During the last one and a half decades, wireless sensor networks have witnessed significant growth and tremendous development in both academia and industry. A large number of researchers, including computer scientists and engineers, have been interested in solving challenging problems that span all the layers of the protocol stack of sensor networking systems. Several venues, such as journals, conferences, and workshops, have been launched to cover innovative research and practice in this promising and rapidly advancing field. Because of these trends, I thought it would be beneficial to provide our sensor networks community with a comprehensive reference on as much of the findings as possible on a variety of topics in wireless sensor networks. As this area of research is in continuous progress, it does not seem to be a reasonable solution to keep delaying the publication of such reference any more. This book relates to the second volume and focuses on the advanced topics and applications of wireless sensor networks. Our rationale is that the second volume has all application-specific and non-conventional sensor networks, emerging techniques and advanced topics that are not as matured as what is covered in the first volume. Thus, the second volume deals with three-dimensional, underground, underwater, body-mounted, and societal networks. Following Donald E. Knuth's above-quoted elegant strategy to focus on several important fields (The Art of Computer Programming: Fundamental Algorithms, 1997), all the book chapters in this volume include up-to-date research work spanning various topics, such as stochastic modeling, barrier and spatiotemporal coverage, tracking, estimation, counting, coverage and localization in three-dimensional sensor networks, topology control and routing in three-dimensional sensor networks, underground and underwater sensor networks, multimedia and body sensor networks, and social sensing. Most of these major topics can be covered in an advanced course on wireless sensor networks. This book will be an excellent source of information for graduate students majoring in computer science, computer engineering, electrical engineering, or any related discipline. Furthermore, computer scientists, researchers, and practitioners in both academia and industry will find this book useful and interesting.

This book defines and explores the problem of placing the instances of dynamic data types on the components of the heterogeneous memory organization of an embedded system, with the final goal of reducing energy consumption and improving performance. It is one of the first to cover the problem of placement for dynamic data objects on embedded systems with heterogeneous memory architectures, presenting a complete methodology that can be easily adapted to real cases and work flows. The authors discuss how to improve system performance and energy consumption simultaneously. Discusses the problem of placement for dynamic data objects on embedded systems with heterogeneous memory architectures; Presents a complete methodology that can be adapted easily to real cases and work flows; Offers hints on how to improve system performance and energy consumption simultaneously.

"Materials and Reliability Handbook for Semiconductor Optical and Electron Devices" provides comprehensive coverage of reliability procedures and approaches for electron and photonic devices. These include lasers and high speed electronics used in cell phones, satellites, data transmission systems and displays. Lifetime predictions for compound semiconductor devices are notoriously inaccurate due to the absence of standard protocols. Manufacturers have relied on extrapolation back to room temperature of accelerated testing at elevated temperature. This technique fails for scaled, high current density devices. Device failure is driven by electric field or current mechanisms or low activation energy processes that are masked by other mechanisms at high temperature.

The" Handbook "addresses reliability engineering for III-V devices, including materials and electrical characterization, reliability testing, and electronic characterization. These are used to develop new simulation technologies for device operation and reliability, which allow accurate prediction of reliability as well as the design specifically for improved reliability. The "Handbook" emphasizes physical mechanisms rather than an electrical definition of reliability. Accelerated aging is useful only if the failure mechanism is known. The Handbook also focuses on voltage and current acceleration stress mechanisms."

The ambitious objectives of future road mobility, i.e. fuel efficiency, reduced emissions, and zero accidents, imply a paradigm shift in the concept of the car regarding its architecture, materials, and propulsion technology, and require an intelligent integration into the systems of transportation and power. ICT, components and smart systems have been essential for a multitude of recent innovations, and are expected to be key enabling technologies for the changes ahead, both inside the vehicle and at its interfaces for the exchange of data and power with the outside world. It has been the objective of the International Forum on Advanced Microsystems for Automotive Applications (AMAA) for almost two decades to detect novel trends and to discuss technological implications and innovation potential from day one on. In 2012, the topic of the AMAA conference is "Smart Systems for Safe, Sustainable and Networked Vehicles". The conference papers selected for this book address current research, developments and innovations in the field of ICT, components and systems and other key enabling technologies leading to the automobile and road transport of the future. The book focuses on application fields such as electrification, power train and vehicle efficiency, safety and driver assistance, networked vehicles, as well as components and systems. Additional information is available at www.amaa.de

