This open access book presents theoretical framework and sample applications of variant construction. The first part includes the components variant logic, variant measurements, and variant maps, while the second part covers sample applications such as variation with functions, variant stream ciphers, quantum interference, classical/quantum random sequences, whole DNA sequences, and multiple-valued pulse sequences. Addressing topics ranging from logic and measuring foundation to typical applications and including various illustrated maps, it is a valuable guide for theoretical researchers in discrete mathematics; computing-, quantum- and communication scientists; big data engineers; as well as graduate and upper undergraduate students.

This book addresses the fundamental challenges underlying bioelectronics and tissue interface for clinical investigation. Appropriate for biomedical engineers and researchers, the authors cover topics ranging from retinal implants to restore vision, implantable circuits for neural implants, and intravascular electrochemical impedance to detect unstable plaques. In addition to these chapters, the authors also document the approaches and issues of multi-scale physiological assessment and monitoring in both humans and animal models for health monitoring and biological investigations; novel biomaterials such as conductive and biodegradable polymers to be used in biomedical devices; and the optimization of wireless power transfer via inductive coupling for batteryless and wireless implantable medical devices. In addition to engineers and researchers, this book is also an ideal supplementary or reference book for a number of courses in biomedical engineering programs, such as bioinstrumentation, MEMS/BioMEMS, bioelectronics and sensors, and more. Analyzes and discusses the electrode-tissue interfaces for optimization of biomedical devices. Introduces novel biomaterials to be used in next-generation biomedical devices. Discusses high-frequency transducers for biomedical applications.

This book provides a single-source reference to the state-of-the-art in logic synthesis. Readers will benefit from the authors' expert perspectives on new technologies and logic synthesis, new data structures, big data and logic synthesis, and convergent logic synthesis. The authors describe techniques that will enable readers to take advantage of recent advances in big data techniques and frameworks in order to have better logic synthesis algorithms.

Radio Frequency and Microwave Power Amplifiers are finding an increasingly broad range of applications, particularly in communications and broadcasting, but also in the industrial, medical, automotive, aviation, military, and sensing fields. Each application has its own design specifications, for example, high linearity in modern communication systems or high efficiency in broadcasting, and, depending on process technology, capability to operate efficiently at very high frequencies, such as 77 GHz and higher for automotive radars. Advances in design methodologies have practical applications in improving gain, power output, bandwidth, power efficiency, linearity, input and output impedance matching, and heat dissipation. This essential reference presented in two volumes aims to provide comprehensive, state-of-the-art coverage of RF and microwave power amplifier design with in-depth descriptions of current and potential future approaches. Volume 1 covers principles, device modeling and matching networks, while volume 2 focuses specifically on efficiency and linearity enhancement techniques. The volumes will be of particular interest to engineers and researchers engaged in RF and microwave amplifier design, and those who are interested in systems incorporating RF and microwave amplifiers.

This book describes the bottleneck faced soon by designers of traditional CMOS devices, due to device scaling, power and energy consumption, and variability limitations. This book aims at bridging the gap between device technology and architecture/system design. Readers will learn about challenges and opportunities presented by "beyond-CMOS devices" and gain insight into how these might be leveraged to build energy-efficient electronic systems.

This holistic book is an invaluable reference for addressing various practical challenges in architecting and engineering Intelligent IoT and eHealth solutions for industry practitioners, academic and researchers, as well as for engineers involved in product development. The first part provides a comprehensive guide to fundamentals, applications, challenges, technical and economic benefits, and promises of the Internet of Things using examples of real-world applications. It also addresses all important aspects of designing and engineering cutting-edge IoT solutions using a cross-layer approach from device to fog, and cloud covering standards, protocols, design principles, reference architectures, as well as all the underlying technologies, pillars, and components such as embedded systems, network, cloud computing, data storage, data processing, big data analytics, machine learning, distributed ledger technologies, and security. In addition, it discusses the effects of Intelligent IoT, which are reflected in new business models and digital transformation. The second part provides an insightful guide to the design and deployment of IoT solutions for smart healthcare as one of the most important applications of IoT. Therefore, the second part targets smart healthcare-wearable sensors, body area sensors, advanced pervasive healthcare systems, and big data analytics that are aimed at providing connected health interventions to individuals for healthier lifestyles.

This book focuses on conceptual frameworks that are helpful in understanding the basics of electronics - what the feedback system is, the principle of an oscillator, the operational working of an amplifier, and other relevant topics. It also provides an overview of the technologies supporting electronic systems, like OP-AMP, transistor, filter, ICs, and diodes. It consists of seven chapters, written in an easy and understandable language, and featuring relevant block diagrams, circuit diagrams, valuable and interesting solved examples, and important test questions. Further, the book includes up-to-date illustrations, exercises, and numerous worked examples to illustrate the theory and to demonstrate their use in practical designs.

