In this revised and expanded edition, the authors provide a comprehensive overview of the tools, technologies, and physical models needed to understand, build, and analyze microdevices. Students, specialists within the field, and researchers in related fields will appreciate their unified presentation and extensive references.

Topological defects are generic in continuous media. In the relativistic quantum vacuum they are known as cosmic strings, in superconductors as quantized flux lines, and in superfluids, low-density atomic Bose-Einstein condensates and neutron stars as quantized vortex lines. This collection of articles by leading scientists presents a modern treatment of the physics of vortex matter, mainly applied to unconventional superconductors and superfluids but with extensions to other areas of physics.

Until the 1990s, the reduction of the minimum feature sizes used to fabricate in- grated circuits, called "scaling," has highlighted serious advantages as integration density, speed, power consumption, functionality and cost. Direct consequence was the decrease of cost-per-function, so the electronic productivity has largely progressed in this period. Another usually cited trend is the evolution of the in- gration density as expressed by the well-know Moore's Law in 1975: the number of devices per chip doubles every 2 years. This evolution has allowed improving signi?cantly the circuit complexity, offering a great computing power in the case of microprocessor, for example. However, since few years, signi?cant issues appeared such as the increase of the circuit heating, device complexity, variability and dif?culties to improve the integration density. These new trends generate an important growth in development and production costs. Though is it, since 40 years, the evolution of the microelectronics always f- lowed the Moore's law and each dif?culty has found a solution.

Processor Design provides insight into a number of different flavors of processor architectures and their design, software tool generation, implementation, and verification. After a brief introduction to processor architectures and how processor designers have sometimes failed to deliver what was expected, the authors introduce a generic flow for embedded on-chip processor design and start to explore the vast design space of on-chip processing. The types of processor cores covered include general purpose RISC cores, traditional DSP, a VLIW approach to signal processing, processor cores that can be customized for specific applications, reconfigurable processors, protocol processors, Java engines, and stream processors. Co-processor and multi-core design approaches that deliver application-specific performance over and above that which is available from single-core designs are also described.

This text focuses on techniques for minimizing power dissipation during test application at logic and register-transfer levels of abstraction of the VLSI design flow. It surveys existing techniques and presents several test automation techniques for reducing power in scan-based sequential circuits and BIST data paths.

A major current challenge for semiconductor devices is to develop materials for the next generation of optical communication systems and solar power conversion applications. Recently, extensive research has revealed that an introduction of only a few percentages of nitrogen into III-V semiconductor lattice leads to a dramatic reduction of the band gap. This discovery has opened the possibility of using these material systems for applications ranging from lasers to solar cells. "Physics and Technology of Dilute III-V Nitride Semiconductors and Novel Dilute Nitride Material Systems" reviews the current status of research and development in dilute III-V nitrides, with 24 chapters from prominent research groups covering recent progress in growth techniques, experimental characterization of band structure, defects carrier transport, transport properties, dynamic behavior of N atoms, device applications, modeling of device design, novel optoelectronic integrated circuits, and novel nitrogen containing III-V materials.

Electronic structure and physical properties of strongly correlated materials containing elements with partially filled 3d, 4d, 4f and 5f electronic shells is analyzed by Dynamical Mean-Field Theory (DMFT). DMFT is the most universal and effective tool used for the theoretical investigation of electronic states with strong correlation effects. In the present book the basics of the method are given and its application to various material classes is shown. The book is aimed at a broad readership: theoretical physicists and experimentalists studying strongly correlated systems. It also serves as a handbook for students and all those who want to be acquainted with fast developing filed of condensed matter physics.

The goal of putting systems on a chip' has been a difficult challenge that is only recently being met. Since the world is analog', putting systems on a chip requires putting analog interfaces on the same chip as digital processing functions. Since some processing functions are accomplished more efficiently in analog circuitry, chips with a large amount of analog and digital circuitry are being designed. Whether a small amount of analog circuitry is combined with varying amounts of digital circuitry or the other way around, the problem encountered in marrying analog and digital circuitry are the same but with different scope. Some of the most prevalent problems are chip/package capacitive and inductive coupling, ringing on the RLC tuned circuits that form the chip/package power supply rails and off-chip drivers and receivers, coupling between circuits through the chip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problems of designers who have to deal with the complexity of mixed-signal coupling there is a lack of verification techniques to simulate the problem. In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuit designers must also model coupling through the common substrate when simulating ICs to obtain an accurate estimate of coupled noise in their designs. Unfortunately, accurate simulation of substrate coupling has only recently begun to receive attention, and techniques for the same are not widely known. Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits addresses two major issues of the mixed-signal coupling problem -- how to simulate it and how to overcome it. It identifies some of the problems that will be encountered, gives examples of actual hardware experiences, offers simulation techniques, and suggests possible solutions. Readers of this book should come away with a clear directive to simulate their design for interactions prior to building the design, versus a build it and see' mentality.

