This book will explain how to verify SoC logic designs using "formal" and "semi-formal" verification techniques. The critical issue to be addressed is whether the functionality of the design is the one that the designers intended. Simulation has been used for checking the correctness of SoC designs (as in "functional" verification), but many subtle design errors cannot be caught by simulation. Recently, formal verification, giving mathematical proof of the correctness of designs, has been getting much more attention. So far, most of the books on formal verification target the register transfer level (RTL) or lower levels of design. For higher design productivity, it is essential to debug designs as early as possible. That is, designs should be completely verified at very abstracted design levels (higher than RTL). This book covers all aspects of high-level formal and semi-formal verification techniques for system level designs.
- First book that covers all aspects of formal and semi-formal, high-level (higher than RTL) design verification targeting SoC designs.
- Formal verification of high-level designs (RTL or higher).
- Verification techniques are discussed with associated system-level design methodology.

The ambitious objectives of future road mobility, i.e. fuel efficiency, reduced emissions, and zero accidents, imply a paradigm shift in the concept of the car regarding its architecture, materials, and propulsion technology, and require an intelligent integration into the systems of transportation and power. ICT, components and smart systems have been essential for a multitude of recent innovations, and are expected to be key enabling technologies for the changes ahead, both inside the vehicle and at its interfaces for the exchange of data and power with the outside world. It has been the objective of the International Forum on Advanced Microsystems for Automotive Applications (AMAA) for almost two decades to detect novel trends and to discuss technological implications and innovation potential from day one on. In 2012, the topic of the AMAA conference is "Smart Systems for Safe, Sustainable and Networked Vehicles". The conference papers selected for this book address current research, developments and innovations in the field of ICT, components and systems and other key enabling technologies leading to the automobile and road transport of the future. The book focuses on application fields such as electrification, power train and vehicle efficiency, safety and driver assistance, networked vehicles, as well as components and systems. Additional information is available at www.amaa.de

This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore's Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore's Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product.

Human lives are getting increasingly entangled with technology, especially comp- ing and electronics. At each step we take, especially in a developing world, we are dependent on various gadgets such as cell phones, handheld PDAs, netbooks, me- cal prosthetic devices, and medical measurement devices (e.g., blood pressure m- itors, glucometers). Two important design constraints for such consumer electronics are their form factor and battery life. This translates to the requirements of reduction in the die area and reduced power consumption for the semiconductor chips that go inside these gadgets. Performance is also important, as increasingly sophisticated applications run on these devices, and many of them require fast response time. The form factor of such electronics goods depends not only on the overall area of the chips inside them but also on the packaging, which depends on thermal ch- acteristics. Thermal characteristics in turn depend on peak power signature of the chips. As a result, while the overall energy usage reduction increases battery life, peak power reduction in?uences the form factor. One more important aspect of these electronic equipments is that every 6 months or so, a newer feature needs to be added to keep ahead of the market competition, and hence new designs have to be completed with these new features, better form factor, battery life, and performance every few months. This extreme pressure on the time to market is another force that drives the innovations in design automation of semiconductor chips.

Chalcopyrites, in particular those with a wide band gap, are fascinating materials in terms of their technological potential in the next generation of thin-film solar cells and in terms of their basic material properties. They exhibit uniquely low defect formation energies, leading to unusual doping and phase behavior and to extremely benign grain boundaries. This book collects articles on a number of those basic material properties of wide-gap chalcopyrites, comparing them to their low-gap cousins. They explore the doping of the materials, the electronic structure and the transport through interfaces and grain boundaries, the formation of the electric field in a solar cell, the mechanisms and suppression of recombination, the role of inhomogeneities, and the technological role of wide-gap chalcopyrites.

There is a wide field of tasks left that can only be satisfyingly attacked with the help of old-fashioned analogue technology, and one of the most important are amplifiers for analogue signals. The strongly expanded content of the second edition of "the sound of silence" leads to affordable amplifier design approaches which will end up in lowest-noise solutions not far away from the edge of physical boundaries set by room temperature and given cartridges - thus, fully compatible with very expensive so called "high-end" or "state-of-the-art" offers on today markets - and, from a noise point of view in most cases outperforming them

With easy to follow mathematical treatment it is demonstrated as well that theory is not far away from reality. Measured SNs will be found within 1dB off the calculated ones and deviations from the exact amplifier transfer won't cross the 0.1dB tolerance lines. Additionally, the book presents measurement set-ups and results. Consequently, comparisons with measurement results of test magazine will soon become easier to perform.

