This book explores emerging topics in atomic- and nano-scale electronics after the era of Moore's Law, covering both the physical principles behind, and technological implementations for many devices that are now expected to become key elements of the future of nanoelectronics beyond traditional complementary metal-oxide semiconductors (CMOS). Moore's law is not a physical law itself, but rather a visionary prediction that has worked well for more than 50 years but is rapidly coming to its end as the gate length of CMOS transistors approaches the length-scale of only a few atoms. Thus, the key question here is: "What is the future for nanoelectronics beyond CMOS?" The possible answers are found in this book. Introducing novel quantum devices such as atomic-scale electronic devices, ballistic devices, memristors, superconducting devices, this book also presents the reader with the physical principles underlying new ways of computing, as well as their practical implementation. Topics such as quantum computing, neuromorphic computing are highlighted here as some of the most promising candidates for ushering in a new era of atomic-scale electronics beyond CMOS.

This book covers remarkable contemporary nanomaterials such as carbon nanomaterials, nanoclays, quantum dots, MXene, and metal-organic frameworks. Each chapter discusses the synthesis techniques, characterization methods, properties, and the nanomaterials' use in different aspects of biomedical, energy, polymers, material construction, biosensors, coatings, and catalysis. Moreover, commercialization challenges and environmental risks of nanomaterials are also covered in depth. The book provides an understanding of the fundamental properties, limitations and challenges in nanomaterials synthesis, serving as a valuable resource for researchers, graduate students, academicians, and consultants working with nanomaterials for engineering applications.

The volume includes 30 contributions from the 3rd International Workshop on Advanced Dynamics and Model Based Control of Structures and Machines representing the frontiers in the mechanics of controlled machines and structures. The Workshop, held in Perm, Russia in September 2017 continued a series of international workshops, starting in with the Japan - Austria Joint Workshop on Mechanics and Model Based Control of Smart Materials and Structures, the Russia - Austria Joint Workshop on Advanced Dynamics and Model Based Control of Structures and Machines and the first two editions of the International Workshop on Advanced Dynamics and Model Based Control of Structures and Machines. The previous workshops took place in Linz, Austria in September 2008 and April 2010, in St. Petersburg, Russia in July 2012 and in Vienna, Austria in September 2015. The up-to-date contributions are authored by internationally re-known leading experts in dynamics and control representing a broad spectrum of topics in the field of Advanced Structures and Machines; both, with respect to theoretical aspects as well as applications to contemporary engineering problems.

The series Topics in Current Chemistry Collections presents critical reviews from the journal Topics in Current Chemistry organized in topical volumes. The scope of coverage is all areas of chemical science including the interfaces with related disciplines such as biology, medicine and materials science. The goal of each thematic volume is to give the non-specialist reader, whether in academia or industry, a comprehensive insight into an area where new research is emerging which is of interest to a larger scientific audience. Each review within the volume critically surveys one aspect of that topic and places it within the context of the volume as a whole. The most significant developments of the last 5 to 10 years are presented using selected examples to illustrate the principles discussed. The coverage is not intended to be an exhaustive summary of the field or include large quantities of data, but should rather be conceptual, concentrating on the methodological thinking that will allow the non-specialist reader to understand the information presented. Contributions also offer an outlook on potential future developments in the field.

This book studies electron resonant tunneling in two- and three-dimensional quantum waveguides of variable cross-sections in the time-independent approach. Mathematical models are suggested for the resonant tunneling and develop asymptotic and numerical approaches for investigating the models. Also, schemes are presented for several electronics devices based on the phenomenon of resonant tunneling. Compared to its first edition, this book includes four new chapters, redistributes the content between chapters and modifies the estimates of the remainders in the asymptotics of resonant tunneling characteristics. The book is addressed to mathematicians, physicists, and engineers interested in waveguide theory and its applications in electronics.

This book provides essential insights into designing a localized DNA circuit to promote the rate of desired hybridization reactions over undesired leak reactions in the bulk solution. The area of dynamic DNA nanotechnology, or DNA circuits, holds great promise as a highly programmable toolbox that can be used in various applications, including molecular computing and biomolecular detection. However, a key bottleneck is the recurring issue of circuit leakage. The assembly of the localized circuit is dynamically driven by the recognition of biomolecules - a different approach from most methods, which are based on a static DNA origami assembly. The design guidelines for individual reaction modules presented here, which focus on minimizing circuit leakage, are established through NUPACK simulation and tested experimentally - which will be useful for researchers interested in adapting the concepts for other contexts. In the closing section, the design concepts are successfully applied to the biomolecular sensing of a broad range of targets including the single nucleotide mutations, proteins, and cell surface receptors.