This book introduces the basic framework of advanced focal plane technology based on the third-generation infrared focal plane concept. The essential concept, research advances, and future trends in advanced sensor arrays are comprehensively reviewed. Moreover, the book summarizes recent research advances in HgCdTe/AlGaN detectors for the infrared/ultraviolet waveband, with a particular focus on the numerical method of detector design, material epitaxial growth and processing, as well as Complementary Metal-Oxide-Semiconductor Transistor readout circuits. The book offers a unique resource for all graduate students and researchers interested in the technologies of focal plane arrays or electro-optical imaging sensors.

This book brings together the many concepts and discoveries in liquid crystal colloids contributed over the last twenty years and scattered across numerous articles and book chapters. It provides both a historical overview of the development of the field and a clear perspective on the future applications in photonics. The book covers all phenomena observed in liquid crystal colloids with an emphasis on experimental tools and applications of topology in condensed matter, as well as practical micro-photonics applications. It includes a number of spectacular manifestations of new topological phenomena not found or difficult to observe in other systems. Starting from the early works on nematic colloids, it explains the basics of topological defects in ordered media, charge and winding, and the elastic forces between colloidal particles in nematics. Following a detailed description of experimental methods, such as optical tweezing and particle tracking, the book eases the reader into the theoretical part, which deals with elastic deformation of nematic liquid crystals due to inclusions and surface alignment. This is discussed in the context of basic mean field Landau-de Gennes Q-tensor theory, with a brief explanation of the free-energy minimization numerical methods. There then follows an excursion into the topology of complex nematic colloidal structures, colloidal entanglement, knotting and linking. Nematic droplets, shells, handlebodies and chiral topological structures are addressed in separate chapters. The book concludes with an extensive chapter on the photonic properties of nematic dispersions, presenting the concept of integrated soft matter photonics and discussing the concepts of nematic and chiral nematic microlasers, surface-sensitive photonic devices and smectic microfibers. The text is complemented by a large bibliography, explanatory sketches and beautiful micrographs.

This is a unique book devoted to the important class of nitride semiconductors and devices. Numerous tables and figures detailing properties and performance devices are compiled. Structural, electrical and optical properties of nitrides and substrates on which they are deposited, band structures of nitrides, optical processes, deposition and fabrication technologies (contacts), dopant incorporation and analyses, pn-junctions, light-emitting diodes, and blue lasers are treated succinctly. Attention is paid to both technological issues and fundamentals.

"Nanostructure Semiconductor Optical Amplifiers" reviews all-optical processing methods currently available and presents semiconductor optical amplifiers (SOAs) as a new building block for this purpose. The authors discuss the overcomes of high frequency operation of SOAs and propose a new all-optical pumping method for the implementation of semiconductor optical amplifiers. Content Level Research

This book reviews a range of quantum phenomena in novel nanoscale transistors called FinFETs, including quantized conductance of 1D transport, single electron effect, tunneling transport, etc. The goal is to create a fundamental bridge between quantum FinFET and nanotechnology to stimulate readers' interest in developing new types of semiconductor technology. Although the rapid development of micro-nano fabrication is driving the MOSFET downscaling trend that is evolving from planar channel to nonplanar FinFET, silicon-based CMOS technology is expected to face fundamental limits in the near future. Therefore, new types of nanoscale devices are being investigated aggressively to take advantage of the quantum effect in carrier transport. The quantum confinement effect of FinFET at room temperatures was reported following the breakthrough to sub-10nm scale technology in silicon nanowires. With chapters written by leading scientists throughout the world, Toward Quantum FinFET provides a comprehensive introduction to the field as well as a platform for knowledge sharing and dissemination of the latest advances. As a roadmap to guide further research in an area of increasing importance for the future development of materials science, nanofabrication technology, and nano-electronic devices, the book can be recommended for Physics, Electrical Engineering, and Materials Science departments, and as a reference on micro-nano electronic science and device design. Offers comprehensive coverage of novel nanoscale transistors with quantum confinement effect Provides the keys to understanding the emerging area of the quantum FinFET Written by leading experts in each research area Describes a key enabling technology for research and development of nanofabrication and nanoelectronic devices

This guide emphasizes jitter for time domain applications so that there is not a need to translate from frequency domain. This provides a more direct path to the results for designing in an application area where performance is specified in the time domain. The book includes classification of oscillator types and an exhaustive guide to existing research literature. It also includes classification of measurement techniques to help designers understand how the eventual performance of circuit design is verified.

