Organic flexible electronics represent a highly promising technology that will provide increased functionality and the potential to meet future challenges of scalability, flexibility, low power consumption, light weight, and reduced cost. They will find new applications because they can be used with curved surfaces and incorporated in to a number of products that could not support traditional electronics. The book covers device physics, processing and manufacturing technologies, circuits and packaging, metrology and diagnostic tools, architectures, and systems engineering. Part one covers the production, properties and characterisation of flexible organic materials and part two looks at applications for flexible organic devices.

Piezoelectric materials produce electric charges on their surfaces as a consequence of applying mechanical stress. They are used in the fabrication of a growing range of devices such as transducers (used, for example, in ultrasound scanning), actuators (deployed in such areas as vibration suppression in optical and microelectronic engineering), pressure sensor devices (such as gyroscopes) and increasingly as a way of producing energy. Their versatility has led to a wealth of research to broaden the range of piezoelectric materials and their potential uses. Advanced piezoelectric materials: science and technology provides a comprehensive review of these new materials, their properties, methods of manufacture and applications. After an introductory overview of the development of piezoelectric materials, Part one reviews the various types of piezoelectric material, ranging from lead zirconate titanate (PZT) piezo-ceramics, relaxor ferroelectric ceramics, lead-free piezo-ceramics, quartz-based piezoelectric materials, the use of lithium niobate and lithium in piezoelectrics, single crystal piezoelectric materials, electroactive polymers (EAP) and piezoelectric composite materials. Part two discusses how to design and fabricate piezo-materials with chapters on piezo-ceramics, single crystal preparation techniques, thin film technologies, aerosol techniques and manufacturing technologies for piezoelectric transducers. The final part of the book looks at applications such as high-power piezoelectric materials and actuators as well as the performance of piezoelectric materials under stress. With its distinguished editor and international team of expert contributors Advanced piezoelectric materials: science and technology is a standard reference for all those researching piezoelectric materials and using them to develop new devices in such areas as microelectronics, optical, sound, structural and biomedical engineering.

Unlike electroplating, electroless plating allows uniform deposits of coating materials over all surfaces, regardless of size, shape and electrical conductivity. Electroless copper and nickel-phosphorus deposits provide protective and functional coatings in industries as diverse as electronics, automotive, aerospace and chemical engineering. This book discusses the latest research in electroless depositions. After an introductory chapter, part one focuses on electroless copper depositions reviewing such areas as surface morphology and residual stress, modelling surface structure, adhesion strength of electroless copper deposit, electrical resistivity and applications of electroless copper deposits. Part two goes on to look at electroless nickel-phosphorus depositions with chapters on the crystallisation of nickel-phosphorus deposits, modelling the thermodynamics and kinetics of crystallisation of nickel-phosphorus deposits, artificial neural network (ANN) modelling of crystallisation temperatures, hardness evolution of nickel-phosphorus deposits and applications of electroless nickel-phosphorus plating. Written by leading experts in the field Electroless copper and nickel-phosphorus plating: Processing, characterisation and modelling is an invaluable guide for researchers studying electroless deposits or materials science as well as for those working in the chemical, oil and gas, automotive, electronics and aerospace industries.

There have been major recent advances in robotic systems that can replace humans in undertaking hazardous activities in demanding or dangerous environments. Published in association with the CLAWAR (Climbing and Walking Robots and Associated Technologies Association) (www.clawar.org), this important book reviews the development of robotic systems for de-mining and other risky activities such as fire-fighting. Part one provides an overview of the use of robots for humanitarian de-mining work. Part two discusses the development of sensors for mine detection whilst Part thee reviews developments in both teleoperated and autonomous robots. Building on the latter, Part four concentrates on robot autonomous navigation. The final part of the book reviews research on multi-agent-systems (MAS) and the multi-robotics-systems (MRS), promising tools that take into account modular design of mobile robots and the use of several robots in multi-task missions. With its distinguished editors and international team of contributors, Using robots in hazardous environments: landmine detection, de-mining and other applications is a standard reference for all those researching the use of robots in hazardous environments as well as government and other agencies wishing to use robots for dangerous tasks such as landmine detection and disposal.

