"Intuitive Analog Circuit Design" outlines ways of thinking about analog circuits and systems that let you develop a feel for what a good, working analog circuit design should be. This book reflects author Marc Thompson's 30 years of experience designing analog and power electronics circuits and teaching graduate-level analog circuit design, and is the ideal reference for anyone who needs a straightforward introduction to the subject.

In this book, Dr. Thompson describes intuitive and "back-of-the-envelope" techniques for designing and analyzing analog circuits, including transistor amplifiers (CMOS, JFET, and bipolar), transistor switching, noise in analog circuits, thermal circuit design, magnetic circuit design, and control systems. The application of some simple rules of thumb and design techniques is the first step in developing an intuitive understanding of the behavior of complex electrical systems.

Introducing analog circuit design with a minimum of mathematics, this book uses numerous real-world examples to help you make the transition to analog design. The second edition is an ideal introductory text for anyone new to the area of analog circuit design.
LTSPICE files and PowerPoint files available online to assist readers and instructors in simulating circuits found in the textDesign examples are used throughout the text, along with end-of-chapter examplesCovers real-world parasitic elements in circuit design and their effects

This book describes the state-of-the-art in energy efficient, fault-tolerant embedded systems. It covers the entire product lifecycle of electronic systems design, analysis and testing and includes discussion of both circuit and system-level approaches. Readers will be enabled to meet the conflicting design objectives of energy efficiency and fault-tolerance for reliability, given the up-to-date techniques presented.

Radio Frequency and Microwave Power Amplifiers are finding an increasingly broad range of applications, particularly in communications and broadcasting, but also in the industrial, medical, automotive, aviation, military, and sensing fields. Each application has its own design specifications, for example, high linearity in modern communication systems or high efficiency in broadcasting, and, depending on process technology, capability to operate efficiently at very high frequencies, such as 77 GHz and higher for automotive radars. Advances in design methodologies have practical applications in improving gain, power output, bandwidth, power efficiency, linearity, input and output impedance matching, and heat dissipation. This essential reference presented in two volumes aims to provide comprehensive, state-of-the-art coverage of RF and microwave power amplifier design with in-depth descriptions of current and potential future approaches. Volume 1 covers principles, device modeling and matching networks, while volume 2 focuses specifically on efficiency and linearity enhancement techniques. The volumes will be of particular interest to engineers and researchers engaged in RF and microwave amplifier design, and those who are interested in systems incorporating RF and microwave amplifiers.

This book describes a new design approach for energy-efficient, Domain-Specific Instruction set Processor (DSIP) architectures for the wireless baseband domain. The innovative techniques presented enable co-design of algorithms, architectures and technology, for efficient implementation of the most advanced technologies. To demonstrate the feasibility of the author's design approach, case studies are included for crucial functionality of advanced wireless systems with increased computational performance, flexibility and reusability. Designers using this approach will benefit from reduced development/product costs and greater scalability to future process technology nodes.

High-Performance Computing using FPGA covers the area of high performance reconfigurable computing (HPRC). This book provides an overview of architectures, tools and applications for High-Performance Reconfigurable Computing (HPRC). FPGAs offer very high I/O bandwidth and fine-grained, custom and flexible parallelism and with the ever-increasing computational needs coupled with the frequency/power wall, the increasing maturity and capabilities of FPGAs, and the advent of multicore processors which has caused the acceptance of parallel computational models. The Part on architectures will introduce different FPGA-based HPC platforms: attached co-processor HPRC architectures such as the CHREC's Novo-G and EPCC's Maxwell systems; tightly coupled HRPC architectures, e.g. the Convey hybrid-core computer; reconfigurably networked HPRC architectures, e.g. the QPACE system, and standalone HPRC architectures such as EPFL's CONFETTI system. The Part on Tools will focus on high-level programming approaches for HPRC, with chapters on C-to-Gate tools (such as Impulse-C, AutoESL, Handel-C, MORA-C++); Graphical tools (MATLAB-Simulink, NI LabVIEW); Domain-specific languages, languages for heterogeneous computing(for example OpenCL, Microsoft's Kiwi and Alchemy projects). The part on Applications will present case from several application domains where HPRC has been used successfully, such as Bioinformatics and Computational Biology; Financial Computing; Stencil computations; Information retrieval; Lattice QCD; Astrophysics simulations; Weather and climate modeling.