This book fills in details that are often left out of modern books on the theory of antennas. The starting point is a discussion of some general principles that apply to all electronic systems and to antennas in particular. Just as time domain functions can be expanded in terms of sine waves using Fourier transforms, spatial domain functions can be expanded in terms of plane waves also using Fourier transforms, and K-space gain is the spatial Fourier transform of the aperture weighting function. Other topics discussed include the Discrete Fourier Transform (DFT) formulation of antenna gain and what is missing in this formulation, the effect of sky temperature on the often specified G/T ratio of antennas, sidelobe control using conventional and novel techniques, and ESA digital beamforming versus adaptive processing to limit interference. Presents content the author derived when first asked to evaluate the performance of an electronically scanned array under design with manufacturing imperfections and design limitations; Enables readers to understand the firm theoretical foundation of antenna gain even when they must start from well-known formulations rather than first principles; Explains in a straightforward manner the relationship between antenna gain and aperture area; Discusses the relationship between sidelobe control algorithms and aperture shape, how to take advantage of it, and what the penalties are; Shows the equivalence of Minimum-Variance, Distortionless Response (MVDR) and Space-Time Adaptive Processing (STAP) and how these algorithms can be used with ESA subarrays to mitigate interference.

This thesis explores several fundamental topics in mesoscopic circuitries that incorporate few electronic conduction channels. It reports a series of long-awaited experiments that establish a new state of the art. The first experiments address the quantized character of charge in circuits. We demonstrate the charge quantization criterion, observe the predicted charge quantization scaling and a crossover toward a universal behavior as temperature is increased. The second set of experiments addresses the unconventional quantum critical physics that arises in the multichannel Kondo model. We observe the predicted universal Kondo fixed points and validate the numerical renormalization group scaling curves. Away from the quantum critical point, we obtain a direct visualization of the development of a second-order quantum phase transition.

Since publication of the first edition in 1988 many significant advances have occurred in IC chips that have driven the hybrid packaging processes toward even higher densities and greater performance. The almost exponential increase in density, complexity, and performance of integrated circuits over the past ten years (for example, ASIC (Application Specific Integrated Circuit), VHSIC (Very High Speed IC), VLSIC (Very Large Scale IC), and ULSIC (Ultra Large Scale IC) have driven developments in the interconnect substrates culminating in what is now known as multichip modules (MCM). However, the fundamentals of design, fabrication, and testing of MCMs are essentially the same as for hybrid microcircuit. In the authors' opinion MCMs are extensions of hybrid circuits that can accommodate the new generation of high-speed high-performance chips.

In this revised edition they have therefore expanded their treatment of hybrid circuits without finding it necessary to change the fundamentals. They have included a separate chapter on multichip modules and throughout the book have included new and emerging materials and processes that are beginning to be used. Examples include: metal-matrix composites and aluminum nitride as substrate materials, plastic encapsulated microcircuits and chip-on-board as low-cost alternatives to hermetic sealed packages, atmospheric friendly cleaning solvents and methods, and advanced high I/O density quad flat packages (QFP) and ball grid array (BGA) packages. Since the first edition, there have also been tremendous advances in software programs for thermal and electrical analysis and these are also treated in this new edition.

The abbreviated Table ofContents below includes the chapter titles and selected sub-headings.

Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.

This book uses motivating examples and real-life attack scenarios to introduce readers to the general concept of fault attacks in cryptography. It offers insights into how the fault tolerance theories developed in the book can actually be implemented, with a particular focus on a wide spectrum of fault models and practical fault injection techniques, ranging from simple, low-cost techniques to high-end equipment-based methods. It then individually examines fault attack vulnerabilities in symmetric, asymmetric and authenticated encryption systems. This is followed by extensive coverage of countermeasure techniques and fault tolerant architectures that attempt to thwart such vulnerabilities. Lastly, it presents a case study of a comprehensive FPGA-based fault tolerant architecture for AES-128, which brings together of a number of the fault tolerance techniques presented. It concludes with a discussion on how fault tolerance can be combined with side channel security to achieve protection against implementation-based attacks. The text is supported by illustrative diagrams, algorithms, tables and diagrams presenting real-world experimental results.

