This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.

Device Architecture and Materials for Organic Light-Emitting Devices focuses on the design of new device and material concepts for organic light-emitting devices, thereby targeting high current densities and an improved control of the triplet concentration. A new light-emitting device architecture, the OLED with field-effect electron transport, is demonstrated. This device is a hybrid between a diode and a field-effect transistor. Compared to conventional OLEDs, the metallic cathode is displaced by one to several micrometers from the light-emitting zone, reducing optical absorption losses. The electrons injected by the cathode accumulate at an organic heterojunction and are transported to the light-emission zone by field-effect. High mobilities for charge carriers are achieved in this way, enabling a high current density and a reduced number of charge carriers in the device. Pulsed excitation experiments show that pulses down to 1 us can be applied to this structure without affecting the light intensity, suggesting that pulsed excitation might be useful to reduce the accumulation of triplets in the device. The combination of all these properties makes the OLED with field-effect electron transport particularly interesting for waveguide devices and future electrically pumped lasers. In addition, triplet-emitter doped organic materials, as well as the use of triplet scavengers in conjugated polymers are investigated.

This book includes original, peer-reviewed research papers from the 2022 10th China Conference on Command and Control (C2 2022), held in Beijing, China on July 7-9, 2022. The topics covered include but are not limited to: Theories, Modelling and Simulation, System Engineering Technology for Intelligent Command and Control, 5G and Intelligent Command, Control and Management Integration Technology, Joint Cooperative Command and Control Organization Management, Agility in the Network Age, Cyberspace Situational Awareness Technology, CPS Parallel Management and Control Unmanned Systems, Intelligent Military Camp Technology, Architecture Design for Intelligent Air Traffic Control System, Human-Machine Interaction and Virtual Reality, Swarm Intelligence and Cooperative Control, Intelligent Gaming Theory and Technology.The papers showcased here share the latest findings on theories, algorithms and applications in command and control, making the book a valuable asset for researchers, engineers, and university students alike.

1V CMOS Gm-C Filters: Design and Applications discusses the design aspects of transconductor and Gm-C filter circuits, with a special focus on 1V circuit implementations. The emphasis is on high linearity voltage-to-current blocks for wireless and wireline applications, and the designs cover up to very high speed specifications.

1V CMOS Gm-C Filters: Design and Applications provides a clear introduction of low voltage architectures and yields insight into the influence of circuit non-idealities. The fully CMOS implementation could be useful for wireless and wireline applications. The basic design concepts can be easily constructed through the illustration of this book. This book can be provided for engineers and researchers who are interested in the transconductor and Gm-C filter. It is also a good reference for the course related to analog integrated circuit design.

This Open Access book celebrates Professor Peter Marwedel's outstanding achievements in compilers, embedded systems, and cyber-physical systems. The contributions in the book summarize the content of invited lectures given at the workshop "Embedded Systems" held at the Technical University Dortmund in early July 2019 in honor of Professor Marwedel's seventieth birthday. Provides a comprehensive view from leading researchers with respect to the past, present, and future of the design of embedded and cyber-physical systems; Discusses challenges and (potential) solutions from theoreticians and practitioners on modeling, design, analysis, and optimization for embedded and cyber-physical systems; Includes coverage of model verification, communication, software runtime systems, operating systems and real-time computing.

This book provides a comprehensive and up-to-date guide to the AMOLED technologies and applications which have become industry standard in a range of devices, from small mobile displays to large televisions. Unlike other books on the topic, which cover the fundamentals, materials, processing, and manufacturing of OLEDs, this one-stop book discusses the core components, such as TFT backplanes, OLED materials and devices, and driving schematics together in one volume with chapters written by experts from leading international companies in the field of OLED materials and OLED TVs. It also examines emerging areas, such as micro-LEDs, displays using quantum dots, and AR & VR displays. Presenting the latest research trends as well as the basic principles of each topic, this book is intended for undergraduate and postgraduate students taking display-related courses, new researchers, and engineers in related fields.

Quality Electronic Design (QED)'s landscape spans a vast region where territories of many participating disciplines and technologies overlap. This book explores the latest trends in several key topics related to quality electronic design, with emphasis on Hardware Security, Cybersecurity, Machine Learning, and application of Artificial Intelligence (AI). The book includes topics in nonvolatile memories (NVM), Internet of Things (IoT), FPGA, and Neural Networks.