Ecological restrictions in many parts of the world are demanding the elimination of Pb from all consumer items. At this moment in the piezoelectric ceramics industry, there is no issue of more importance than the transition to lead-free materials. The goal of Lead-Free Piezoelectrics is to provide a comprehensive overview of the fundamentals and developments in the field of lead-free materials and products to leading researchers in the world. The text presents chapters on demonstrated applications of the lead-free materials, which will allow readers to conceptualize the present possibilities and will be useful for both students and professionals conducting research on ferroelectrics, piezoelectrics, smart materials, lead-free materials, and a variety of applications including sensors, actuators, ultrasonic transducers and energy harvesters.

VLSI, or Very-Large-Scale-Integration, is the practice of combining billions of transistors to create an integrated circuit. At present, VLSI circuits are realised using CMOS technology. However, the demand for ever smaller, more efficient circuits is now pushing the limits of CMOS. Post-CMOS refers to the possible future digital logic technologies beyond the CMOS scaling limits. This 2-volume set addresses the current state of the art in VLSI technologies and presents potential options for post-CMOS processes. VLSI and Post-CMOS Electronics is a useful reference guide for researchers, engineers and advanced students working in the area of design and modelling of VLSI and post-CMOS devices and their circuits. Volume 1 focuses on design, modelling and simulation, including applications in low voltage and low power VLSI, and post-CMOS devices and circuits. Volume 2 addresses a wide range of devices, circuits and interconnects.

Radio Frequency and Microwave Power Amplifiers are finding an increasingly broad range of applications, particularly in communications and broadcasting, but also in the industrial, medical, automotive, aviation, military, and sensing fields. Each application has its own design specifications, for example, high linearity in modern communication systems or high efficiency in broadcasting, and, depending on process technology, capability to operate efficiently at very high frequencies, such as 77 GHz and higher for automotive radars. Advances in design methodologies have practical applications in improving gain, power output, bandwidth, power efficiency, linearity, input and output impedance matching, and heat dissipation. This essential reference presented in two volumes aims to provide comprehensive, state-of-the-art coverage of RF and microwave power amplifier design with in-depth descriptions of current and potential future approaches. Volume 1 covers principles, device modeling and matching networks, while volume 2 focuses specifically on efficiency and linearity enhancement techniques. The volumes will be of particular interest to engineers and researchers engaged in RF and microwave amplifier design, and those who are interested in systems incorporating RF and microwave amplifiers.

Quantum Information Processing and Quantum Error Correction is a self-contained, tutorial-based introduction to quantum information, quantum computation, and quantum error-correction. Assuming no knowledge of quantum mechanics and written at an intuitive level suitable for the engineer, the book gives all the essential principles needed to design and implement quantum electronic and photonic circuits. Numerous examples from a wide area of application are given to show how the principles can be implemented in practice.

This book is ideal for the electronics, photonics and computer engineer who requires an easy- to-understand foundation on the principles of quantum information processing and quantum error correction, together with insight into how to develop quantum electronic and photonic circuits.

Readers of this book will be ready for further study in this area, and will be prepared to perform independent research. The reader completed the book will be able design the information processing circuits, stabilizer codes, Calderbank-Shor-Steane (CSS) codes, subsystem codes, topological codes and entanglement-assisted quantum error correction codes; and propose corresponding physical implementation. The reader completed the book will be proficient in quantum fault-tolerant design as well.

Unique Features

Unique in covering both quantum information processing and quantum error correction - everything in one book that an engineer needs to understand and implement quantum-level circuits.

