposits provide protective and functional coatings in industries as diverse as electronics, automotive, aerospace and chemical engineering. This book discusses the latest research in electroless depositions. After an introductory chapter, part one focuses on electroless copper depositions reviewing such areas as surface morphology and residual stress, modelling surface structure, adhesion strength of electroless copper deposit, electrical resistivity and applications of electroless copper deposits. Part two goes on to look at electroless nickel-phosphorus depositions with chapters on the crystallisation of nickel-phosphorus deposits, modelling the thermodynamics and kinetics of crystallisation of nickel-phosphorus deposits, artificial neural network (ANN) modelling of crystallisation temperatures, hardness evolution of nickel-phosphorus deposits and applications of electroless nickel-phosphorus plating. Written by leading experts in the field Electroless copper and nickel-phosphorus plating: Processing, characterisation and modelling is an invaluable guide for researchers studying electroless deposits or materials science as well as for those working in the chemical, oil and gas, automotive, electronics and aerospace industries.

Microbiorobotics is a new engineering discipline that inherently involves a multidisciplinary approach (mechanical engineering, cellular biology, mathematical modeling, control systems, synthetic biology, etc). Building robotics system in the micro scale is an engineering task that has resulted in many important applications, ranging from micromanufacturing techniques to cellular manipulation. However, it is also a very challenging engineering task. One of the reasons is because many engineering ideas and principles that are used in larger scales do not scale well to the micro-scale. For example, locomotion principles in a fluid do not function in the same way, and the use of rotational motors is impractical because of the difficulty of building of the required components.

Integrated Lasers on Silicon provides a comprehensive overview of the state-of-the-art use of lasers on silicon for photonic integration. The authors demonstrate the need for efficient laser sources on silicon, motivated by the development of on-board/on-chip optical interconnects and the different integration schemes available. The authors include detailed descriptions of Group IV-based lasers, followed by a presentation of the results obtained through the bonding approach (hybrid III-V lasers). The monolithic integration of III-V semiconductor lasers are explored, concluding with a discussion of the different kinds of cavity geometries benchmarked with respect to their potential integration on silicon in an industrial environment.