This book focuses on control units, which are a vital part of modern digital systems, and responsible for the efficiency of controlled systems. The model of a finite state machine (FSM) is often used to represent the behavior of a control unit. As a rule, control units have irregular structures that make it impossible to design their logic circuits using the standard library cells. Design methods depend strongly on such factors as the FSM used, specific features of the logic elements implemented in the FSM logic circuit, and the characteristics of the control algorithm to be interpreted. This book discusses Moore and Mealy FSMs implemented with FPGA chips, including look-up table elements (LUT) and embedded memory blocks (EMB). It is crucial to minimize the number of LUTs and EMBs in an FSM logic circuit, as well as to make the interconnections between the logic elements more regular, and various methods of structural decompositions can be used to solve this problem. These methods are reduced to the presentation of an FSM circuit as a composition of different logic blocks, the majority of which implement systems of intermediate logic functions different (and much simpler) than input memory functions and FSM output functions. The structural decomposition results in multilevel FSM circuits having fewer logic elements than equivalent single-level circuits. The book describes well-known methods of structural decomposition and proposes new ones, examining their impact on the final amount of hardware in an FSM circuit. It is of interest to students and postgraduates in the area of Computer Science, as well as experts involved in designing digital systems with complex control units. The proposed models and design methods open new possibilities for creating logic circuits of control units with an optimal amount of hardware and regular interconnections.

Modeling Microprocessor Performance focuses on the development of a design and evaluation tool, named RIPE (Rensselaer Interconnect Performance Estimator). This tool analyzes the impact on wireability, clock frequency, power dissipation, and the reliability of single chip CMOS microprocessors as a function of interconnect, device, circuit, design and architectural parameters. It can accurately predict the overall performance of existing microprocessor systems. For the three major microprocessor architectures, DEC, PowerPC and Intel, the results have shown agreement within 10% on key parameters. The models cover a broad range of issues that relate to the implementation and performance of single chip CMOS microprocessors. The book contains a detailed discussion of the various models and the underlying assumptions based on actual design practices. As such, RIPE and its models provide an insightful tool into single chip microprocessor design and its performance aspects. At the same time, it provides design and process engineers with the capability to model, evaluate, compare and optimize single chip microprocessor systems using advanced technology and design techniques at an early design stage without costly and time consuming implementation. RIPE and its models demonstrate the factors which must be considered when estimating tradeoffs in device and interconnect technology and architecture design on microprocessor performance.

The book covers a variety of studies of organic semiconductors, from fundamental electronic states to device applications, including theoretical studies. Furthermore, innovative experimental techniques, e.g., ultrahigh sensitivity photoelectron spectroscopy, photoelectron yield spectroscopy, spin-resolved scanning tunneling microscopy (STM), and a material processing method with optical-vortex and polarization-vortex lasers, are introduced. As this book is intended to serve as a textbook for a graduate level course or as reference material for researchers in organic electronics and nanoscience from electronic states, fundamental science that is necessary to understand the research is described. It does not duplicate the books already written on organic electronics, but focuses mainly on electronic properties that arise from the nature of organic semiconductors (molecular solids). The new experimental methods introduced in this book are applicable to various materials (e.g., metals, inorganic and organic materials). Thus the book is also useful for experts working in physics, chemistry, and related engineering and industrial fields.

This book offers an overview of power electronic applications in the study of power integrated circuit (IC) design, collecting novel research ideas and insights into fast transient response to prevent the output voltage from dropping significantly at the undershoot. It also discusses techniques and training to save energy and increase load efficiency, as well as fast transient response and high efficiency, which are the most important factors for consumer products that implement power IC. Lastly, the book focuses on power electronics for system loop analysis and optimal compensation design to help users and engineers implement their applications. The book is a valuable resource for university researchers, power IC R&D engineers, application engineers and graduate students in power electronics who wish to learn about the power IC design principles, methods, system behavior, and applications in consumer products.

Cooperation is known as an effective strategy in nature to achieve individual or common goals by forming cooperative groups. As the cross over between nature and engineering has always been fruitful, Cooperation in Wireless Networks: Principles and Applications advocates the use of cooperative strategies in the field of wireless communications.Whether to cooperate or act autonomously, i.e., in a more selfish manner, has to be decided by each wireless terminal individually. Following the rule The real egoistic behavior is to cooperate, mutual aid among terminals will be applied if and only if it is beneficial for all group members.