This new edition includes a new chapters about reference levels, Noise in Amp Input sections, Humming Problems, and much more."

This book provides a hands-on, application-oriented guide to the language and methodology of both SystemVerilog Assertions and Functional Coverage. Readers will benefit from the step-by-step approach to learning language and methodology nuances of both SystemVerilog Assertions and Functional Coverage, which will enable them to uncover hidden and hard to find bugs, point directly to the source of the bug, provide for a clean and easy way to model complex timing checks and objectively answer the question 'have we functionally verified everything'. Written by a professional end-user of ASIC/SoC/CPU and FPGA design and Verification, this book explains each concept with easy to understand examples, simulation logs and applications derived from real projects. Readers will be empowered to tackle the modeling of complex checkers for functional verification and exhaustive coverage models for functional coverage, thereby drastically reducing their time to design, debug and cover. This updated third edition addresses the latest functional set released in IEEE-1800 (2012) LRM, including numerous additional operators and features. Additionally, many of the Concurrent Assertions/Operators explanations are enhanced, with the addition of more examples and figures. * Covers in its entirety the latest IEEE-1800 2012 LRM syntax and semantics; * Covers both SystemVerilog Assertions and SystemVerilog Functional Coverage languages and methodologies; * Provides practical applications of the what, how and why of Assertion Based Verification and Functional Coverage methodologies; * Explains each concept in a step-by-step fashion and applies it to a practical real life example; * Includes 6 practical LABs that enable readers to put in practice the concepts explained in the book.

This monograph covers some selected problems of positive and fractional electrical circuits composed of resistors, coils, capacitors and voltage (current) sources. The book consists of 8 chapters, 4 appendices and a list of references. Chapter 1 is devoted to fractional standard and positive continuous-time and discrete-time linear systems without and with delays. In chapter 2 the standard and positive fractional electrical circuits are considered and the fractional electrical circuits in transient states are analyzed. Descriptor linear electrical circuits and their properties are investigated in chapter 3, while chapter 4 is devoted to the stability of fractional standard and positive linear electrical circuits. The reachability, observability and reconstructability of fractional positive electrical circuits and their decoupling zeros are analyzed in chapter 5. The fractional linear electrical circuits with feedbacks are considered in chapter 6. In chapter 7 solutions of minimum energy control for standard and fractional systems with and without bounded inputs is presented. In chapter 8 the fractional continuous-time 2D linear systems described by the Roesser type models are investigated.

This book describes methods to design distributed amplifiers useful for performing circuit functions such as duplexing, paraphrase amplification, phase shifting power splitting and power combiner applications. A CMOS bidirectional distributed amplifier is presented that combines for the first time device-level with circuit-level linearization, suppressing the third-order intermodulation distortion. It is implemented in 0.13um RF CMOS technology for use in highly-linear, low-cost UWB Radio-over-Fiber communication systems."

Design exibility and power consumption in addition to the cost, have always been the most important issues in design of integrated circuits (ICs), and are the main concerns of this research, as well. Energy Consumptions: Power dissipation (P ) and energy consumption are - diss pecially importantwhen there is a limited amountof power budgetor limited source of energy. Very common examples are portable systems where the battery life time depends on system power consumption. Many different techniques have been - veloped to reduce or manage the circuit power consumption in this type of systems. Ultra-low power (ULP) applications are another examples where power dissipation is the primary design issue. In such applications, the power budget is so restricted that very special circuit and system level design techniquesare needed to satisfy the requirements. Circuits employed in applications such as wireless sensor networks (WSN), wearable battery powered systems [1], and implantable circuits for biol- ical applications need to consume very low amount of power such that the entire system can survive for a very long time without the need for changingor recharging battery[2-4]. Using newpowersupplytechniquessuchas energyharvesting[5]and printable batteries [6], is another reason for reducing power dissipation. Devel- ing special design techniques for implementing low power circuits [7-9], as well as dynamic power management (DPM) schemes [10] are the two main approaches to control the system power consumption. Design Flexibility: Design exibility is the other important issue in modern in- grated systems.

