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Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials
This book presents posits a solution to the current limitations in global connectivity by introducing a global laser/optical communication system using constellation satellites, UAVs, HAPs and Balloons. The author outlines how this will help to satisfy the tremendous increasing demand for data exchange and information between end-users worldwide including in remote locations. The book provides both fundamentals and the advanced technology development in establishing worldwide communication and global connectivity using, (I) All-Optical technology, and (ii) Laser/Optical Communication Constellation Satellites (of different types, sizes and at different orbits), UAVs, HAPs (High Altitude Platforms) and Balloons. The book discusses step-by-step methods to develop a satellite backbone in order to interconnect a number of ground nodes clustered within a few SD-WAN (software-defined networking) in a wide area network (WAN) around the world in order to provide a fully-meshed communication network. This book pertains to anyone in optical communications, telecommunications, and system engineers, as well as technical managers in the aerospace industry and the graduate students, and researchers in academia and research laboratory. Proposed a solution to the limitations in global connectivity through a global laser/optical communication system using constellation satellites, UAVs, HAPs and Balloons; Provides both fundamentals and the advanced technology development in establishing global communication connectivity using optical technology and communication constellation satellites; Includes in-depth coverage of the basics of laser/optical communication constellation satellites.
The unique electronic band structure of graphene gives rise to remarkable properties when in contact with a superconducting electrode. In this thesis two main aspects of these junctions are analyzed: the induced superconducting proximity effect and the non-local transport properties in multi-terminal devices. For this purpose specific models are developed and studied using Green function techniques, which allow us to take into account the detailed microscopic structure of the graphene-superconductor interface. It is shown that these junctions are characterized by the appearance of bound states at subgap energies which are localized at the interface region. Furthermore it is shown that graphene-supercondutor-graphene junctions can be used to favor the splitting of Cooper pairs for the generation of non-locally entangled electron pairs. Finally, using similar techniques the thesis analyzes the transport properties of carbon nanotube devices coupled with superconducting electrodes and in graphene superlattices.
MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs. Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain. Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).
Providing an important link between the theoretical knowledge in the field of non-linier physics and practical application problems in microelectronics, the purpose of the book is popularization of the physical approach for reliability assurance. Another unique aspect of the book is the coverage given to the role of local structural defects, their mathematical description, and their impact on the reliability of the semiconductor devices.
This book presents an important technique to process organic photovoltaic devices. The basics, materials aspects and manufacturing of photovoltaic devices with solution processing are explained. Solution processable organic solar cells - polymer or solution processable small molecules - have the potential to significantly reduce the costs for solar electricity and energy payback time due to the low material costs for the cells, low cost and fast fabrication processes (ambient, roll-to-roll), high material utilization etc. In addition, organic photovoltaics (OPV) also provides attractive properties like flexibility, colorful displays and transparency which could open new market opportunities. The material and device innovations lead to improved efficiency by 8% for organic photovoltaic solar cells, compared to 4% in 2005. Both academic and industry research have significant interest in the development of this technology. This book gives an overview of the booming technology, focusing on the solution process for organic solar cells and provides a state-of-the-art report of the latest developments. World class experts cover fundamental, materials, devices and manufacturing technology of OPV technology.
This book bridges a gap between two major communities of Condensed Matter Physics, Semiconductors and Superconductors, that have thrived independently. Through an original perspective that their key particles, excitons and Cooper pairs, are composite bosons, the authors raise fundamental questions of current interest: how does the Pauli exclusion principle wield its power on the fermionic components of bosonic particles at a microscopic level and how this affects the macroscopic physics? What can we learn from Wannier and Frenkel excitons and from Cooper pairs that helps us understand "bosonic condensation" of composite bosons and its difference from Bose-Einstein condensation of elementary bosons? The authors start from solid mathematical and physical foundation to derive excitons and Cooper pairs. They further introduce Shiva diagrams as a graphic support to grasp the many-body physics induced by fermion exchange - a novel mechanism not visualized by standard Feynman diagrams. Advanced undergraduate or graduate students in physics with no prior background will benefit from this book. The developed concepts and methodology should also be useful to present researches on ultracold atomic gases, exciton-polaritons, and quantum information.
Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.