The book focuses on system dependability modeling and calculation, considering the impact of s-dependency and uncertainty. The best suited approaches for practical system dependability modeling and calculation, (1) the minimal cut approach, (2) the Markov process approach, and (3) the Markov minimal cut approach as a combination of (1) and (2) are described in detail and applied to several examples. The stringently used Boolean logic during the whole development process of the approaches is the key for the combination of the approaches on a common basis. For large and complex systems, efficient approximation approaches, e.g. the probable Markov path approach, have been developed, which can take into account s-dependencies be-tween components of complex system structures. A comprehensive analysis of aleatory uncertainty (due to randomness) and epistemic uncertainty (due to lack of knowledge), and their combination, developed on the basis of basic reliability indices and evaluated with the Monte Carlo simulation method, has been carried out. The uncertainty impact on system dependability is investigated and discussed using several examples with different levels of difficulty. The applications cover a wide variety of large and complex (real-world) systems. Actual state-of-the-art definitions of terms of the IEC 60050-192:2015 standard, as well as the dependability indices, are used uniformly in all six chapters of the book.

This book introduces readers to electric circuits with variable loads and voltage regulators. It defines invariant relationships for numerous parameters, and proves the concepts characterizing these circuits. Moreover, the book presents the fundamentals of electric circuits and develops circuit theorems, while also familiarizing readers with generalized equivalent circuits and using projective geometry to interpret changes in operating regime parameters. It provides useful expressions for normalized regime parameters and changes in them, as well as convenient formulas for calculating currents. This updated and extended third edition features new chapters on the use of invariant properties in two-port circuits, invariant energy characteristics for limited single-valued two-port circuits, and on testing projective coordinates. Given its novel geometrical approach to real electrical circuits, the book offers a valuable guide for engineers, researchers, and graduate students who are interested in basic electric circuit theory and the regulation and monitoring of power supply systems.

Suitable as a reference work for reliability professionals or as a text for advanced undergraduate or graduate students, this book introduces the reader to the widely dispersed reliability literature of microelectronic and electronic-optional devices. Reliability and Failure of Electronic Materials and Devices integrates a treatment of chip and packaging level failures within the context of the atomic mechanisms and models used to explain degradation, and the statistical handling of lifetime data. Electromigration, dielectric radiation damage and the mechanical failure of contacts and solder joints are among the failure mechanisms considered. An underlying thread of the book concerns product defects--their relation to yield and reliability, the role they play in failure, and the way they are experimentally exposed.
The reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices, acquire skills in the mathematical handling of reliability data, and better appreciate future technology trends and the reliability issues they raise.
Key Features
* Discusses reliability and failure on both the chip and packaging levels
* Handles the role of defects in yield and reliability
* Includes a tutorial chapter on the mathematics of reliability
* Focuses on electromigration, dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, radiation damage and the mechanical failure of packages, contacts, and solder joints
* Considers defect detection methods and failure analysis techniques

This book is based on the 18 tutorials presented during the 28th workshop on Advances in Analog Circuit Design. Expert designers present readers with information about a variety of topics at the frontier of analog circuit design, including next-generation analog-to-digital converters , high-performance power management systems and technology considerations for advanced IC design. For anyone involved in analog circuit research and development, this book will be a valuable summary of the state-of-the-art in these areas. Provides a summary of the state-of-the-art in analog circuit design, written by experts from industry and academia; Presents material in a tutorial-based format; Includes coverage of next-generation analog-to-digital converters, high-performance power management systems, and technology considerations for advanced IC design.

This book discusses a number of important topical technical and non-technical issues related to the global energy, environment and socio-economic developments for professionals and students directly and indirectly involved in the relevant fields. It shows how renewable energy offers solutions to mitigate energy demand and helps achieve a clean environment, and also addresses the lack of a clear vision in the development of technology and a policy to reach the mandatory global renewable energy targets to reduce greenhouse gas emissions and stimulate socio-economic development. The book is structured in such a way that it provides a consistent compilation of fundamental theories, a compendium of current research and development activities as well as new directions to overcome critical limitations; future technologies for power grids and their control, stability and reliability are also presented.

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to "RF and Microwave Microelectronics Packaging" (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.

This book describes new and effective methodologies for modeling, analyzing and mitigating cell-internal signal electromigration in nanoCMOS, with significant circuit lifetime improvements and no impact on performance, area and power. The authors are the first to analyze and propose a solution for the electromigration effects inside logic cells of a circuit. They show in this book that an interconnect inside a cell can fail reducing considerably the circuit lifetime and they demonstrate a methodology to optimize the lifetime of circuits, by placing the output, Vdd and Vss pin of the cells in the less critical regions, where the electromigration effects are reduced. Readers will be enabled to apply this methodology only for the critical cells in the circuit, avoiding impact in the circuit delay, area and performance, thus increasing the lifetime of the circuit without loss in other characteristics.