This book is mostly concerned on the experimental research of the nonlinear optical characteristics of various media, low- and high-order harmonic generation in different materials, and formation, and nonlinear optical characterization of clusters. We also demonstrate the inter-connection between these areas of nonlinear optics.
Nonlinear optical properties of media such as optical limiting can be applied in various areas of science and technology. To define suitable materials for these applications, one has to carefully analyse the nonlinear optical characteristics of various media, such as the nonlinear refractive indices, coefficients of nonlinear absorption, saturation absorption intensities, etc. Knowing the nonlinear optical parameters of materials is also important for describing the propagation effects, self-interaction of intense laser pulses, and optimisation of various nonlinear optical processes. Among those processes one can admit the importance of the studies of the frequency conversion of coherent laser sources. The area of interest for nonlinear optical characterization of materials is also closely related with new field of nanostructures formation and application during laser-matter interaction.
We show how the nonlinear optical analysis of materials leads to improvement of their high-order nonlinear optical response during the interaction with strong laser fields. Ablation-induced nanoparticles formation is correlated with their applications as efficient sources of coherent short-wavelength photons. From other side, recent achievements of harmonic generation in plasmas are closely related with the knowledge of the properties of materials in the laser plumes. All of these studies are concerned with the low-order nonlinear optical features of various materials. The novelty of the approach developed in present book is related with inter-connection of those studies with each other."

This book describes the basic physical principles of the oxide/semiconductor epitaxy and offers a view of the current state of the field. It shows how this technology enables large-scale integration of oxide electronic and photonic devices and describes possible hybrid semiconductor/oxide systems. The book incorporates both theoretical and experimental advances to explore the heteroepitaxy of tuned functional oxides and semiconductors to identify material, device and characterization challenges and to present the incredible potential in the realization of multifunctional devices and monolithic integration of materials and devices. Intended for a multidisciplined audience, Integration of Functional Oxides with Semiconductors describes processing techniques that enable atomic-level control of stoichiometry and structure and reviews characterization techniques for films, interfaces and device performance parameters. Fundamental challenges involved in joining covalent and ionic systems, chemical interactions at interfaces, multi-element materials that are sensitive to atomic-level compositional and structural changes are discussed in the context of the latest literature. Magnetic, ferroelectric and piezoelectric materials and the coupling between them will also be discussed. GaN, SiC, Si, GaAs and Ge semiconductors are covered within the context of optimizing next-generation device performance for monolithic device processing.

This book discusses future trends and developments in electron device packaging and the opportunities of nano and bio techniques as future solutions. It describes theeffect of nano-sized particles and cell-based approaches for packaging solutions with their diverse requirements. It offers a comprehensive overview of nano particles and nano composites and theirapplication aspackaging functions in electron devices. The importance and challenges of three-dimensional design and computer modeling in nano packaging is discussed; alsoways for implementation are described. Solutions for unconventional packaging solutions for metallizations and functionalized surfaces as well as new packaging technologies with high potential for industrial applications are discussed. The book brings together a comprehensive overview of nano scale components and systems comprising electronic, mechanical and optical structures and serves as important reference for industrial and academic researchers."

This is a milestone in machine-assisted microprocessor verification. Gordon [20] and Hunt [32] led the way with their verifications of sim ple designs, Cohn [12, 13] followed this with the verification of parts of the VIPER microprocessor. This work illustrates how much these, and other, pioneers achieved in developing tractable models, scalable tools, and a robust methodology. A condensed review of previous re search, emphasising the behavioural model underlying this style of verification is followed by a careful, and remarkably readable, ac count of the SECD architecture, its formalisation, and a report on the organisation and execution of the automated correctness proof in HOL. This monograph reports on Graham's MSc project, demonstrat ing that - in the right hands - the tools and methodology for formal verification can (and therefore should?) now be applied by someone with little previous expertise in formal methods, to verify a non-trivial microprocessor in a limited timescale. This is not to belittle Graham's achievement; the production of this proof, work ing as Graham did from the previous literature, goes well beyond a typical MSc project. The achievement is that, with this exposition to hand, an engineer tackling the verification of similar microprocessor designs will have a clear view of the milestones that must be passed on the way, and of the methods to be applied to achieve them.