This book presents a tutorial review of van der Pol model, a universal oscillator model for the analysis of modern RC oscillators in weak and strong nonlinear regimes. A detailed analysis of the injection locking in van der Pol oscillators is also presented. The relation between the van der Pol parameters and several circuit implementations in CMOS nanotechnology is given, showing that this theory is very useful in the optimization of oscillator key parameters, such as: frequency, amplitude and phase relationship. The authors discuss three different examples: active coupling RC oscillators, capacitive coupling RC oscillators, and two-integrator oscillator working in the sinusoidal regime. * Provides a detailed tutorial on the van der Pol oscillator model, which can be the basis for the analysis of modern RC oscillators in weak and strong nonlinear regimes; * Demonstrations the relationship between the van der Pol parameters and several circuit implementations in CMOS nanotechnology, showing that this theory is a powerful tool in the optimization of key oscillator parameters; * Provides three circuit prototypes implemented in modern CMOS nanotechnology in the GHz range, with applications in low area, low power, low cost, wireless sensor network (WSN) applications (e.g. IoT, BLE).

This book will explain how to verify SoC logic designs using "formal" and "semi-formal" verification techniques. The critical issue to be addressed is whether the functionality of the design is the one that the designers intended. Simulation has been used for checking the correctness of SoC designs (as in "functional" verification), but many subtle design errors cannot be caught by simulation. Recently, formal verification, giving mathematical proof of the correctness of designs, has been getting much more attention. So far, most of the books on formal verification target the register transfer level (RTL) or lower levels of design. For higher design productivity, it is essential to debug designs as early as possible. That is, designs should be completely verified at very abstracted design levels (higher than RTL). This book covers all aspects of high-level formal and semi-formal verification techniques for system level designs.
- First book that covers all aspects of formal and semi-formal, high-level (higher than RTL) design verification targeting SoC designs.
- Formal verification of high-level designs (RTL or higher).
- Verification techniques are discussed with associated system-level design methodology.

This book comprises select proceedings of the 43rd National Systems Conference on Innovative and Emerging Trends in Engineering Systems (NSC 2019) held at the Indian Institute of Technology, Roorkee, India. The contents cover latest research in the highly multidisciplinary field of systems engineering, and discusses its various aspects like systems design, dynamics, analysis, modeling and simulation. Some of the topics covered include computing systems, consciousness systems, electrical systems, energy systems, manufacturing systems, mechanical systems, literary systems, social systems, and quantum and nano systems. Given the scope of the contents, this book will be useful for researchers and professionals from diverse engineering and management background.

"Microelectronic Test Structures for CMOS Technology and Products" addresses the basic concepts of the design of test structures for incorporation within test-vehicles, scribe-lines, and CMOS products. The role of test structures in the development and monitoring of CMOS technologies and products has become ever more important with the increased cost and complexity of development and manufacturing. In this timely volume, IBM scientists Manjul Bhushan and Mark Ketchen emphasize high speed characterization techniques for digital CMOS circuit applications and bridging between circuit performance and characteristics of MOSFETs and other circuit elements. Detailed examples are presented throughout, many of which are equally applicable to other microelectronic technologies as well. The authors' overarching goal is to provide students and technology practitioners alike a practical guide to the disciplined design and use of test structures that give unambiguous information on the parametrics and performance of digital CMOS technology. "

At 90 nm, wires account for nearly 75% of the total delay in a circuit. Even more insidious, however, is that among nearly 40% of these nets, more than 50% of their total net capacitance are attributed to the cross-coupling capacitance between neighboring signals. At this point a new design and optimization paradigm based on real wires is required. Nanometer routers must prevent and correct these effects on-the-fly in order to reach timing closure.

This book describes a new type of passive electronic components, called fractal elements, from a theoretical and practical point of view. The authors discuss in detail the physical implementation and design of fractal devices for application in fractional-order signal processing and systems. The concepts of fractals and fractal signals are explained, as well as the fundamentals of fractional calculus. Several implementations of fractional impedances are discussed, along with comparison of their performance characteristics. Details of design, schematics, fundamental techniques and implementation of RC-based fractal elements are provided.

This volume gives the latest developments in on the mechanisms of cancer cell resistance to apoptotic stimuli, which eventually result in cancer progression and metastasis. One of the main challenges in cancer research is to develop new therapies to combat resistant tumors. The development of new effective therapies will be dependent on delineating the biochemical, molecular, and genetic mechanisms that regulate tumor cell resistance to cytotoxic drug-induced apoptosis. These mechanisms should reveal gene products that directly regulate resistance in order to develop new drugs that target these resistance factors and such new drugs may either be selective or common to various cancers. If successful, new drugs may not be toxic and may be used effectively in combination with subtoxic conventional drugs to achieve synergy and to reverse tumor cell resistance. The research developments presented in this book can be translated to produce better clinical responses to resistant tumors.