This book provides a comprehensive methodology for automated design, test and diagnosis, and use of robust, low-cost, and manufacturable digital microfluidic systems. It focuses on the development of a comprehensive CAD optimization framework for digital microfluidic biochips that unifies different design problems. With the increase in system complexity and integration levels, biochip designers can utilize the design methods described in this book to evaluate different design alternatives, and carry out design-space exploration to obtain the best design point.

This book addresses the theoretical and practical circuit and system concepts that underpin the design of reliable and reproducible, high performance, monolithic feedback circuits. It is intended for practicing electronics engineers and students who wish to acquire an insightful understanding of the ways in which open loop topologies, closed loop architectures, and fundamental circuit theoretic issues combine to determine the limits of performance of analog networks. Since many of the problems that underpin high speed digital circuit design are a subset of the analysis and design dilemmas confronted by wideband analog circuit designers, the book is also germane to high performance digital circuit design.

This textbook presents the mathematical theory and techniques necessary for analyzing and modeling high-performance global networks, such as the Internet. The three main building blocks of high-performance networks are links, switching equipment connecting the links together and software employed at the end nodes and intermediate switches. This book provides the basic techniques for modeling and analyzing these last two components. Topics covered include, but are not limited to: Markov chains and queuing analysis, traffic modeling, interconnection networks and switch architectures and buffering strategies.

This text/reference provides background for those new to the field, gives numerous problems sets and practical examples, and discusses computer aided design and analysis. Annotation copyright Book News, Inc. Portland, Or.

This book fits in the quest for highly efficient fully integrated xDSL modems for central office applications. It presents a summary of research at one of Europe 's most famous analog design research groups over a five year period. The book focuses on the line driver, the most demanding building block of the xDSL modem for lowering power.

The book covers the total design flow of monolithic CMOS high voltage circuits. It is essential reading for analog design engineers.

This book is dedicated to Prof. Peter Young on his 70th birthday. Professor Young has been a pioneer in systems and control, and over the past 45 years he has influenced many developments in this field. This volume comprises a collection of contributions by leading experts in system identification, time-series analysis, environmetric modelling and control system design - modern research in topics that reflect important areas of interest in Professor Young's research career. Recent theoretical developments in and relevant applications of these areas are explored treating the various subjects broadly and in depth. The authoritative and up-to-date research presented here will be of interest to academic researcher in control and disciplines related to environmental research, particularly those to with water systems. The tutorial style in which many of the contributions are composed also makes the book suitable as a source of study material for graduate students in those areas.

This book describes an approach for designing Systems-on-Chip such that the system meets precise mathematical requirements. The methodologies presented enable embedded systems designers to reuse intellectual property (IP) blocks from existing designs in an efficient, reliable manner, automatically generating correct SoCs from multiple, possibly mismatching, components.

Model based testing is the most powerful technique for testing hardware and software systems. Models in Hardware Testing describes the use of models at all the levels of hardware testing. The relevant fault models for nanoscaled CMOS technology are introduced, and their implications on fault simulation, automatic test pattern generation, fault diagnosis, memory testing and power aware testing are discussed. Models and the corresponding algorithms are considered with respect to the most recent state of the art, and they are put into a historical context by a concluding chapter on the use of physical fault models in fault tolerance.

Due to the ever increasing electric fields in scaled CMOS devices, reliability is becoming a showstopper for further scaled technology nodes. Although several groups have already demonstrated functional Si channel devices with aggressively scaled Equivalent Oxide Thickness (EOT) down to 5A, a 10 year reliable device operation cannot be guaranteed anymore due to severe Negative Bias Temperature Instability.

This book focuses on the reliability of the novel (Si)Ge channel quantum well pMOSFET technology. This technology is being considered for possible implementation in next CMOS technology nodes, thanks to its benefit in terms of carrier mobility and device threshold voltage tuning. We observe that it also opens a degree of freedom for device reliability optimization. By properly tuning the device gate stack, sufficiently reliable ultra-thin EOT devices with a 10 years lifetime at operating conditions are demonstrated.

