This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes. The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc.

This text sets out to provide a source of design techniques for leading to reduction in expense, size and weight of directional couplers and filters. It also gives step-by-step procedures for enhancing circuit performance. Numerous design examples and verified measured results for ultrawideband, bandpass, periodic and co-directional couplers are provided.

This book describes the state-of-the art of industrial and academic research in the architectural design of heterogeneous, multi/many-core processors. The authors describe methods and tools to enable next-generation embedded and high-performance heterogeneous processors to confront cost-effectively the inevitable variations by providing Dependable-Performance: correct functionality and timing guarantees throughout the expected lifetime of a platform under thermal, power, and energy constraints. Various aspects of the reliability problem are discussed, at both the circuit and architecture level, the intelligent selection of knobs and monitors in multicore platforms, and systematic design methodologies. The authors demonstrate how new techniques have been applied in real case studies from different applications domain and report on results and conclusions of those experiments. Enables readers to develop performance-dependable heterogeneous multi/many-core architectures Describes system software designs that support high performance dependability requirements Discusses and analyzes low level methodologies to tradeoff conflicting metrics, i.e. power, performance, reliability and thermal management Includes new application design guidelines to improve performance dependability

This book introduces a novel framework for accurately modeling the errors in nanoscale CMOS technology and developing a smooth tool flow at high-level design abstractions to estimate and mitigate the effects of errors. The book presents novel techniques for high-level fault simulation and reliability estimation as well as architecture-level and system-level fault tolerant designs. It also presents a survey of state-of-the-art problems and solutions, offering insights into reliability issues in digital design and their cross-layer countermeasures.

This volume of the Lecture Notes in Mobility series contains papers written by speakers and poster presenters at the 21st International Forum on Advanced Microsystems for Automotive Applications (AMAA 2017) "Smart Systems Transforming the Automobile" that was held in Berlin, Germany in September 2017. The authors report about recent breakthroughs in electric and electronic components and systems, driver assistance and vehicle automation as well as safety and testing. Furthermore, legal aspects and impacts of connected and automated driving are covered. The target audience primarily comprises research experts and practitioners in industry and academia, but the book may also be beneficial for graduate students alike.

The book Electric Circuit AnalysisA" has been designed as an introductory course for all disciplines of Engineering and has a much greater significance for students of Electrical, Communication & Instrumentation Engineering. This book helps in learning the basics of electrical circuit elements and provides the ways to connect them in circuit. Also some of the basic mathematical techniques are given, useful for solving linear differential equations which is a pre-requisite of both undergraduate and graduate programmes. In this revised edition, the main objective is to provide a detailed account of basic circuit concept, circuit model and methods of circuit analysis in time and frequency domain for solving simple and multidimensional circuit problems.

This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.

This book provides readers with insight into an alternative approach for enhancing the reliability, security, and low power features of integrated circuit designs, related to transient faults, hardware Trojans, and power consumption. The authors explain how the addition of integrated sensors enables the detection of ionizing particles and how this information can be processed at a high layer. The discussion also includes a variety of applications, such as the detection of hardware Trojans and fault attacks, and how sensors can operate to provide different body bias levels and reduce power costs. Readers can benefit from these sensors-based approaches through designs with fast response time, non-intrusive integration on gate-level and reasonable design costs.

This book provides a single-source reference to the state-of-the-art of high-level programming models and compilation tool-chains for embedded system platforms. The authors address challenges faced by programmers developing software to implement parallel applications in embedded systems, where very often they are forced to rewrite sequential programs into parallel software, taking into account all the low level features and peculiarities of the underlying platforms. Readers will benefit from these authors' approach, which takes into account both the application requirements and the platform specificities of various embedded systems from different industries. Parallel programming tool-chains are described that take as input parameters both the application and the platform model, then determine relevant transformations and mapping decisions on the concrete platform, minimizing user intervention and hiding the difficulties related to the correct and efficient use of memory hierarchy and low level code generation.

This fully updated textbook provides complete coverage of electrical circuits and introduces students to the field of energy conversion technologies, analysis and design. Chapters are designed to equip students with necessary background material in such topics as devices, switching circuit analysis techniques, converter types, and methods of conversion. The book contains a large number of examples, exercises, and problems to help enforce the material presented in each chapter. A detailed discussion of resonant and softswitching dc-to-dc converters is included along with the addition of new chapters covering digital control, non-linear control, and micro-inverters for power electronics applications. Designed for senior undergraduate and graduate electrical engineering students, this book provides students with the ability to analyze and design power electronic circuits used in various industrial applications.