PHEMT devices and their incorporation into advanced monolithic integrated circuits is the enabling technology for modern microwave/millimeter wave system applications. Although still in its infancy, PHEMT MIMIC technology is already finding applications in both military and commercial systems, including radar, communication and automotive technologies. The successful team in a globally competitive market is one in which the solid-state scientist, circuit designer, system engineer and technical manager are cognizant of those considerations and requirements that influence each other's function. This book provides the reader with a comprehensive review of PHEMT technology, including materials, fabrication and processing, device physics, CAD tools and modelling, monolithic integrated circuit technology and applications. Readers with a broad range of specialities in one or more of the areas of materials, processing, device physics, circuit design, system design and marketing will be introduced quickly to important basic concepts and techniques. The specialist who has specific PHEMT experience will benefit from the broad range of topics covered and the open discussion of practical issues. Finally, the publication offers an additional benefit, in that it presents a broad scope to both the researcher and manager, both of whom must be aware and educated to remain relevant in an ever-expanding technology base.

This book explores C-based design, implementation, and analysis of post-quantum cryptography (PQC) algorithms for signature generation and verification. The authors investigate NIST round 2 PQC algorithms for signature generation and signature verification from a hardware implementation perspective, especially focusing on C-based design, power-performance-area-security (PPAS) trade-offs and design flows targeting FPGAs and ASICs. Describes a comprehensive set of synthesizable c code base as well as the hardware implementations for the different types of PQC algorithms including lattice-based, code-based, and multivariate-based; Demonstrates the hardware (FPGA and ASIC) and hardware-software optimizations and trade-offs of the NIST round 2 signature-based PQC algorithms; Enables designers to build hardware implementations that are resilient to a variety of side-channels.

This book describes a wide variety of System-on-Chip (SoC) security threats and vulnerabilities, as well as their sources, in each stage of a design life cycle. The authors discuss a wide variety of state-of-the-art security verification and validation approaches such as formal methods and side-channel analysis, as well as simulation-based security and trust validation approaches. This book provides a comprehensive reference for system on chip designers and verification and validation engineers interested in verifying security and trust of heterogeneous SoCs.

This book provides a comprehensive study of the research outcomes on memristor emulator circuits and includes various analog applications as examples. The authors describe in detail how to design different types of memristor emulators, using active and passive components for different applications. Most of the emulator circuits presented in this book are new and are the outcomes of the authors' recent research. Coverage also includes the latest technological advances in memristor and memristor emulators. Readers will benefit from an understanding of the fundamental concepts and potential applications related to memristors, since these emulator circuits can be built in the laboratory using inexpensive, off-the-shelf circuit components. Introduces readers to memristor emulator circuit design, using regular off-the-shelf circuit components; Describes analog applications of memristors that can be verified by the proposed emulator circuits; Includes a brief overview of the updated mathematical models of the memristor device, with different material implementations; Equips readers to understand the three fingerprints of memristors, which make them unique, compared to the three known, passive elements (resistor, inductor and capacitor).

This textbook provides a compact but comprehensive treatment that guides students through the analysis of circuits, using LTspice (R). Ideal as a hands-on source for courses in Circuits, Electronics, Digital Logic and Power Electronics this text focuses on solving problems using market-standard software, corresponding to all key concepts covered in the classroom. The author uses his extensive classroom experience to guide students toward deeper understanding of key concepts, while they gain facility with software they will need to master for later studies and practical use in their engineering careers.

This book describes a comprehensive framework for hardware/software co-design, optimization, and use of robust, low-cost, and cyberphysical digital microfluidic systems. Readers with a background in electronic design automation will find this book to be a valuable reference for leveraging conventional VLSI CAD techniques for emerging technologies, e.g., biochips or bioMEMS. Readers from the circuit/system design community will benefit from methods presented to extend design and testing techniques from microelectronics to mixed-technology microsystems. For readers from the microfluidics domain, this book presents a new design and development strategy for cyberphysical microfluidics-based biochips suitable for large-scale bioassay applications. * Takes a transformative, "cyberphysical" approach towards achieving closed-loop and sensor feedback-driven biochip operation under program control; * Presents a "physically-aware" system reconfiguration technique that uses sensor data at intermediate checkpoints to dynamically reconfigure biochips; * Enables readers to simplify the structure of biochips, while facilitating the "general-purpose" use of digital microfluidic biochips for a wider range of applications.