The first book to combine satellite and terrestrial positioning techniques - vital for the understanding and development of new technologies Written and edited by leading experts in the field, with contributors belonging to the European Commission's FP7 Network of Excellence NEWCOM++ Applications to a wide range of fields, including sensor networks, emergency services, military use, location-based billing, location-based advertising, intelligent transportation, and leisure Location-aware personal devices and location-based services have become ever more prominent in the past few years, thanks to the significant advances in position location technology. Sensor networks, geographic information, emergency services, location management, location-based billing, location-based advertising, intelligent transportation, and leisure applications are just some of the potential applications that can be enabled by these techniques. Increasingly, satellite and terrestrial positioning techniques are being combined for maximum performance; to produce the next wave of location-based devices and services, engineers need to combine both components. This book is the first to present a holistic view, covering all aspects of positioning: both terrestrial and satellite, both theory and practice, both performance bounds and signal processing techniques. It will provide a valuable resource for product developers and R&D engineers, allowing them to improve existing location techniques and develop future approaches for new systems.

Whilst printed films are currently used in varied devices across a wide range of fields, research into their development and properties is increasingly uncovering even greater potential. Printed films provides comprehensive coverage of the most significant recent developments in printed films and their applications. Materials and properties of printed films are the focus of part one, beginning with a review of the concepts, technologies and materials involved in their production and use. Printed films as electrical components and silicon metallization for solar cells are discussed, as are conduction mechanisms in printed film resistors, and thick films in packaging and microelectronics. Part two goes on to review the varied applications of printed films in devices. Printed resistive sensors are considered, as is the role of printed films in capacitive, piezoelectric and pyroelectric sensors, mechanical micro-systems and gas sensors. The applications of printed films in biosensors, actuators, heater elements, varistors and polymer solar cells are then explored, followed by a review of screen printing for the fabrication of solid oxide fuel cells and laser printed micro- and meso-scale power generating devices. With its distinguished editors and international team of expert contributors, Printed films is a key text for anyone working in such fields as microelectronics, fuel cell and sensor technology in both industry and academia.

Electrical motor products reviews the energy efficiency management laws for electrical motor products in United States, European Union (EU) and China. The energy efficiency certification requirements for the electrical motor products vary from country to country and are summarised here. International standards, testing methods and certification requirements for specific electrical motor products are discussed, including electric motors, pumps and fans. Finally, methods for improving energy efficiency are examined.

Thin film technology is used in many applications such as microelectronics, optics, hard and corrosion resistant coatings and micromechanics, and thin films form a uniquely versatile material base for the development of novel technologies within these industries. Thin film growth provides an important and up-to-date review of the theory and deposition techniques used in the formation of thin films. Part one focuses on the theory of thin film growth, with chapters covering nucleation and growth processes in thin films, phase-field modelling of thin film growth and surface roughness evolution. Part two covers some of the techniques used for thin film growth, including oblique angle deposition, reactive magnetron sputtering and epitaxial growth of graphene films on single crystal metal surfaces. This section also includes chapters on the properties of thin films, covering topics such as substrate plasticity and buckling of thin films, polarity control, nanostructure growth dynamics and network behaviour in thin films. With its distinguished editor and international team of contributors, Thin film growth is an essential reference for engineers in electronics, energy materials and mechanical engineering, as well as those with an academic research interest in the topic.

Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field.

Nanostructured silicon-germanium (SiGe) opens up the prospects of novel and enhanced electronic device performance, especially for semiconductor devices. Silicon-germanium (SiGe) nanostructures reviews the materials science of nanostructures and their properties and applications in different electronic devices. The introductory part one covers the structural properties of SiGe nanostructures, with a further chapter discussing electronic band structures of SiGe alloys. Part two concentrates on the formation of SiGe nanostructures, with chapters on different methods of crystal growth such as molecular beam epitaxy and chemical vapour deposition. This part also includes chapters covering strain engineering and modelling. Part three covers the material properties of SiGe nanostructures, including chapters on such topics as strain-induced defects, transport properties and microcavities and quantum cascade laser structures. In Part four, devices utilising SiGe alloys are discussed. Chapters cover ultra large scale integrated applications, MOSFETs and the use of SiGe in different types of transistors and optical devices. With its distinguished editors and team of international contributors, Silicon-germanium (SiGe) nanostructures is a standard reference for researchers focusing on semiconductor devices and materials in industry and academia, particularly those interested in nanostructures.