The extensive experimental datasets collected on a variety of processed 300mm wafers and presented here show the reliability improvement to be process - and architecture-independent and, as such, readily transferable to advanced device architectures as Tri-Gate (finFET) devices. We propose a physical model to understand the intrinsically superior reliability of the MOS system consisting of a Ge-based channel and a SiO2/HfO2 dielectric stack.

The improved reliability properties here discussed strongly support (Si)Ge technology as a clear frontrunner for future CMOS technology nodes."

This edited volume presents the proceedings of the AMAA 2015 conference, Berlin, Germany. The topical focus of the 2015 conference lies on smart systems for green and automated driving. The automobile of the future has to respond to two major trends, the electrification of the drivetrain, and the automation of the transportation system. These trends will not only lead to greener and safer driving but re-define the concept of the car completely, particularly if they interact with each other in a synergetic way as for autonomous parking and charging, self-driving shuttles or mobile robots. Key functionalities like environment perception are enabled by electronic components and systems, sensors and actuators, communication nodes, cognitive systems and smart systems integration. The book will be a valuable read for research experts and professionals in the automotive industry but the book may also be beneficial for graduate students.

This book describes design techniques that can be used to mitigate crosstalk in high-speed I/O circuits. The focus of the book is in developing compact and low power integrated circuits for crosstalk cancellation, inter-symbol interference (ISI) mitigation and improved bit error rates (BER) at higher speeds. This book is one of the first to discuss in detail the problem of crosstalk and ISI mitigation encountered as data rates have continued beyond 10Gb/s. Readers will learn to avoid the data performance cliff, with circuits and design techniques described for novel, low power crosstalk cancellation methods that are easily combined with current ISI mitigation architectures.

Since scaling of CMOS is reaching the nanometer area serious limitations enforce the introduction of novel materials, device architectures and device concepts. Multi-gate devices employing high-k gate dielectrics are considered as promising solution overcoming these scaling limitations of conventional planar bulk CMOS. Variation Aware Analog and Mixed-Signal Circuit Design in Emerging Multi-Gate CMOS Technologies provides a technology oriented assessment of analog and mixed-signal circuits in emerging high-k and multi-gate CMOS technologies.

This book provides a single-source reference to the state-of-the art in tunneling field effect transistors (TFETs). Readers will learn the TFETs physics from advanced atomistic simulations, the TFETs fabrication process and the important roles that TFETs will play in enabling integrated circuit designs for power efficiency.

Since the 1997 Kyoto protocol of reduction of greenhouse gas emissions, the development of novel refrigerators has been a priority within the scientific community. Although magnetocaloric materials are promising candidates, they still need a large magnetic field to induce a giant T as well as powerful and costly magnets. However, in electrocaloric materials (ECMs) a temperature change may be achieved by applying or removing an electric field. Since a giant electrocaloric effect on ferroelectric thin films was reported in Science in 2006, researchers have been inspired to explore such effect in different ferroelectric thin films. This book reviews electrocaloric effects observed in bulk materials as well as recent promising advances in thin films, with special emphasis on the ferroelectric, antiferroelectric and relaxor nature of ECMs. It reports a number of considerations about the future of ECMs as a means of achieving an efficient, ecologically sustainable and low cost refrigerator.

The electronics and information technology revolution continues, but it is a critical time in the development of technology. Once again, we stand on the brink of a new era where emerging research will yield exciting applications and products destined to transform and enrich our daily lives! The potential is staggering and the ultimate impact is unimaginable, considering the continuing marriage of te- nology with fields such as medicine, communications and entertainment, to name only a few. But who will actually be responsible for transforming these potential new pr- ucts into reality? The answer, of course, is today's (and tomorrow's) design en- neers! The design of integrated circuits today remains an essential discipline in s- port of technological progress, and the authors of this book have taken a giant step forward in the development of a practice-oriented treatise for design engineers who are interested in the practical, industry-driven world of integrated circuit - sign.