This book, in essence the proceedings of a NATO Advanced Study Institute with the same title, is designed to provide in-depth coverage of many, but not all, of the major current applications of superconductivity, and of many that still are being developed. It will be of value to scientists and engineers who have interests in the research and production aspects of the technology, as well as in the applications themselves. The ftrst three chapters (by Clarke, Vrba and Wikswo) are devoted to an understanding of the principles, fabrication and uses of SQUID magnetometers and gradiometers, with the greatest emphasis on biomagnetism and nondestructive evaluation (NDE). For the most part, traditional low-temperature superconductor (LTS) SQUIDs are used, but particularly for NDE, high-temperature superconductor (HTS) SQUIDs are proving useful and often more convenient. The succeeding three chapters (by Przybysz, Likharev and Chaloupka) cover broader aspects of superconducting electronics. The ftrst two of these deal primarily with digital L TS circuits, while the third discusses in great detail passive component applications using HTS materials. Currently, HTS ftlters are undergoing intense J3-site testing at cellular telephone base stations. While it is clear that HTS ftlters outperform conventional ftlters in reducing signal loss and allowing for more channels in a given bandwidth, it isn't yet certain that the cellular telephone industry sees sufficient economic beneftts to make a ftrm decision to use HTS ftlters universally in its systems. If this application is generally adapted, the market for these ftlters should be quite large.

This book includes original, peer-reviewed research papers from the 2021 International Top-Level Forum on Engineering Science and Technology Development Strategy -- the 6th PURPLE MOUNTAIN FORUM on Smart Grid Protection and Control (PMF2021), held in Nanjing, China, on August 14-22, 2021. The accepted papers cover the following topics: 1. Advanced power transmission technology 2. AC/DC hybrid power grid technology3. Power Internet of Things Technology and Application4. Operation, control and protection of smart grid5. Active distribution network technology6. Power electronic technology and application7. New technology of substation automation8. Energy storage technology and application9. Application of new technologies such as artificial intelligence, blockchain, and big data10. Application of Information and Communication Technology11. Low-carbon energy planning and security12. Low-carbon operation of the power system13. Low-carbon energy comprehensive utilization technology14. Carbon trading and power market15. Carbon emission stream and carbon capture technology16. Energy saving and smart energy technology17. Analysis and evaluation of low-carbon efficiency of power system18. Carbon flow modelling in power system operationThe papers included in this proceeding share the latest research results and practical application examples on the methodologies and algorithms in these areas, which makes the book a valuable reference for researchers, engineers, and university students.

Cyber-physical systems are the natural extension of the so-called "Internet of Things". They are "systems of collaborating computational elements controlling physical entities". Cyber Physical Systems of Systems (CPSoS) are considered "The Next Computing Revolution" after Mainframe computing (60's-70's), Desktop computing & Internet (80's-90's) and Ubiquitous computing (00's); because all aspects of daily life are rapidly evolving towards humans interacting amongst themselves as well as their environment via computational devices (often mobile), and because in most cases systems will employ their computational capabilities to interact amongst themselves. CPSoS enable the physical world to merge with the cyber one. Using sensors, the embedded systems monitor and collect data from physical processes, such as the steering of a vehicle, energy consumption or human health functions. The systems are networked making the data globally available. CPSoS make it possible for software applications to directly interact with events in the physical world, for example to measure and react to changes in blood pressure or peaks in energy consumption. Embedded hardware and software systems crucially expand the functionality and competitiveness of vehicles, aircraft, medical equipment, production plants and household appliances. Connecting these systems to a virtual environment of globally networked services and information systems opens completely new areas of innovation and novel business platforms. Future CPSoS will have many sophisticated, interconnected parts that must instantaneously exchange, parse, and act on detailed data in a highly coordinated manner. Continued advances in science and engineering will be necessary to enable advances in design and development of these complex systems. Multi- scale, multi-layer, multi-domain, and multi-system integrated infrastructures will require new foundations in system science and engineering. Scientists and engineers with an understanding of otherwise physical systems will need to work in tandem with computer and information scientists to achieve effective, workable designs. In this tutorial, basic and advanced issues on the design of the future heterogeneous CPSoS are presented including relevant Blockchain technologies, reconfigurable systems, advanced sensor interfaces and human-centered design processes. Certain advanced tools for the design and implementation of the cyber parts of the CPSoS (i.e. FPGA design tools from Xilinx) are also covered.