Presenting the new IEEE 802.16m standard, this is the first book to take a systematic, top-down approach to describing Mobile WiMAX and its next generation, giving detailed algorithmic descriptions together with explanations of the principles behind the operation of individual air-interface protocols and network components. Features: A systematic and detailed, top-down approach to the design of 4G cellular systems based on IEEE 802.16m and 3GPP LTE/LTE-Advanced technologies A systematic approach to understanding IEEE 802.16m radio access network and mobile WiMAX network architecture and protocols The first comprehensive technical reference on the design, development and performance evaluation of IMT-Advanced systems, including the theoretical background and design principles as well as implementation considerations About the author: The author, chief architect and technical lead of the IEEE 802.16m project at Intel Corporation, initiated and masterminded the development of the IEEE 802.16m standard and has been one of the leading technical drivers in its standardization process in IEEE. The author was also a leading technical contributor to the definition and development of requirements and evaluation methodology for the IMT-Advanced systems in ITU-R. Reflecting the author's 20+ years expertise and experience, the book provides an in-depth, systematic and structured technical reference for professional engineers, researchers, and graduate students working in cellular communication systems, radio air-interface technologies, cellular communications protocols, advanced radio access technologies for 4G systems, and broadband cellular standards.

Autonomic networking aims to solve the mounting problems created by increasingly complex networks, by enabling devices and service-providers to decide, preferably without human intervention, what to do at any given moment, and ultimately to create self-managing networks that can interface with each other, adapting their behavior to provide the best service to the end-user in all situations. This book gives both an understanding and an assessment of the principles, methods and architectures in autonomous network management, as well as lessons learned from, the ongoing initiatives in the field. It includes contributions from industry groups at Orange Labs, Motorola, Ericsson, the ANA EU Project and leading universities. These groups all provide chapters examining the international research projects to which they are contributing, such as the EU Autonomic Network Architecture Project and Ambient Networks EU Project, reviewing current developments and demonstrating how autonomic management principles are used to define new architectures, models, protocols, and mechanisms for future network equipment.

This book is an overview of the strategies to generate high-quality films of one-dimensional semiconductor nanostructures on flexible substrates (e.g., plastics) and the use of them as building blocks to fabricating flexible devices (including electronics, optoelectronics, sensors, power systems). In addition to engineering aspects, the physics and chemistry behind the fabrication and device operation will also be discussed as well. Internationally recognized scientists from academia, national laboratories, and industries, who are the leading researchers in the emerging areas, are contributing exceptional chapters according to their cutting-edge research results and expertise. This book will be an on-time addition to the literature in nanoscience and engineering. It will be suitable for graduate students and researchers as a useful reference to stimulate their research interest as well as facilitate their research in nanoscience and engineering.

With the advent of wavelength routing and dynamic, reconfigurable optical networks, new demands are being made in the design and operation of optical amplifiers. This book provides, for the first time, a comprehensive review of optical amplifier technology in the context of these recent advances in the field. It demonstrates how to manage the trade-offs between amplifier design, network architecture and system management and operation. The book provides an overview of optical amplifiers and reconfigurable networks before examining in greater detail the issues of importance to network operators and equipment manufacturers, including 40G and 100G transmission. Optical amplifier design is fully considered, focusing on fundamentals, design solutions and amplifier performance limitations. Finally, the book discusses other emerging applications for optical amplifiers such as optical networks for high data rate systems, free space systems, long single span links and optical digital networks. This book will be of great value to R&D engineers, network and systems engineers, telecommunications service providers, component suppliers, industry analysts, network operators, postgraduate students, academics and anyone seeking to understand emerging trends in optical networks and the consequent changes in optical amplifier design, features and applications.

This in-depth, detailed reference presents for the first time a comprehensive treatment of recent advances in optical performance monitoring. Written by leading experts in the field, the book provides an overview of recent developments in the area and the role of OPM in future optical systems and networks. Detailed discussions of various advanced techniques are provided to illustrate their principles. FEATURES: Presents the principles and applications of advanced OPM techniques, together with a comparative evaluation of their effectiveness in monitoring individual parameters, such as optical signal-to-noise ratio, chromatic dispersion, and polarization mode dispersion Explains the principles of the various advanced optical signal processing techniques and their applications in OPM Examines the role and applications of OPM in optical networks, including optical transport networks, coherent optical systems, and long-haul optical transmission systems Discusses the current approaches of OPM in the global standard SDH/SONET This book is ideal for technical professionals and researchers who want to understand and evaluate advanced techniques in OPM and their impact on the practical design of next-generation optical systems and networks.