This book focuses on novel bismuth-containing alloys and nanostructures, covering a wide range of materials from semiconductors, topological insulators, silica optical fibers and to multiferroic materials. It provides a timely overview of bismuth alloys and nanostructures, from material synthesis and physical properties to device applications and also includes the latest research findings. Bismuth is considered to be a sustainable and environmentally friendly element, and has received increasing attention in a variety of innovative research areas in recent years. The book is intended as a reference resource and textbook for graduate students and researchers working in these fields.

This book provides a complete overview of a wide range of nanomaterials from their synthesis and characterization to current and potential applications with special focus on the use of such nano-based products as functional agents in biomedical, environmental and industrial applications. It addresses the intrinsic relationship between aspects involving the synthesis of nanocompounds, their bio-physico-chemical properties and their interactions occurring in biomedical, environmental and industrial matrix. This book is of interest to engineers, academics and research scholars working in these fields.

This book brings together selective and specific chapters on nanoscale carbon and applications, thus making it unique due to its thematic content. It provides access to the contemporary developments in carbon nanomaterial research in electronic applications. Written by professionals with thorough expertise in similar broad area, the book is intended to address multiple aspects of carbon research in a single compiled edition. It targets professors, scientists and researchers belonging to the areas of physics, chemistry, engineering, biology and medicine, and working on theory, experiment and applications of carbon nanomaterials.

This book discusses physical design and mask synthesis of directed self-assembly lithography (DSAL). It covers the basic background of DSAL technology, physical design optimizations such as placement and redundant via insertion, and DSAL mask synthesis as well as its verification. Directed self-assembly lithography (DSAL) is a highly promising patterning solution in sub-7nm technology.

This book provides novel approach to the diagnosis of complex technical systems that are widely used in various kinds of transportation, energy, metallurgy, metalworking, fuels, mining, chemical, paper industries, etc. Effective diagnostic systems are necessary for the early detection of errors in mechatronic systems, for the organization of maintenance and for the assessment of the performed service quality. Unfortunately, the practical use of AI in the diagnosis of mechatronic systems is still quite limited and the inability to build effective mechatronic systems leads to significant economic losses and dangers. The main aim of this book is to contribute to knowledge within the topic of diagnostics of mechatronic systems by the analysis of the elements reliability characteristics, using methods, models and algorithms for diagnostics and by studying examples of model diagnostic systems using AI methods based on neural networks, fuzzy inference systems and genetic algorithms.

This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes-bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond-pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond-pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond-pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry Features 120 figures and tables Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.

This book addresses the fundamental challenges underlying bioelectronics and tissue interface for clinical investigation. Appropriate for biomedical engineers and researchers, the authors cover topics ranging from retinal implants to restore vision, implantable circuits for neural implants, and intravascular electrochemical impedance to detect unstable plaques. In addition to these chapters, the authors also document the approaches and issues of multi-scale physiological assessment and monitoring in both humans and animal models for health monitoring and biological investigations; novel biomaterials such as conductive and biodegradable polymers to be used in biomedical devices; and the optimization of wireless power transfer via inductive coupling for batteryless and wireless implantable medical devices. In addition to engineers and researchers, this book is also an ideal supplementary or reference book for a number of courses in biomedical engineering programs, such as bioinstrumentation, MEMS/BioMEMS, bioelectronics and sensors, and more. Analyzes and discusses the electrode-tissue interfaces for optimization of biomedical devices. Introduces novel biomaterials to be used in next-generation biomedical devices. Discusses high-frequency transducers for biomedical applications.