This book includes a selection of the best contributions to the Forum on Specification and Design Languages held in 2005 (FDL'05). It provides detailed insights into recent works dealing with a large spectrum of issues in system-on-chip design. All the chapters have been carefully revised and extended to offer up-to-date information. They also provide seeds for further researches and developments in the field of heterogeneous systems-on-chip design.

Many and ever more mobile users wish to enjoy a variety of multimedia services, in very diverse geographical environments. The growing number of communication options within and across wireless standards is accommodating the growing volume and heterogeneity in wireless wishes. On the other hand, advancement in radio technologies opening much more flexibility, a.o. through Software Defined Radios, opens up the possibility to realize mobile devices featuring multi-mode options at low cost and interesting form factors.

It is crucial to manage the new degrees of freedom opened up in radios and standards in a smart way, such that the required service is offered at satisfactory quality as efficiently as possible. Efficiency in energy consumption is clearly primordial for battery powered mobile terminals specifically, and in the context of growing ecological concerns in a broader context. Moreover, efficient usage of the spectrum is a growing prerequisite for wireless systems, and coexistence of different standards puts overall throughput at risk.

The management of flexibility risks bringing about intolerable complexity and hamper the desired agility. A systematic approach, consisting of anticipative preparing for smooth operation, allows mastering this challenge. Case studies show that already today, this approach enables smart operation of radios realizing impressive efficiency gains without hampering Quality-of-Service. In the future wireless communication scenes will be able to profit form the opening of the spectrum. Even smarter and cognitive behavior will become possible and essential.

This monograph covers some selected problems of positive and fractional electrical circuits composed of resistors, coils, capacitors and voltage (current) sources. The book consists of 8 chapters, 4 appendices and a list of references. Chapter 1 is devoted to fractional standard and positive continuous-time and discrete-time linear systems without and with delays. In chapter 2 the standard and positive fractional electrical circuits are considered and the fractional electrical circuits in transient states are analyzed. Descriptor linear electrical circuits and their properties are investigated in chapter 3, while chapter 4 is devoted to the stability of fractional standard and positive linear electrical circuits. The reachability, observability and reconstructability of fractional positive electrical circuits and their decoupling zeros are analyzed in chapter 5. The fractional linear electrical circuits with feedbacks are considered in chapter 6. In chapter 7 solutions of minimum energy control for standard and fractional systems with and without bounded inputs is presented. In chapter 8 the fractional continuous-time 2D linear systems described by the Roesser type models are investigated.

This book provides an invaluable primer on the techniques utilized in the design of low power digital semiconductor devices. Readers will benefit from the hands-on approach which starts form the ground-up, explaining with basic examples what power is, how it is measured and how it impacts on the design process of application-specific integrated circuits (ASICs). The authors use both the Unified Power Format (UPF) and Common Power Format (CPF) to describe in detail the power intent for an ASIC and then guide readers through a variety of architectural and implementation techniques that will help meet the power intent. From analyzing system power consumption, to techniques that can be employed in a low power design, to a detailed description of two alternate standards for capturing the power directives at various phases of the design, this book is filled with information that will give ASIC designers a competitive edge in low-power design.

This book shares with readers practical design knowledge gained from the author's 24 years of IC design experience. The author addresses issues and challenges faced commonly by IC designers, along with solutions and workarounds. Guidelines are described for tackling issues such as clock domain crossing, using lockup latch to cross clock domains during scan shift, implementation of scan chains across power domain, optimization methods to improve timing, how standard cell libraries can aid in synthesis optimization, BKM (best known method) for RTL coding, test compression, memory BIST, usage of signed Verilog for design requiring +ve and -ve calculations, state machine, code coverage and much more. Numerous figures and examples are provided to aid the reader in understanding the issues and their workarounds.