This book describes the theory and design of high-accuracy CMOS smart temperature sensors. The major topic of the work is the realization of a smart temperature sensor that has an accuracy that is so high that it can be applied without any form of calibration. Integrated in a low-cost CMOS technology, this yields at the publication date of this book one of the most inexpensive intelligent general purpose temperature sensors in the world. The first thermometers could only be read by the human eye. The industrial revolution and the following computerization asked for more intelligent sensors, which could easily communicate to digital computers. This led to. the development of integrated temperature sensors that combine a bipolar temperature sensor and an A-to-D converter on the same chip. The implementation in CMOS technology reduces the processing costs to a minimum while having the best-suited technology to increase the (digital) intelligence. The accuracy of conventional CMOS smart temperature sensors is degraded by the offset of the read-out electronics. Calibration of these errors is quite expensive, however, dynamic offset-cancellation techniques can reduce the offset of amplifiers by a factor 100 to 1000 and do not need trimming. Chapter two gives an elaborate description of the different kinds of dynamic offset-cancellation techniques. Also a new technique is introduced called the nested chopper technique. An implementation of a CMOS nested-chopper instrumentation amplifier shows a residual offset of less than lOOn V, which is the best result reported to date."
This book covers several of the most important topics of current interest at the forefront of scanning probe microscopy. These include a realistic theory of atom-resolving atomic force microscopy (AFM), fundamentals of MBE growth of III-V compound semiconductors and atomic manipulation for future single-electron devices.
This book covers a broad range of topics from the interdisciplinary research field of ultrafast intense laser science, focusing on atoms and molecules interacting with intense laser fields, laser-induced filamentation, high-order harmonics generation, and high power lasers and their applications. This sixteenth volume features contributions from world-renowned researchers, introducing the latest reports on probing molecular chirality with intense laser fields, and the most recent developments in the Shanghai Superintense Ultrafast Laser Facility project. The PUILS series delivers up-to-date reviews of progress in this emerging interdisciplinary research field, spanning atomic and molecular physics, molecular science, and optical science, which has been stimulated by the recent developments in ultrafast laser technologies. Each volume compiles peer-reviewed articles authored by researchers at the forefront of each of their own subfields of ultrafast intense laser science. Every chapter opens with an overview of the topics to be discussed, so that researchers unfamiliar to the subfield, especially graduate students, can grasp the importance and attractions of the research topic at hand; these are followed by reports of cutting-edge discoveries.
This book is intended for theoretical and experimental researchers who are interested in ferroelectrics and advanced memory. After introducing readers to dielectric, perovskites, advanced memories, and ferroelectric, it explains quantum simulation. Then, using molecular orbital calculation results, it explains the ferroelectric mechanism in perovskite titanium oxides in concrete terms. Lastly, the book examines the materials designed for high-performance ferroelectrics and discusses the future of high-speed memory.
Almost all semiconductor devices contain metal-semiconductor, insulator-semiconductor, insulator-metal and/or semiconductor-semiconductor interfaces; and their electronic properties determine the device characteristics. This is the first monograph that treats the electronic properties of all different types of semiconductor interfaces. Using the continuum of interfacea "induced gap states (IFIGS) as a unifying theme, MAnch explains the band-structure lineup at all types of semiconductor interfaces. These intrinsic IFIGS are the wave-function tails of electron states, which overlap a semiconductor band-gap exactly at the interface, so they originate from the quantum-mechanical tunnel effect. He shows that a more chemical view relates the IFIGS to the partial ionic character of the covalent interface-bonds and that the charge transfer across the interface may be modeled by generalizing Paulinga (TM)s electronegativity concept. The IFIGS-and-electronegativity theory is used to quantitatively explain the barrier heights and band offsets of well-characterized Schottky contacts and semiconductor heterostructures, respectively.
The 14th conference in the series focused on the most recent advances in the study of the structural and electronic properties of semiconducting materials by the application of transmission and scanning electron microscopy. The latest developments in the use of other important microcharacterisation techniques were also covered and included the latest work using scanning probe microscopy and also X-ray topography and diffraction.
This book is concerned with wafer fabrication and the factories that manufacture microprocessors and other integrated circuits. With the invention of the transistor in 1947, the world as we knew it changed. The transistor led to the microprocessor, and the microprocessor, the guts of the modern computer, has created an epoch of virtually unlimited information processing. The electronics and computer revolution has brought about, for better or worse, a new way of life. This revolution could not have occurred without wafer fabrication, and its associated processing technologies. A microprocessor is fabricated via a lengthy, highly-complex sequence of chemical processes. The success of modern chip manufacturing is a miracle of technology and a tribute to the hundreds of engineers who have contributed to its development. This book will delineate the magnitude of the accomplishment, and present methods to analyze and predict the performance of the factories that make the chips. The set of topics covered juxtaposes several disciplines of engineering. A primary subject is the chemical engineering aspects of the electronics industry, an industry typically thought to be strictly an electrical engineer's playground. The book also delves into issues of manufacturing, operations performance, economics, and the dynamics of material movement, topics often considered the domain of industrial engineering and operations research. Hopefully, we have provided in this work a comprehensive treatment of both the technology and the factories of wafer fabrication. Novel features of these factories include long process flows and a dominance of processing over operational issues.