This thesis builds on recent innovations in multi-phase emulsion droplet design to demonstrate that emulsion morphologies enable a useful variety of dynamic optical phenomena. Despite the highly dynamic nature of fluid morphologies and their utility for stimuli-responsive, dynamic optical materials and devices, fluid matter is underrepresented in optical technology. Using bi-phase emulsion droplets as refractive micro-optical components, this thesis realizes micro-scale fluid compound lenses with optical properties that vary in response to changes in chemical concentrations, structured illumination, and thermal gradients. Theoretical considerations of emulsions as optical components are used to explain a previously unrecognized total internal reflection-enabled light interference phenomenon in emulsion droplets that results in rich structural coloration. While this work is focused on the fundamental optics of emulsion droplets, it also facilitates the use of light-emitting emulsion morphologies as chemo-optical transducers for early-stage food-borne pathogen detection. This thesis beautifully demonstrates the virtue of fundamental interdisciplinary exploration of unconventional material systems at the interface of optics, chemistry, and materials science, and the benefits arising from translation of the acquired knowledge into specific application scenarios.

This book comprises select papers presented at the Conference on Innovative Product Design and Intelligent Manufacturing System (IPDIMS 2020). The book discusses the latest methods and advanced tools from different areas of design and manufacturing technology. The main topics covered include design methodologies, industry 4.0, smart manufacturing, and advances in robotics among others. The contents of this book are useful for academics as well as professionals working in the areas of industrial design, mechatronics, robotics, and automation.

This book was developed with the goal of providing an easily understood text for those users of the scanning electron microscope (SEM) who have little or no background in the area. The SEM is routinely used to study the surface structure and chemistry of a wide range of biological and synthetic materials at the micrometer to nanometer scale. Ease-of-use, typically facile sample preparation, and straightforward image interpretation, combined with high resolution, high depth of field, and the ability to undertake microchemical and crystallographic analysis, has made scanning electron microscopy one of the most powerful and versatile techniques for characterization today. Indeed, the SEM is a vital tool for the characterization of nanostructured materials and the development of nanotechnology. However, its wide use by professionals with diverse technical backgrounds-including life science, materials science, engineering, forensics, mineralogy, etc., and in various sectors of government, industry, and academia-emphasizes the need for an introductory text providing the basics of effective SEM imaging.A Beginners' Guide to Scanning Electron Microscopy explains instrumentation, operation, image interpretation and sample preparation in a wide ranging yet succinct and practical text, treating the essential theory of specimen-beam interaction and image formation in a manner that can be effortlessly comprehended by the novice SEM user. This book provides a concise and accessible introduction to the essentials of SEM includes a large number of illustrations specifically chosen to aid readers' understanding of key concepts highlights recent advances in instrumentation, imaging and sample preparation techniques offers examples drawn from a variety of applications that appeal to professionals from diverse backgrounds.

This book covers the performance aspects of nanocomposite supercapacitor materials based on transition metal oxides, activated carbon, carbon nanotubes, carbon nanofibers, graphene and conducting polymers. It compares the performance of simple electrode materials versus binary and ternary composites, while highlighting the advantages and challenges of different supercapacitor electrode materials. This book is part of the Handbook of Nanocomposite Supercapacitor Materials. Supercapacitors have emerged as promising devices for electrochemical energy storage, playing an important role in energy harvesting for meeting the current demands of increasing global energy consumption. The handbook covers the materials science and engineering of nanocomposite supercapacitors, ranging from their general characteristics and performance to materials selection, design and construction. Covering both fundamentals and recent developments, this handbook serves a readership encompassing students, professionals and researchers throughout academia and industry, particularly in the fields of materials chemistry, electrochemistry, and energy storage and conversion. It is ideal as a reference work and primary resource for any introductory senior-level undergraduate or beginning graduate course covering supercapacitors.

This book provides a comprehensive introduction to the methods and variety of Kelvin probe force microscopy, including technical details. It also offers an overview of the recent developments and numerous applications, ranging from semiconductor materials, nanostructures and devices to sub-molecular and atomic scale electrostatics. In the last 25 years, Kelvin probe force microscopy has developed from a specialized technique applied by a few scanning probe microscopy experts into a tool used by numerous research and development groups around the globe. This sequel to the editors' previous volume "Kelvin Probe Force Microscopy: Measuring and Compensating Electrostatic Forces," presents new and complementary topics. It is intended for a broad readership, from undergraduate students to lab technicians and scanning probe microscopy experts who are new to the field.