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

Human lives are getting increasingly entangled with technology, especially comp- ing and electronics. At each step we take, especially in a developing world, we are dependent on various gadgets such as cell phones, handheld PDAs, netbooks, me- cal prosthetic devices, and medical measurement devices (e.g., blood pressure m- itors, glucometers). Two important design constraints for such consumer electronics are their form factor and battery life. This translates to the requirements of reduction in the die area and reduced power consumption for the semiconductor chips that go inside these gadgets. Performance is also important, as increasingly sophisticated applications run on these devices, and many of them require fast response time. The form factor of such electronics goods depends not only on the overall area of the chips inside them but also on the packaging, which depends on thermal ch- acteristics. Thermal characteristics in turn depend on peak power signature of the chips. As a result, while the overall energy usage reduction increases battery life, peak power reduction in?uences the form factor. One more important aspect of these electronic equipments is that every 6 months or so, a newer feature needs to be added to keep ahead of the market competition, and hence new designs have to be completed with these new features, better form factor, battery life, and performance every few months. This extreme pressure on the time to market is another force that drives the innovations in design automation of semiconductor chips.

This book describes methods to design distributed amplifiers useful for performing circuit functions such as duplexing, paraphrase amplification, phase shifting power splitting and power combiner applications. A CMOS bidirectional distributed amplifier is presented that combines for the first time device-level with circuit-level linearization, suppressing the third-order intermodulation distortion. It is implemented in 0.13um RF CMOS technology for use in highly-linear, low-cost UWB Radio-over-Fiber communication systems."

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

Nanorobots represent a nanoscale device where proteins such as DNA, carbon nanotubes could act as motors, mechanical joints, transmission elements, or sensors. When these different components were assembled together they can form nanorobots with multi-degree-of-freedom, able to apply forces and manipulate objects in the nanoscale world. Design, Modeling and Characterization of Bio-Nanorobotic Systems investigates the design, assembly, simulation, and prototyping of biological and artificial molecular structures with the goal of implementing their internal nanoscale movements within nanorobotic systems in an optimized manner.

It has been more than 20 years since the seminal publications on side-channel attacks. They aim at extracting secrets from embedded systems while they execute cryptographic algorithms, and they consist of two steps, measurement and analysis. This book tackles the analysis part, especially under situations where the targeted device is protected by random masking. The authors explain advances in the field and provide the reader with mathematical formalizations. They present all known analyses within the same notation framework, which allows the reader to rapidly understand and learn contrasting approaches. It will be useful as a graduate level introduction, also for self-study by researchers and professionals, and the examples are taken from real-world datasets.

Analog Circuit Design contains the contribution of 18 tutorials of the 18th workshop on Advances in Analog Circuit Design. Each part discusses a specific to-date topic on new and valuable design ideas in the area of analog circuit design. Each part is presented by six experts in that field and state of the art information is shared and overviewed. This book is number 18 in this successful series of Analog Circuit Design, providing valuable information and excellent overviews of: Smart Data Converters: Chaired by Prof. Arthur van Roermund, Eindhoven University of Technology, Filters on Chip: Chaired by Herman Casier, AMI Semiconductor Fellow, Multimode Transmitters: Chaired by Prof. M. Steyaert, Catholic University Leuven, Analog Circuit Design is an essential reference source for analog circuit designers and researchers wishing to keep abreast with the latest development in the field. The tutorial coverage also makes it suitable for use in an advanced design.

With the semiconductor market growth, new Integrated Circuit designs are pushing the limit of the technology and in some cases, require speci?c ?ne-tuning of certain process modules in manufacturing. Thus the communities of design and technology are increasingly intertwined. The issues that require close interactions and colla- ration for trade-off and optimization across the design/device/process ?elds are addressed in this book. It contains a set of outstanding papers, keynote and tutorials presented during 3 days at the International Conference on Integrated Circuit Design and Technology (ICICDT) held in June 2008 in Minatec, Grenoble. The selected papers are spread over ?ve chapters covering various aspects of emerging technologies and devices, advanced circuit design, reliability, variability issues and solutions, advanced memories and analog and mixed signals. All these papers are focusing on design and technology interactions and comply with the scope of the conference. v . Contents Part I Introduction 1 Synergy Between Design and Technology: A Key Factor in the Evolving Microelectronic Landscape. . . . . . . . . . . . . . . . . . . . . . 3 Michel Brilloue]t Part II Emerging Technologies and Circuits 2 New State Variable Opportunities Beyond CMOS: A System Perspective . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Victor V. Zhirnov, Ralph K. Cavin, and George I. Bourianoff 3 A Simple Compact Model to Analyze the Impact of Ballistic and Quasi-Ballistic Transport on Ring Oscillator Performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 S. Martinie, D. Munteanu, G. Le Carval, and J. L. Autran Part III Advanced Devices and Circuits 4 Low-Voltage Scaled 6T FinFET SRAM Cells . . . . . . . . . . . . . . . . . . . 55 N. Collaert, K. von Arnim, R. Rooyackers, T."

This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore's Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore's Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product.