This book describes the efficient implementation of public-key cryptography (PKC) to address the security challenges of massive amounts of information generated by the vast network of connected devices, ranging from tiny Radio Frequency Identification (RFID) tags to powerful desktop computers. It investigates implementation aspects of post quantum PKC and homomorphic encryption schemes whose security is based on the hardness of the ring-learning with error (LWE) problem. The work includes designing an FPGA-based accelerator to speed up computation on encrypted data in the cloud computer. It also proposes a more practical scheme that uses a special module called recryption box to assist homomorphic function evaluation, roughly 20 times faster than the implementation without this module.

This book covers the state-of-the-art research in design of modern electronic systems used in safety-critical applications such as medical devices, aircraft flight control, and automotive systems. The authors discuss lifetime reliability of digital systems, as well as an overview of the latest research in the field of reliability-aware design of integrated circuits. They address modeling approaches and techniques for evaluation and improvement of lifetime reliability for nano-scale CMOS digital circuits, as well as design algorithms that are the cornerstone of Computer Aided Design (CAD) of reliable VLSI circuits. In addition to developing lifetime reliability analysis and techniques for clocked storage elements (such as flip-flops), the authors also describe analysis and improvement strategies targeting commercial digital circuits.

Over the years there has been a large increase in the functionality available on a single integrated circuit. This has been mainly achieved by a continuous drive towards smaller feature sizes, larger dies, and better packing efficiency. However, this greater functionality has also resulted in substantial increases in the capital investment needed to build fabrication facilities. Given such a high level of investment, it is critical for IC manufacturers to reduce manufacturing costs and get a better return on their investment. The most obvious method of reducing the manufacturing cost per die is to improve manufacturing yield. Modern VLSI research and engineering (which includes design manufacturing and testing) encompasses a very broad range of disciplines such as chemistry, physics, material science, circuit design, mathematics and computer science. Due to this diversity, the VLSI arena has become fractured into a number of separate sub-domains with little or no interaction between them. This is the case with the relationships between testing and manufacturing. From Contamination to Defects, Faults and Yield Loss: Simulation and Applications focuses on the core of the interface between manufacturing and testing, i.e., the contamination-defect-fault relationship. The understanding of this relationship can lead to better solutions of many manufacturing and testing problems. Failure mechanism models are developed and presented which can be used to accurately estimate probability of different failures for a given IC. This information is critical in solving key yield-related applications such as failure analysis, fault modeling and design manufacturing.

Power supply current monitoring to detect CMOS IC defects during production testing quietly laid down its roots in the mid-1970s. Both Sandia Labs and RCA in the United States and Philips Labs in the Netherlands practiced this procedure on their CMOS ICs. At that time, this practice stemmed simply from an intuitive sense that CMOS ICs showing abnormal quiescent power supply current (IDDQ) contained defects. Later, this intuition was supported by data and analysis in the 1980s by Levi (RACD, Malaiya and Su (SUNY-Binghamton), Soden and Hawkins (Sandia Labs and the University of New Mexico), Jacomino and co-workers (Laboratoire d'Automatique de Grenoble), and Maly and co-workers (Carnegie Mellon University). Interest in IDDQ testing has advanced beyond the data reported in the 1980s and is now focused on applications and evaluations involving larger volumes of ICs that improve quality beyond what can be achieved by previous conventional means. In the conventional style of testing one attempts to propagate the logic states of the suspended nodes to primary outputs. This is done for all or most nodes of the circuit. For sequential circuits, in particular, the complexity of finding suitable tests is very high. In comparison, the IDDQ test does not observe the logic states, but measures the integrated current that leaks through all gates. In other words, it is like measuring a patient's temperature to determine the state of health. Despite perceived advantages, during the years that followed its initial announcements, skepticism about the practicality of IDDQ testing prevailed. The idea, however, provided a great opportunity to researchers. New results on test generation, fault simulation, design for testability, built-in self-test, and diagnosis for this style of testing have since been reported. After a decade of research, we are definitely closer to practice.