This book focuses on the preparation and characterisation of polyvinyl alcohol (PVA)/ halloysite nanotube (HNT) bionanocomposite films with different HNT contents for potential use in food packaging. It examines the effect of material composition and nanofiller content on mechanical, thermal and optical properties in relation to their morphological structures, and also comprehensively describes the water resistance, biodegradation and migration rates of such bionanocomposites, as well as their barrier properties in terms of water vapour transmission, and water vapour, air and oxygen permeabilities. Further, this book discusses the use of Nielsen model and Cussler model to predict the relative permeability of bionanocomposites, demonstrating that Nielsen model is more effective and in better agreement with experimental data obtained. Lastly, it discusses the application of bionanocomposite films in food packaging to prolong the shelf life of freshly cut avocados and peaches.

Starting from a broad overview of heat transport based on the Boltzmann Transport Equation, this book presents a comprehensive analysis of heat transport in bulk and nanomaterials based on a kinetic-collective model (KCM). This has become key to understanding the field of thermal transport in semiconductors, and represents an important stride. The book describes how heat transport becomes hydrodynamic at the nanoscale, propagating very much like a viscous fluid and manifesting vorticity and friction-like behavior. It introduces a generalization of Fourier's law including a hydrodynamic term based on collective behavior in the phonon ensemble. This approach makes it possible to describe in a unifying way recent experiments that had to resort to unphysical assumptions in order to uphold the validity of Fourier's law, demonstrating that hydrodynamic heat transport is a pervasive type of behavior in semiconductors at reduced scales.

This book presents some of the latest achievements in nanotechnology and nanomaterials from leading researchers in Ukraine, Europe, and beyond. It features selected peer-reviewed contributions from participants in the 5th International Science and Practice Conference Nanotechnology and Nanomaterials (NANO2017) held in Chernivtsi, Ukraine on August 23-26, 2017. The International Conference was organized jointly by the Institute of Physics of the National Academy of Sciences of Ukraine, Ivan Franko National University of Lviv (Ukraine), University of Tartu (Estonia), University of Turin (Italy), and Pierre and Marie Curie University (France). Internationally recognized experts from a wide range of universities and research institutions share their knowledge and key results on topics ranging from nanooptics and nanoplasmonics to interface studies. This book's companion volume also addresses topics such as energy storage and biomedical applications.

This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple's iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP - such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. - are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.

Cyber-Physical and Gentelligent Systems in Manufacturing and Life Cycle explores the latest technologies resulting from the integration of sensing components throughout the production supply chain, and the resulting possibilities to improve efficiency, flexibility, and product quality. The authors present cutting edge research into data storage in components, communication devices, data acquisition, as well as new industrial applications. Detailed technical descriptions of the tools are presented in addition to discussions of how these systems have been used, the benefits they provide, and what industry problems they could tackle in the future. This is essential reading for researchers and production engineers interested in the potential of cyber physical systems to optimize all parts of the supply chain.

Processing of polymer nanocomposites usually requires special attention since the resultant structure-micro- and nano-level, is directly influenced by among other factors, polymer/nano-additive chemistry and the processing strategy. This book consolidates knowledge, from fundamental to product development, on polymer nanocomposites processing with special emphasis on the processing-structure-property-performance relationships in a wide range of polymer nanocomposites. Furthermore, this book focuses on emerging processing technologies such as electrospinning, which has very exciting applications ranging from medical to filtration. Additionally, the important role played by the nanoparticles in polymer blends structures has been illustrated in the current book, with special focus on fundamental aspects and properties of nanoparticles migration and interface crossing in immiscible polymer blend nanocomposites. This book introduces readers to nanomaterials and polymer nanocomposites processing. After defining nanoparticles and polymer nanocomposites and discussing environmental aspects, the second chapter focuses on the synthesis and functionalization of nanomaterials with applications in polymers. A brief overview on nanoclay and nanoclay-containing polymer nanocomposites is provided in third chapter. The fourth chapter provides an overview of the polymer nanocomposites structural elucidation techniques, such as X-ray diffraction and scattering, microscopy and spectroscopy, rheology. The fifth chapter is dedicated to the polymer nanocomposites processing technologies, among which electrospinning, which has very exciting applications ranging from medical to filtration. The last chapter provides an overview on how melt-processing strategy impact structure and mechanical properties of polymer nanocomposites by taking polypropylene-clay nanocomposite as a model system. The book is useful to undergraduate and postgraduate students (polymer engineering, materials science & engineering, chemical & process engineering), as well as research & development personnel, engineers, and material scientists.

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.