Present-day scienceand technology have become increasingly based on studies and applications of thin films. This is especiallytrue of solid-state physics, semiconduc tor electronics, integrated optics, computer science, and the like. In these fields, it is necessary to use filmswith an ordered structure, especiallysingle-crystallinefilms, because physical phenomena and effects in such films are most reproducible. Also, active parts of semiconductor and other devices and circuits are created, as a rule, in single-crystal bodies. To date, single-crystallinefilms have been mainly epitaxial (or heteroepitaxial); i.e., they have been grown on a single-crystalline substrate, and principal trends, e.g., in the evolution of integrated circuits (lCs), have been based on continuing reduction in feature size and increase in the number of components per chip. However, as the size decreases into the submicrometer range, technological and physical limitations in integrated electronics become more and more severe. It is generally believed that a feature size of about 0.1um will have a crucial character. In other words, the present two-dimensional ICs are anticipated to reach their limit of minimization in the near future, and it is realized that further increase of packing density and/or functions might depend on three-dimensional integration. To solve the problem, techniques for preparation of single-crystalline films on arbitrary (including amorphous) substrates are essential."
This book introduces the physics and chemistry of plastic scintillators (fluorescent polymers) that are able to emit light when exposed to ionizing radiation, discussing their chemical modification in the early 1950s and 1960s, as well as the renewed upsurge in interest in the 21st century. The book presents contributions from various researchers on broad aspects of plastic scintillators, from physics, chemistry, materials science and applications, covering topics such as the chemical nature of the polymer and/or the fluorophores, modification of the photophysical properties (decay time, emission wavelength) and loading of additives to make the material more sensitive to, e.g., fast neutrons, thermal neutrons or gamma rays. It also describes the benefits of recent technological advances for plastic scintillators, such as nanomaterials and quantum dots, which allow features that were previously not achievable with regular organic molecules or organometallics.
This volume gathers the latest advances, innovations and applications in the field of vibration and technology of machinery, as presented by leading international researchers and engineers at the XV International Conference on Vibration Engineering and Technology of Machinery (VETOMAC), held in Curitiba, Brazil on November 10-15, 2019. Topics include concepts and methods in dynamics, dynamics of mechanical and structural systems, dynamics and control, condition monitoring, machinery and structural dynamics, rotor dynamics, experimental techniques, finite element model updating, industrial case studies, vibration control and energy harvesting, and MEMS. The contributions, which were selected through a rigorous international peer-review process, share exciting ideas that will spur novel research directions and foster new multidisciplinary collaborations.
The series Topics in Current Chemistry Collections presents critical reviews from the journal Topics in Current Chemistry organized in topical volumes. The scope of coverage is all areas of chemical science including the interfaces with related disciplines such as biology, medicine and materials science. The goal of each thematic volume is to give the non-specialist reader, whether in academia or industry, a comprehensive insight into an area where new research is emerging which is of interest to a larger scientific audience. Each review within the volume critically surveys one aspect of that topic and places it within the context of the volume as a whole. The most significant developments of the last 5 to 10 years are presented using selected examples to illustrate the principles discussed. The coverage is not intended to be an exhaustive summary of the field or include large quantities of data, but should rather be conceptual, concentrating on the methodological thinking that will allow the non-specialist reader to understand the information presented. Contributions also offer an outlook on potential future developments in the field.
Quantum dots are nanometer-size semiconductor structures, and represent one of the most rapidly developing areas of current semiconductor research as increases in the speed and decreases in the size of semiconductor devices become more important. They present the utmost challenge to semiconductor technology, making possible fascinating novel devices. This important new reference book focuses on the key phenomena and principles. Chapter 1 provides a brief account of the history of quantum dots, whilst the second chapter surveys the various fabrication techniques used in the past two decades, and introduces the concept of self-organized growth. This topic is expanded in the following chapter, which presents a broad review of self-organization phenomena at surfaces of crystals. Experimental results on growth of quantum dot structures in many different systems and on their structural characterization are presented in Chapter 4. Basic properties of the dots relate to their geometric structure and chemical composition. Numerical modeling of the electronic and optical properties of real dots is presented in Chapter 5, together with general theoretical considerations on carrier capture, relaxation, recombination and properties of quantum dot lasers. Chapters 6 and 7 summarize experimental results on electronic, optical and electrical properties. The book concludes by disoussing highly topical results on quantum-dot-based photonic devices — mainly quantum dot lasers. Quantum Dot Heterostructures is written by some of the key researchers who have contributed significantly to the development of the field, and have pioneered both the theoretical understanding of quantum dot related phenomena and quantum dot lasers. It is of great interest to graduate and postgraduate students, and to researchers in semiconductor physics and technology and optoelectronics.