Nanophotonics has emerged as a major technology and applications domain, exploiting the interaction of light-emitting and light-sensing nanostructured materials. These devices are lightweight, highly efficient, low on power consumption, and are cost effective to produce. The authors of this book have been involved in pioneering work in manufacturing photonic devices from carbon nanotube (CNT) nanowires and provide a series of practical guidelines for their design and manufacture, using processes such as nano-robotic manipulation and assembly methods. They also introduce the design and operational principles of opto-electrical sensing devices at the nano scale. Thermal annealing and packaging processes are also covered, as key elements in a scalable manufacturing process. Examples of applications of different nanowire based photonic devices are presented. These include applications in the fields of electronics (e.g. FET, CNT Schotty diode) and solar energy.

The MEMS (Micro Electro-Mechanical Systems) market returned to growth in 2010. The total MEMS market is worth about $6.5 billion, up more than 11 percent from last year and nearly as high as its historic peak in 2007. MEMS devices are used across sectors as diverse as automotive, aerospace, medical, industrial process control, instrumentation and telecommunications - forming the nerve center of products including airbag crash sensors, pressure sensors, biosensors and ink jet printer heads. Part of the MEMS cluster within the Micro & Nano Technologies Series, this book covers the fabrication techniques and applications of thick film piezoelectric micro electromechanical systems (MEMS). It includes examples of applications where the piezoelectric thick films have been used, illustrating how the fabrication process relates to the properties and performance of the resulting device. Other topics include: top-down and bottom-up fabrication of thick film MEMS, integration of thick films with other materials, effect of microstructure on properties, device performance, etc.

Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike. The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly 'green' adhesives. Information about regulations and compliance has been brought fully up-to-date. As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as: * Tamper-proof adhesives for electronic security devices. * Bio-compatible adhesives for implantable medical devices. * Electrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly - as required by regulatory regimes, e.g. the EU's Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market). * Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices.

In the era of cyber-physical systems, the area of control of complex systems has grown to be one of the hardest in terms of algorithmic design techniques and analytical tools. The 23 chapters, written by international specialists in the field, cover a variety of interests within the broader field of learning, adaptation, optimization and networked control. The editors have grouped these into the following 5 sections: "Introduction and Background on Control Theory", "Adaptive Control and Neuroscience", "Adaptive Learning Algorithms", "Cyber-Physical Systems and Cooperative Control", "Applications". The diversity of the research presented gives the reader a unique opportunity to explore a comprehensive overview of a field of great interest to control and system theorists. This book is intended for researchers and control engineers in machine learning, adaptive control, optimization and automatic control systems, including Electrical Engineers, Computer Science Engineers, Mechanical Engineers, Aerospace/Automotive Engineers, and Industrial Engineers. It could be used as a text or reference for advanced courses in complex control systems. * Collection of chapters from several well-known professors and researchers that will showcase their recent work * Presents different state-of-the-art control approaches and theory for complex systems * Gives algorithms that take into consideration the presence of modelling uncertainties, the unavailability of the model, the possibility of cooperative/non-cooperative goals and malicious attacks compromising the security of networked teams * Real system examples and figures throughout, make ideas concrete

Integrated Lasers on Silicon provides a comprehensive overview of the state-of-the-art use of lasers on silicon for photonic integration. The authors demonstrate the need for efficient laser sources on silicon, motivated by the development of on-board/on-chip optical interconnects and the different integration schemes available. The authors include detailed descriptions of Group IV-based lasers, followed by a presentation of the results obtained through the bonding approach (hybrid III-V lasers). The monolithic integration of III-V semiconductor lasers are explored, concluding with a discussion of the different kinds of cavity geometries benchmarked with respect to their potential integration on silicon in an industrial environment.

Although existing nanometer CMOS technology is expected to remain dominant for the next decade, new non-classical devices are being developed as the potential replacements of silicon CMOS, in order to meet the ever-present demand for faster, smaller, more efficient integrate circuits. Many new devices are based on novel emerging materials such as one-dimensional carbon nanotubes and two-dimensional graphene, non-graphene two-dimensional materials, and transition metal dichalcogenides. Such devices use on/off operations based on quantum mechanical current transport, and so their design and fabrication require an understanding of the electronic structures of materials and technologies. Moreover, new electronic design automation (EDA) tools and techniques need to be developed based on integrating devices from emerging novel material-based technologies. The aim of this book is to explore the materials and design requirements of these emerging integrated circuit technologies, and to outline their prospective applications. It will be useful for academics and research scientists interested in future directions and developments in design, materials and applications of novel integrated circuit technologies, and for research and development professionals working at the cutting edge of integrated circuit development.