Gives an intuitive understanding by not assuming knowledge of quantum mechanics, thereby avoiding heavy mathematics.

In-depth coverage of the design and implementation of quantum information processing and quantum error correction circuits.

Provides the right balance among the quantum mechanics, quantum error correction, quantum computing and quantum communication.

Dr. Djordjevic is an Assistant Professor in the Department of Electrical and Computer Engineering of College of Engineering, University of Arizona, with a joint appointment in the College of Optical Sciences. Prior to this appointment in August 2006, he was with University of Arizona, Tucson, USA (as a Research Assistant Professor); University of the West of England, Bristol, UK; University of Bristol, Bristol, UK; Tyco Telecommunications, Eatontown, USA; and National Technical University of Athens, Athens, Greece. His current research interests include optical networks, error control coding, constrained coding, coded modulation, turbo equalization, OFDM applications, and quantum error correction. He presently directs the Optical Communications Systems Laboratory (OCSL) within the ECE Department at the University of Arizona.
Provides everything an engineer needs in one tutorial-based introduction to understand and implement quantum-level circuitsAvoids the heavy use of mathematics by not assuming the previous knowledge of quantum mechanicsProvides in-depth coverage of the design and implementation of quantum information processing and quantum error correction circuits

This book is based on the 18 presentations during the 21st workshop on Advances in Analog Circuit Design. Expert designers provide readers with information about a variety of topics at the frontier of analog circuit design, including Nyquist analog-to-digital converters, capacitive sensor interfaces, reliability, variability, and connectivity. This book serves as a valuable reference to the state-of-the-art, for anyone involved in analog circuit research and development. "

This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatings-- including optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry.
The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely covered -- including an entire chapter on resist process defectivity and the potential yield limiting effect on device production.
Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook.

VLSI, or Very-Large-Scale-Integration, is the practice of combining billions of transistors to create an integrated circuit. At present, VLSI circuits are realised using CMOS technology. However, the demand for ever smaller, more efficient circuits is now pushing the limits of CMOS. Post-CMOS refers to the possible future digital logic technologies beyond the CMOS scaling limits. This 2-volume set addresses the current state of the art in VLSI technologies and presents potential options for post-CMOS processes. VLSI and Post-CMOS Electronics is a useful reference guide for researchers, engineers and advanced students working in the area of design and modelling of VLSI and post-CMOS devices and their circuits. Volume 1 focuses on design, modelling and simulation, including applications in low voltage and low power VLSI, and post-CMOS devices and circuits. Volume 2 addresses a wide range of devices, circuits and interconnects.

This book presents theory, design methods and novel applications for integrated circuits for analog signal processing. The discussion covers a wide variety of active devices, active elements and amplifiers, working in voltage mode, current mode and mixed mode. This includes voltage operational amplifiers, current operational amplifiers, operational transconductance amplifiers, operational transresistance amplifiers, current conveyors, current differencing transconductance amplifiers, etc. Design methods and challenges posed by nanometer technology are discussed and applications described, including signal amplification, filtering, data acquisition systems such as neural recording, sensor conditioning such as biomedical implants, actuator conditioning, noise generators, oscillators, mixers, etc.

Presents analysis and synthesis methods to generate all circuit topologies from which the designer can select the best one for the desired application; Includes design guidelines for active devices/elements with low voltage and low power constraints;Offers guidelines for selecting the right active devices/elements in the design of linear and nonlinear circuits;Discusses optimization of the active devices/elements for process and manufacturing issues of nanometer technology."

With vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. This is due primarily to the inevitable increase in the distance among circuit elements and interconnect design solutions have become the greatest determining factor in overall performance.
Three-dimensional (3D) integrated circuits (ICs), which contain multiple layers of active devices, have the potential to enhance dramatically chip performance and functionality, while reducing the distance among devices on a chip. They promise solutions to the current "interconnect bottleneck" challenges faced by IC designers. They also may facilitate the integration of heterogeneous materials, devices, and signals. However, before these advantages can be realized, key technology challenges of 3D ICs must be addressed.
This is the first book on 3-D integrated circuit design, covering all of the technological and design aspects of this emerging design paradigm, while proposing effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. A handy, comprehensive reference or a practical design guide, this book provides a sound foundation for the design of three-dimensional integrated circuits.
* Demonstrates how to overcome "Interconnect Bottleneck" with 3D Integrated Circuit Design...leading edge design techniques offer solutions to problems (performance/power consumption/price) faced by all circuit designers.
* The FIRST book on 3D Integrated Circuit Design...provides up-to-date information that is otherwise difficult tofind;
* Focuses on design issues key to the product development cyle...good design plays a major role in exploiting the implementation flexibilities offered in the third dimension;
* Provides broad coverage of 3D IC Design, including Interconnect Prediction Models, Thermal Management Techniques, and Timing Optimization...offers practical view of designing 3D circuits.

This textbook is based on 20 years of teaching a graduate-level course in random processes to a constituency extending beyond signal processing, communications, control, and networking, and including in particular circuits, RF and optics graduate students. In order to accommodate today's circuits students' needs to understand noise modeling, while covering classical material on Brownian motion, Poisson processes, and power spectral densities, the author has inserted discussions of thermal noise, shot noise, quantization noise and oscillator phase noise. At the same time, techniques used to analyze modulated communications and radar signals, such as the baseband representation of bandpass random signals, or the computation of power spectral densities of a wide variety of modulated signals, are presented. This book also emphasizes modeling skills, primarily through the inclusion of long problems at the end of each chapter, where starting from a description of the operation of a system, a model is constructed and then analyzed. Provides semester-length coverage of random processes, applicable to the analysis of electrical and computer engineering systems; Designed to be accessible to students with varying backgrounds in undergraduate mathematics and engineering; Includes solved examples throughout the discussion, as well as extensive problem sets at the end of every chapter; Develops and reinforces student's modeling skills, with inclusion of modeling problems in every chapter; Solutions for instructors included.

This book provides a single-source reference to routing algorithms for Networks-on-Chip (NoCs), as well as in-depth discussions of advanced solutions applied to current and next generation, many core NoC-based Systems-on-Chip (SoCs). After a basic introduction to the NoC design paradigm and architectures, routing algorithms for NoC architectures are presented and discussed at all abstraction levels, from the algorithmic level to actual implementation. Coverage emphasizes the role played by the routing algorithm and is organized around key problems affecting current and next generation, many-core SoCs. A selection of routing algorithms is included, specifically designed to address key issues faced by designers in the ultra-deep sub-micron (UDSM) era, including performance improvement, power, energy, and thermal issues, fault tolerance and reliability.

This book highlights numerical models as powerful tools for the optimal design of Micro-Electro-Mechanical Systems (MEMS). Most MEMS experts have a background in electronics, where circuit models or behavioral models (i.e. lumped-parameter models) of devices are preferred to field models. This is certainly convenient in terms of preliminary design, e.g. in the prototyping stage. However, design optimization should also take into account fine-sizing effects on device behavior and therefore be based on distributed-parameter models, such as finite-element models. The book shows how the combination of automated optimal design and field-based models can produce powerful design toolboxes for MEMS. It especially focuses on illustrating theoretical concepts with practical examples, fostering comprehension through a problem-solving approach. By comparing the results obtained using different methods, readers will learn to identify their respective strengths and weaknesses. In addition, special emphasis is given to evolutionary computing and nature-inspired optimization strategies, the effectiveness of which has already been amply demonstrated. Given its scope, the book provides PhD students, researchers and professionals in the area of computer-aided analysis with a comprehensive, yet concise and practice-oriented guide to MEMS design and optimization. To benefit most from the book, readers should have a basic grasp of electromagnetism, vector analysis and numerical methods.