This book discusses key techniques of protection and fault ride-through in VSC-HVDC grids, including high-speed selective protection, DC fault current limitation, converter restarting, and DCCB reclosing strategies. It investigates how high-speed transient-variable-based protection can be used to improve grids' acting sensitivity, acting reliability, and ability to withstand high transition resistance compared with traditional protection. In addition, it discusses the applicability of the pilot protections, including the current differential protection and travelign-wave based protection, in the dc grid, as well as the improved methods. Furthermore, it proposes several DC FCL topologies, which are suitable for DC grids. Lastly, in the context of overhead line application conditions, it explores converter restarting and DCCB reclosing strategies, which not only identify the fault property, but also limit the secondary damage to the system, improving the system's operation security and reliability. As such, the book offers a comprehensive overview of original and advanced methods and techniques for the protection of VSC-HVDC grids.

Electroacoustic transducers (EAT) are devices, which transform electric energy to energy of acoustic fluctuations. Principles of action, design of transducers for work in air and water as well as for non-destructive control are described in the book. New technologies of designing EAT, not only expanding designing possibilities, are described. They also allow to create transducers with improved characteristics. In particular, methods to increase target capacity (sound pressure), decrease working (resonant) frequency of transducers and expand frequencies of projectors and sound receivers are developed. Methods and control units of transducers in batch production of transducers are described, too.

This volume of the Lecture Notes in Mobility series contains papers written by speakers at the 22nd International Forum on Advanced Microsystems for Automotive Applications (AMAA 2018) "Smart Systems for Clean, Safe and Shared Road Vehicles" that was held in Berlin, Germany in September 2018. The authors report about recent breakthroughs in electric and electronic components and systems, driver assistance, vehicle automation and electrification as well as data, clouds and machine learning. Furthermore, innovation aspects and impacts of connected and automated driving are covered. The target audience primarily comprises research experts and practitioners in industry and academia, but the book may also be beneficial for graduate students alike.

The book includes high-quality papers presented at the 4th International Conference on Smart Learning Ecosystems and Regional Development at Universita Roma Tor Vergata, Italy, from 22 to 24 May, 2019. Providing insights into the relevance of smart learning ecosystems (schools, campuses, the workplace, informal learning contexts, etc.) for regional development and social innovation, it also discusses how citizens' involvement with smart ecosystems can be increased and made more effective.

This book introduces Software Thermal Management (STM) as a means of reducing power consumption in a computing system in order to manage heat, improve component reliability and increase system safety. Readers will benefit from this pragmatic guide to the field of STM for embedded systems and its catalog of software power management techniques. Since thermal management is a key bottleneck in embedded systems design, this book focuses on root cause of heat in embedded systems: power. Since software has an enormous impact on power consumption in an embedded system, this book urges software engineers to manage heat effectively by understanding, categorizing and developing new ways to reduce static and dynamic power consumption. Whereas most books on thermal management describe mechanisms to remove heat, this book focuses on ways for software engineers to avoid generating heat in the first place.

This research monograph focuses on the design of arithmetic circuits in Quantum Dot Cellular Automata (QCA). Using the fact that the 3-input majority gate is a primitive in QCA, the book sets out to discover hitherto unknown properties of majority logic in the context of arithmetic circuit designs. The pursuit for efficient adders in QCA takes two forms. One involves application of the new results in majority logic to existing adders. The second involves development of a custom adder for QCA technology. A QCA adder named as hybrid adder is proposed and it is shown that it outperforms existing multi-bit adders with respect to area and delay. The work is extended to the design of a low-complexity multiplier for signed numbers in QCA. Furthermore the book explores two aspects unique to QCA technology, namely thermal robustness and the role of interconnects. In addition, the book introduces the reader to QCA layout design and simulation using QCADesigner. Features & Benefits: This research-based book: *Introduces the reader to Quantum Dot Cellular Automata, an emerging nanotechnology. *Explores properties of majority logic. *Demonstrates application of the properties to design efficient arithmetic circuits. *Guides the reader towards layout design and simulation in QCADesigner.

This book offers fascinating insights into the key technical and scientific developments in the history of radar, from the first patent, taken out by Hulsmeyer in 1904, through to the present day. Landmark events are highlighted and fascinating insights provided into the exceptional people who made possible the progress in the field, including the scientists and technologists who worked independently and under strict secrecy in various countries across the world in the 1930s and the big businessmen who played an important role after World War II. The book encourages multiple levels of reading. The author is a leading radar researcher who is ideally placed to offer a technical/scientific perspective as well as a historical one. He has taken care to structure and write the book in such a way as to appeal to both non-specialists and experts. The book is not sponsored by any company or body, either formally or informally, and is therefore entirely unbiased. The text is enriched by approximately three hundred images, most of which are original and have been accessed by detailed searches in the archives.

This book proposes a synergistic framework to help IP vendors to protect hardware IP privacy and integrity from design, optimization, and evaluation perspectives. The proposed framework consists of five interacting components that directly target at the primary IP violations. All the five algorithms are developed based on rigorous mathematical modeling for primary IP violations and focus on different stages of IC design, which can be combined to provide a formal security guarantee.