This book describes RTL design using Verilog, synthesis and timing closure for System On Chip (SOC) design blocks. It covers the complex RTL design scenarios and challenges for SOC designs and provides practical information on performance improvements in SOC, as well as Application Specific Integrated Circuit (ASIC) designs. Prototyping using modern high density Field Programmable Gate Arrays (FPGAs) is discussed in this book with the practical examples and case studies. The book discusses SOC design, performance improvement techniques, testing and system level verification, while also describing the modern Intel FPGA/XILINX FPGA architectures and their use in SOC prototyping. Further, the book covers the Synopsys Design Compiler (DC) and Prime Time (PT) commands, and how they can be used to optimize complex ASIC/SOC designs. The contents of this book will be useful to students and professionals alike.

This book provides an overview of emerging topics in the field of hardware security, such as artificial intelligence and quantum computing, and highlights how these technologies can be leveraged to secure hardware and assure electronics supply chains. The authors are experts in emerging technologies, traditional hardware design, and hardware security and trust. Readers will gain a comprehensive understanding of hardware security problems and how to overcome them through an efficient combination of conventional approaches and emerging technologies, enabling them to design secure, reliable, and trustworthy hardware.

This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple's iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP - such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. - are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.

This book tackles important problems of anomaly detection and health status analysis in complex core router systems, integral to today's Internet Protocol (IP) networks. The techniques described provide the first comprehensive set of data-driven resiliency solutions for core router systems. The authors present an anomaly detector for core router systems using correlation-based time series analysis, which monitors a set of features of a complex core router system. They also describe the design of a changepoint-based anomaly detector such that anomaly detection can be adaptive to changes in the statistical features of data streams. The presentation also includes a symbol-based health status analyzer that first encodes, as a symbol sequence, the long-term complex time series collected from a number of core routers, and then utilizes the symbol sequence for health analysis. Finally, the authors describe an iterative, self-learning procedure for assessing the health status. Enables Accurate Anomaly Detection Using Correlation-Based Time-Series Analysis; Presents the design of a changepoint-based anomaly detector; Includes Hierarchical Symbol-based Health-Status Analysis; Describes an iterative, self-learning procedure for assessing the health status.

This textbook introduces readers to the recent advances in the emerging field of genetic design automation (GDA). Starting with an introduction and the basic concepts of molecular biology, the authors provide an overview of various genetic design automation tools. The authors then present the DVASim tool (Dynamic Virtual Analyzer and Simulator) which is used for the analysis and verification of genetic logic circuits. This includes methods and algorithms for the timing and threshold value analyses of genetic logic circuits. Next, the book presents the GeneTech tool (A technology mapping tool for genetic circuits) and the methods developed for optimization, synthesis, and technology mapping of genetic circuits. Chapters are followed by exercises which give readers hands-on practice with the tools presented. The concepts and algorithms are thoroughly described, enabling readers to improve the tools or use them as a starting point to develop new tools. Both DVASim and GeneTech are available from the developer's website, free of charge. This book is intended for a multidisciplinary audience of computer scientists, engineers and biologists. It provides enough background knowledge for computer scientists and engineers, who usually do not have any background in biology but are interested to get involved in this domain. This book not only presents an accessible basic introduction to molecular biology, it also includes software tools which allow users to perform laboratory experiments in a virtual in-silico environment. This helps newbies to get a quick start in understanding and developing genetic design automation tools. The third part of this book is particular useful for biologists who usually find it difficult to grasp programming and are reluctant to developing computer software. They are introduced to the graphical programming language, LabVIEW, from which they can start developing computer programs rapidly. Readers are further provided with small projects which will help them to start developing GDA tools.

VHDL Coding Styles and Methodologies provides an in-depth study of the VHDL language rules, coding styles, and methodologies. This book clearly distinguishes good from poor coding methodologies using an easy to remember symbology notation along with a rationale for each guideline. The VHDL concepts, rules and styles are demonstrated using complete compilable and simulatable examples which are also supplied on the accompanying disk. VHDL Coding Styles and Methodologies provides practical applications of VHDL and techniques that are current in the industry. It explains how to apply the VHDL guidelines using several complete examples. The learning by example' teaching approach along with an in-depth presentation of the language rules application methodology provides the necessary knowledge to create digital hardware designs and models that are readable, maintainable, predictable, and efficient. VHDL Coding Styles and Methodologies is intended for both college students and design engineers. It provides a practical approach to learning VHDL. Combining methodologies and coding styles along with VHDL rules leads the reader in the right direction from the beginning.