This book discusses topics related to power electronics, especially electromagnetic transient analysis and control of high-power electronics conversion. It focuses on the re-evaluation of power electronics, transient analysis and modeling, device-based system-safe operating area, and energy balance-based control methods, and presenting, for the first time, numerous experimental results for the transient process of various real-world converters. The book systematically presents both theoretical analysis and practical applications. The first chapter discusses the structure and attributes of power electronics systems, highlighting the analysis and synthesis, while the second chapter explores the transient process and modeling for power electronics systems. The transient features of power devices at switching-on/off, transient conversion circuit with stray parameters and device-based system-safe operating area are described in the subsequent three chapters. The book also examines the measurement of transient processes, electromagnetic pulses and their series, as well as high-performance, closed-loop control, and expounds the basic principles and method of the energy-balanced control strategy. Lastly, it introduces the applications of transient analysis of typical power electronics systems. The book is valuable as a textbook for college students, and as a reference resource for electrical engineers as well as anyone working in the field of high-power electronics system.

This book introduces some of the key ideas of this exciting field, using a pedagogic approach, and presents a comprehensive overview of the field. It is divided into four parts. The first part introduces the basic concepts of microwave cavities for particle acceleration. The second part is devoted to the observed behaviour of superconducting cavities. In the third part,general issues connected with beam-cavity interaction and the related issues for the critical components are covered. The final part discusses applications of superconducting cavities to frontier accelerators of the future, drawing heavily on the examples that are in their most advanced stage. Each part of the book ends in a Problems section to illustrate and amplify text material as well as draw on example applications of superconducting cavities to existing and future accelerators.

Systematic Analysis of Bipolar and MOS Transistors is a self-contained reference that walks you through the logical processes involved in transistor analysis. Linking device and circuit engineering, it shows you how to use device models intelligently, tailor existing models, and develop new ones.

Lanthanides have fascinated scientists for more than two centuries now, and since efficient separation techniques were established roughly 50 years ago, they have increasingly found their way into industrial exploitation and our everyday lives. Numerous applications are based on their unique luminescent properties, which are highlighted in this volume. It presents established knowledge about the photophysical basics, relevant lanthanide probes or materials, and describes instrumentation-related aspects including chemical and physical sensors. The uses of lanthanides in bioanalysis and medicine are outlined, such as assays for in vitro diagnostics and research. All chapters were compiled by renowned scientists with a broad audience in mind, providing both beginners in the field and advanced researchers with comprehensive information on on the given subject.

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The primary thrust of very large scale integration (VLS ) is the miniaturization of devices to increase packing density, achieve higher speed, and consume lower power. The fabrication of integrated circuits containing in excess of four million components per chip with design rules in the submicron range has now been made possible by the introduction of innovative circuit designs and the development of new microelectronic materials and processes. This book addresses the latter challenge by assessing the current status of the science and technology associated with the production of VLSI silicon circuits. It represents the cumulative effort of experts from academia and industry who have come together to blend their expertise into a tutorial overview and cohesive update of this rapidly expanding field. A balance of fundamental and applied contributions cover the basics of microelectronics materials and process engineering. Subjects in materials science include silicon, silicides, resists, dielectrics, and interconnect metallization. Subjects in process engineering include crystal growth, epitaxy, oxidation, thin film deposition, fine-line lithography, dry etching, ion implantation, and diffusion. Other related topics such as process simulation, defects phenomena, and diagnostic techniques are also included. This book is the result of a NATO-sponsored Advanced Study Institute (AS ) held in Castelvecchio Pascoli, Italy. Invited speakers at this institute provided manuscripts which were edited, updated, and integrated with other contributions solicited from non-participants to this AS .

This book provides a comprehensive overview of the main electrical technologies for process heating, which tend to be treated separately in specialized books. Individual chapters focus on heat transfer, electromagnetic fields in electro-technologies, arc furnaces, resistance furnaces, direct resistance heating, induction heating, and high-frequency and microwave heating. The author highlights those topics of greatest relevance to a wide-ranging teaching program, and at the same time offer a detailed review of the main applications of the various technologies. The content represents a synthesis of the extensive knowledge and experience that the author has accumulated while researching and teaching at the University of Padua's Engineering Faculty. This text on industrial electroheating technologies is a valuable resource not only for students of industrial, electrical, chemical, and material science engineering, but also for engineers, technicians and others involved in the application of electroheating and energy-efficient industrial processes.