Amorphous and Microcrystalline Silicon Solar Cells: Modeling, Materials and Device Technology provides a comprehensive overview of materials for application in thin film solar cells. It is the first book that compares experimental and computer-modeling methods, combining the state of the art in technology with the latest insights in device modeling. A wide range of experimental issues are explored, from materials and basic device physics of thin film solar cells to potential mass production facilities for solar panels. The modeling section presents an approach to integrated optical and electrical modeling of complete devices, including optical light trapping, and describes the physical materials parameters related to amorphous silicon that are crucial for successful modeling. The increasing importance of multijunction cells with different bandgap components for thin film silicon cells is reflected in a description of the latest breakthroughs acquired experimentally and by modeling. Concluding chapters describe what can be learned from combined modeling and device fabrication, indicating potential future methods of amorphous silicon solar cell optimization. This book will prove invaluable to researchers in the amorphous and microcrystalline silicon field and the physical and experimental approaches will be of interest to researchers investigating solar cells or other film devices for large area applications.
This book describes most recent progress in the properties, synthesis, characterization, modelling, and applications of nanomaterials and nanodevices. It begins with the review of the modelling of the structural, electronic and optical properties of low dimensional and nanoscale semiconductors, methodology of synthesis, and characterization of quantum dots and nanowires, with special attention towards Dirac materials, whose electrical conduction and sensing properties far exceed those of silicon-based materials, making them strong competitors. The contributed reviews presented in this book touch on broader issues associated with the environment, as well as energy production and storage, while highlighting important achievements in materials pertinent to the fields of biology and medicine, exhibiting an outstanding confluence of basic physical science with vital human endeavor. The subjects treated in this book are attractive to the broader readership of graduate and advanced undergraduate students in physics, chemistry, biology, and medicine, as well as in electrical, chemical, biological, and mechanical engineering. Seasoned researchers and experts from the semiconductor/device industry also greatly benefit from the book's treatment of cutting-edge application studies.
The contrasting examples of microwave plasmas given in this volume demonstrate their capability of not only covering the totality of expressed needs in that particular field, but in many others. For example the ions and reactive neutral species, indispensable for the synergetic effects in etching and deposition processes can be used in metallurgical treatment, and for materials processing in general. They also have the ability to dissociate molecules and excite atoms as required in analytical chemistry where the information on the constituent concentrations is obtained through optical spectroscopy or mass spectrometry. Finally, microwave plasmas can supply the photons for laser and lighting applications. It is noteworthy that microwave plasmas cover an impressive pressure range of eight orders of magnitude from 10-3 Pa (10-5 torr) to above atmospheric pressure. The versatility of microwave plasmas, their moderate cost, and their ease of implementation particularly appeal to the industrial entrepreneur.
Highly Sensitive Optical Receivers primarily treats the circuit design of optical receivers with external photodiodes. Continuous-mode and burst-mode receivers are compared. The monograph first summarizes the basics of III/V photodetectors, transistor and noise models, bit-error rate, sensitivity and analog circuit design, thus enabling readers to understand the circuits described in the main part of the book. In order to cover the topic comprehensively, detailed descriptions of receivers for optical data communication in general and, in particular, optical burst-mode receivers in deep-sub-um CMOS are presented. Numerous detailed and elaborate illustrations facilitate better understanding. "
This book covers a wide range of topics related to functional dyes, from synthesis and functionality to application. Making a survey of recent progress in functional dye chemistry, it provides an opportunity not only to understand the structure-property relationships of a variety of functional dyes but also to know how they are applied in practical use, from electronic devices to biochemical analyses. From classic dyes such as cyanines, squaraines, porphyrins, phthalocyanines, and others to the newest functional -conjugation systems, various types of functional dyes are dealt with extensively in the book, focusing especially on the state of the art and the future. Readers will benefit greatly from the scientific context in which organic dyes and pigments are comprehensively explained on the basis of chemistry. |
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