This book presents original studies describing the latest research and developments in the area of reliability and systems engineering. It helps the reader identifying gaps in the current knowledge and presents fruitful areas for further research in the field. Among others, this book covers reliability measures, reliability assessment of multi-state systems, optimization of multi-state systems, continuous multi-state systems, new computational techniques applied to multi-state systems and probabilistic and non-probabilistic safety assessment.

This book details the simulation and optimization of integer and fractional-order chaotic systems, and how they can be implemented in the analog and digital domains using FPAAs and FPGAs. Design guidelines are provided to use commercially available electronic devices, and to perform hardware descriptions of integer/fractional-order chaotic systems programming in VHDL. Finally, several engineering applications oriented to cryptography, internet of things, robotics and chaotic communications, are detailed to highlight the usefulness of FPAA/FPGA based integer/fractional-order chaotic systems. Provides guidelines to implement fractional-order derivatives using commercially available devices; Describes details on using FPAAs to approach fractional-order chaotic systems; Includes details on using FPGAs to approach fractional-order chaotic systems, programming in VHDL and reducing hardware resources; Discusses applications to cryptography, internet of things, robotics and chaotic communications.

This book provides a practical guide to terahertz electronics, especially for readers with an electronics background. The author guides readers through the all the key concepts of terahertz electronics, including terahertz sources, detectors, and waveguides, together with reviews on key terahertz applications on spectroscopy, imaging, communication, and radar. This book will serve as a handy reference for graduate students and engineers in the field of terahertz with a viewpoint from electronics. Presents the topic of terahertz from electronics viewpoint; Designed to be particularly helpful for the readers familiar with semiconductor devices and circuits; Enables optics-based terahertz researchers to understand terahertz electronics; Based on the author's extensive experience from both industry and academia.

Polycrystalline SiGe has emerged as a promising MEMS (Microelectromechanical Systems) structural material since it provides the desired mechanical properties at lower temperatures compared to poly-Si, allowing the direct post-processing on top of CMOS. This CMOS-MEMS monolithic integration can lead to more compact MEMS with improved performance. The potential of poly-SiGe for MEMS above-aluminum-backend CMOS integration has already been demonstrated. However, aggressive interconnect scaling has led to the replacement of the traditional aluminum metallization by copper (Cu) metallization, due to its lower resistivity and improved reliability. Poly-SiGe for MEMS-above-CMOS sensors demonstrates the compatibility of poly-SiGe with post-processing above the advanced CMOS technology nodes through the successful fabrication of an integrated poly-SiGe piezoresistive pressure sensor, directly fabricated above 0.13 m Cu-backend CMOS. Furthermore, this book presents the first detailed investigation on the influence of deposition conditions, germanium content and doping concentration on the electrical and piezoresistive properties of boron-doped poly-SiGe. The development of a CMOS-compatible process flow, with special attention to the sealing method, is also described. Piezoresistive pressure sensors with different areas and piezoresistor designs were fabricated and tested. Together with the piezoresistive pressure sensors, also functional capacitive pressure sensors were successfully fabricated on the same wafer, proving the versatility of poly-SiGe for MEMS sensor applications. Finally, a detailed analysis of the MEMS processing impact on the underlying CMOS circuit is also presented.

This book analyzes energy and reliability as major challenges faced by designers of computing frameworks in the nanometer technology regime. The authors describe the existing solutions to address these challenges and then reveal a new reconfigurable computing platform, which leverages high-density nanoscale memory for both data storage and computation to maximize the energy-efficiency and reliability. The energy and reliability benefits of this new paradigm are illustrated and the design challenges are discussed. Various hardware and software aspects of this exciting computing paradigm are described, particularly with respect to hardware-software co-designed frameworks, where the hardware unit can be reconfigured to mimic diverse application behavior. Finally, the energy-efficiency of the paradigm described is compared with other, well-known reconfigurable computing platforms.

Formal verification means having a mathematical model of a system, a language for specifying desired properties of the system in a concise, comprehensible and unambiguous way, and a method of proof to verify that the specified properties are satisfied. When the method of proof is carried out substantially by machine, we speak of automatic verification. Symbolic Model Checking deals with methods of automatic verification as applied to computer hardware. The practical motivation for study in this area is the high and increasing cost of correcting design errors in VLSI technologies. There is a growing demand for design methodologies that can yield correct designs on the first fabrication run. Moreover, design errors that are discovered before fabrication can also be quite costly, in terms of engineering effort required to correct the error, and the resulting impact on development schedules. Aside from pure cost considerations, there is also a need on the theoretical side to provide a sound mathematical basis for the design of computer systems, especially in areas that have received little theoretical attention.

This book presents fundamental requirements, electrical specification, and parameter tradeoffs of wearable EEG acquisition circuits, especially those compatible with dry electrodes for user-friendly recordings.  The authors introduce active electrode, the most promising solution for dry electrodes-based EEG measurement. This architectural concept has been combined with various, innovative circuit design techniques to illustrate structured IC design methodologies for high performance EEG recording. This book also gives examples on the design, implementation and evaluation of three generations of active electrode ICs.